Insulating sheet and printed circuit board having the same

Abstract

A method of manufacturing an insulating sheet can include: providing a reinforcement material on which a thermoplastic resin layer is stacked, stacking the thermoplastic resin layer stacked on the reinforcement material over a core substrate, and hot pressing the reinforcement material and the thermoplastic resin layer onto the core substrate. This method can be used to produce an insulation board that has a coefficient of thermal expansion close to that of the semiconductor chip, and thereby prevent bending or warpage in the printed circuit board using the insulation board. Furthermore, the stress in the connecting material can be reduced, so that cracking or delamination in the connecting material may be avoided, while heat-releasing performance may also be improved.

1 . A method of manufacturing an insulating sheet, the method comprising:
 providing a reinforcement material having a thermoplastic resin layer stacked thereon;   stacking the thermoplastic resin layer stacked on the reinforcement material over a core substrate; and   hot pressing the reinforcement material and the thermoplastic resin layer onto the core substrate.   
     
     
         2 . The method of  claim 1 , wherein the core substrate has a coefficient of thermal expansion within a range of −20 to 9 ppm/° C. in longitudinal and lateral directions. 
     
     
         3 . The method of  claim 1 , wherein the core substrate includes any one or more selected from a group consisting of copper, iron, nickel, magnesium, cobalt, tungsten, titanium, and aluminum. 
     
     
         4 . The method of  claim 1 , wherein the reinforcement material has a coefficient of thermal expansion within a range of −20 to 9 ppm/° C. in longitudinal and lateral directions. 
     
     
         5 . The method of  claim 1 , wherein the reinforcement material includes organic fibers or inorganic fibers. 
     
     
         6 . The method of  claim 5 , wherein the organic fibers include any one selected from a group consisting of aromatic polyamide fibers, polybenzoxazole fibers, and liquid crystal polyester fibers. 
     
     
         7 . The method of  claim 5 , wherein the inorganic fibers include glass fibers. 
     
     
         8 . The method of  claim 1 , wherein the thermoplastic resin layer has a coefficient of thermal expansion within a range of −20 to 9 ppm/° C. in longitudinal and lateral directions. 
     
     
         9 . The method of  claim 1 , wherein the thermoplastic resin layer includes liquid crystal polyester resin. 
     
     
         10 . The method of  claim 1 , wherein the reinforcement material has a fusion point higher than that of the thermoplastic resin layer. 
     
     
         11 . The method of  claim 1 , further comprising, before the stacking of the thermoplastic resin layer:
 selectively perforating at least one through-hole in the core substrate.   
     
     
         12 . An insulating sheet comprising:
 a reinforcement material;   a thermoplastic resin layer stacked over the reinforcement material; and   a core substrate stacked such that one side thereof faces the thermoplastic resin layer.   
     
     
         13 . The insulating sheet of  claim 12 , wherein the core substrate has a coefficient of thermal expansion within a range of −20 to 9 ppm/° C. in longitudinal and lateral directions. 
     
     
         14 . The insulating sheet of  claim 12 , wherein the reinforcement material has a coefficient of thermal expansion within a range of −20 to 9 ppm/° C. in longitudinal and lateral directions. 
     
     
         15 . The insulating sheet of  claim 12 , wherein the thermoplastic resin layer has a coefficient of thermal expansion within a range of −20 to 9 ppm/° C. in longitudinal and lateral directions. 
     
     
         16 . The insulating sheet of  claim 12 , wherein the thermoplastic resin layer includes liquid crystal polyester resin. 
     
     
         17 . The insulating sheet of  claim 12 , wherein the reinforcement material has a fusion point higher than that of the thermoplastic resin layer. 
     
     
         18 . The insulating sheet of  claim 12 , wherein the core substrate has at least one through-hole selectively perforated therein. 
     
     
         19 . The insulating sheet of  claim 12 , further comprising a thermoplastic resin layer stacked over either side of a reinforcement material and stacked over the other side of the core substrate. 
     
     
         20 . A method of manufacturing a printed circuit board, the method comprising:
 providing a reinforcement material having a thermoplastic resin layer stacked on either side thereof;   stacking the thermoplastic resin layer stacked on either side of the reinforcement material over a core substrate;   hot pressing the reinforcement material and the thermoplastic resin layers onto the core substrate; and   forming a circuit pattern over the exposed thermoplastic resin layer.   
     
     
         21 . The method of  claim 20 , wherein the core substrate has a coefficient of thermal expansion within a range of −20 to 9 ppm/° C. in longitudinal and lateral directions. 
     
     
         22 . The method of  claim 20 , wherein the core substrate includes any one or more selected from a group consisting of copper, iron, nickel, magnesium, cobalt, tungsten, titanium, and aluminum. 
     
     
         23 . The method of  claim 20 , wherein the reinforcement material has a coefficient of thermal expansion within a range of −20 to 9 ppm/° C. in longitudinal and lateral directions. 
     
     
         24 . The method of  claim 20 , wherein the reinforcement material includes organic fibers or inorganic fibers. 
     
     
         25 . The method of  claim 24 , wherein the organic fibers include any one selected from a group consisting of aromatic polyamide fibers, polybenzoxazole fibers, and liquid crystal polyester fibers. 
     
     
         26 . The method of  claim 24 , wherein the inorganic fibers include glass fibers. 
     
     
         27 . The method of  claim 20 , wherein the thermoplastic resin layers have coefficients of thermal expansion within a range of −20 to 9 ppm/° C. in longitudinal and lateral directions. 
     
     
         28 . The method of  claim 20 , wherein the thermoplastic resin layers include liquid crystal polyester resin. 
     
     
         29 . The method of  claim 20 , wherein the reinforcement material has a fusion point higher than those of the thermoplastic resin layers. 
     
     
         30 . The method of  claim 20 , further comprising, before the stacking of the thermoplastic resin layer: selectively perforating at least one through-hole in the core substrate. 
     
     
         31 . A printed circuit board comprising:
 a reinforcement material;   a thermoplastic resin layer stacked over either side of the reinforcement material;   a core substrate stacked such that one side thereof faces the thermoplastic resin layer; and   a circuit pattern formed over the exposed thermoplastic resin layer.   
     
     
         32 . The printed circuit board of  claim 31 , wherein the core substrate has a coefficient of thermal expansion within a range of −20 to 9 ppm/° C. in longitudinal and lateral directions. 
     
     
         33 . The printed circuit board of  claim 31 , wherein the reinforcement material has a coefficient of thermal expansion within a range of −20 to 9 ppm/° C. in longitudinal and lateral directions. 
     
     
         34 . The printed circuit board of  claim 31 , wherein the thermoplastic resin layers have coefficients of thermal expansion within a range of −20 to 9 ppm/° C. in longitudinal and lateral directions. 
     
     
         35 . The printed circuit board of  claim 31 , wherein the thermoplastic resin layers include liquid crystal polyester resin. 
     
     
         36 . The printed circuit board of  claim 31 , wherein the reinforcement material has a fusion point higher than those of the thermoplastic resin layers. 
     
     
         37 . The printed circuit board of  claim 31 , wherein the core substrate has at least one through-hole selectively perforated therein. 
     
     
         38 . The printed circuit board of  claim 31 , further comprising a thermoplastic resin layer stacked over either side of a reinforcement material and stacked over the other side of the core substrate.