Inventor · disambiguated record
Joon-Seo Son
Also filed as: SON JOON SEO
16 granted patents·10 pending applications·228 citations·filing 2003–2024
93Inventor score
Files withFAIRCHILD KR SEMICONDUCTOR LTD9LIM SEUNG-WON4INFINEON TECHNOLOGIES AUSTRIA AG3SON JOON-SEO2EOM JOO-YANG1
Top patents by PatentIndex Score
26 records- 0196US7675148B2Power module having stacked flip-chip and method of fabricating the power moduleFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Granted Mar 9, 2010·42 cites·21 claims
- 0293US7199461B2Semiconductor package suitable for high voltage applicationsFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2004·Granted Apr 3, 2007·78 cites·21 claims
- 0391US7687903B2Power module and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Granted Mar 30, 2010·24 cites·21 claims
- 0489US9130065B2Power module having stacked flip-chip and method for fabricating the power moduleFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2014·Granted Sep 8, 2015·8 cites·20 claims
- 0586US8552541B2Power device packages having thermal electric modules using peltier effect and methods of fabricating the sameIM SEUNGWON·Filed 2011·Granted Oct 8, 2013·15 cites·20 claims
- 0685US7714455B2Semiconductor packages and methods of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Granted May 11, 2010·17 cites·20 claims
- 0783US7816784B2Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the sameFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Oct 19, 2010·12 cites·24 claims
- 0874US8860196B2Semiconductor package and method of fabricating the sameEOM JOO-YANG·Filed 2012·Granted Oct 14, 2014·5 cites·18 claims
- 0974US8067826B2Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the packageSON JOON-SEO·Filed 2008·Granted Nov 29, 2011·5 cites·10 claims
- 1074US7863725B2Power device packages and methods of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Granted Jan 4, 2011·6 cites·16 claims
- 1172US9666512B2Semiconductor packageFAIRCHILD KOREA SEMICONDUCTOR LTD·Filed 2015·Granted May 30, 2017·3 cites·21 claims
- 1272US8766419B2Power module having stacked flip-chip and method of fabricating the power moduleLIM SEUNG-WON·Filed 2009·Granted Jul 1, 2014·6 cites·9 claims
- 1367US8723304B2Semiconductor package and methods of fabricating the sameKANG IN-GOO·Filed 2009·Granted May 13, 2014·6 cites·22 claims
- 1463US11004698B2Power module packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted May 11, 2021·1 cites·18 claims
- 1559US2025118634A1Intelligent power module arrangementINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1651US11848243B2Molded semiconductor package having a substrate with bevelled edgeINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Dec 19, 2023·0 cites·16 claims
- 1751US2024145325A1Semiconductor Package with Molded Heat Dissipation PlateINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Application pending·0 cites
- 1848US8945992B2Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the packageSON JOON-SEO·Filed 2011·Granted Feb 3, 2015·0 cites·9 claims
- 1948US2007181984A1Semiconductor package suitable for high voltage applicationsFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2007·Application pending·0 cites
- 2046US2009127681A1Semiconductor package and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Application pending·0 cites
- 2145US2009243078A1Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the SameLIM SEUNG-WON·Filed 2009·Application pending·0 cites
- 2241US2011076804A1Power device packages and methods of fabricating the sameJONG MAN-KYO·Filed 2010·Application pending·0 cites
- 2340US2009243079A1Semiconductor device packageLIM SEUNG-WON·Filed 2009·Application pending·0 cites
- 2439US2009244848A1Power Device Substrates and Power Device Packages Including the SameLIM SEUNG-WON·Filed 2008·Application pending·0 cites
- 2538US2013307145A1Semiconductor package and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2013·Application pending·0 cites
- 2632US2004061206A1Discrete package having insulated ceramic heat sinkFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →