Inventor · disambiguated record
Jon Thomas Woodyard
Also filed as: WOODYARD JON · WOODYARD JON T · WOODYARD JON THOMAS
2 granted patents·5 pending applications·34 citations·filing 2005–2023
55Inventor score
Top patents by PatentIndex Score
7 records- 0184US7745918B1Package in package (PiP)AMKOR TECHNOLOGY INC·Filed 2005·Granted Jun 29, 2010·34 cites·19 claims
- 0256US2025201645A1Fabricating packages with dummy dies having a construction that mimics warpage of the other components included in the packageMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2023·Application pending·0 cites
- 0353US2024413029A1Embedding an electronic component in a core of an integrated circuit substrateMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2023·Application pending·0 cites
- 0450US2024071778A1Semiconductor interconnect bridge packagingMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2022·Application pending·0 cites
- 0550US2025189557A1Socket apparatus for secure placement of chip packageMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2023·Application pending·0 cites
- 0650US2024071937A1Semiconductor interconnect bridge packagingMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2022·Application pending·0 cites
- 0749US12412810B2Single side via fill process for through-viasAPPLIED MATERIALS INC·Filed 2022·Granted Sep 9, 2025·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →