Inventor · disambiguated record
Jun Abatake
Also filed as: ABATAKE JUN
6 granted patents·3 pending applications·24 citations·filing 2010–2022
74Inventor score
Top patents by PatentIndex Score
9 records- 0186US8415234B2Wafer dividing methodABATAKE JUN·Filed 2012·Granted Apr 9, 2013·20 cites·2 claims
- 0261US11165408B2Method of manufacturing substrate for acoustic wave deviceDISCO CORP·Filed 2018·Granted Nov 2, 2021·1 cites·9 claims
- 0361US10050599B2BAW device and method of manufacturing BAW deviceDISCO CORP·Filed 2016·Granted Aug 14, 2018·1 cites·2 claims
- 0459US12472585B2Adjustment method of laser processing apparatus, and laser processing apparatusDISCO CORP·Filed 2022·Granted Nov 18, 2025·0 cites·2 claims
- 0556US8642920B2Wafer dividing apparatus and laser processing apparatusAIKAWA CHIKARA·Filed 2010·Granted Feb 4, 2014·2 cites·10 claims
- 0651US11088674B2Saw filter manufacturing method and saw filterDISCO CORP·Filed 2020·Granted Aug 10, 2021·0 cites·4 claims
- 0741US2016380605A1Saw device manufacturing methodDISCO CORP·Filed 2016·Application pending·0 cites
- 0833US2011230000A1Mems device manufacturing methodDISCO CORP·Filed 2011·Application pending·0 cites
- 0931US2017257075A1Baw device and baw device manufacturing methodDISCO CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →