Inventor · disambiguated record
Juying Dou
Also filed as: DOU JUYING
17 granted patents·3 pending applications·158 citations·filing 2008–2024
93Inventor score
Files withASML NETHERLANDS BV9HERMES MICROVISION INC6Wang yi-xiang2ASML NETHERIANDS B V1CHEN ZHONG-WEI1
Top patents by PatentIndex Score
20 records- 0198US9922799B2Apparatus of plural charged-particle beamsHERMES MICROVISION INC·Filed 2016·Granted Mar 20, 2018·64 cites·22 claims
- 0296US11705304B2Apparatus of plural charged-particle beamsASML NETHERLANDS BV·Filed 2021·Granted Jul 18, 2023·2 cites·18 claims
- 0393US10541110B2Apparatus of plural charged-particle beamsASML NETHERLANDS BV·Filed 2018·Granted Jan 21, 2020·5 cites·9 claims
- 0493US9991147B2Wafer grounding and biasing method, apparatus, and applicationHERMES MICROVISION INC·Filed 2014·Granted Jun 5, 2018·15 cites·22 claims
- 0593US7960697B2Electron beam apparatusHERMES MICROVISION INC·Filed 2008·Granted Jun 14, 2011·24 cites·20 claims
- 0692US7759653B2Electron beam apparatusHERMES MICROVISION INC·Filed 2008·Granted Jul 20, 2010·16 cites·11 claims
- 0788US8908348B2Wafer grounding and biasing method, apparatus, and applicationWang yi-xiang·Filed 2009·Granted Dec 9, 2014·12 cites·16 claims
- 0886US12424408B2Apparatus of plural charged-particle beamsASML NETHERLANDS BV·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 0983US11062877B2Apparatus of plural charged-particle beamsASML NETHERLANDS BV·Filed 2020·Granted Jul 13, 2021·1 cites·12 claims
- 1081US10784071B2Electron emitter and method of fabricating sameASML NETHERLANDS BV·Filed 2017·Granted Sep 22, 2020·2 cites·13 claims
- 1178US8094428B2Wafer grounding methodologyWANG YI XIANG·Filed 2008·Granted Jan 10, 2012·7 cites·17 claims
- 1275US11688579B2Electron emitter and method of fabricating sameASML NETHERLANDS BV·Filed 2021·Granted Jun 27, 2023·0 cites·15 claims
- 1375US8896195B2Filament for electron sourceDOU JUYING·Filed 2010·Granted Nov 25, 2014·5 cites·17 claims
- 1473US8218284B2Apparatus for increasing electric conductivity to a semiconductor wafer substrate when exposure to electron beamCHEN ZHONG-WEI·Filed 2008·Granted Jul 10, 2012·4 cites·15 claims
- 1571US11201032B2Electron emitter and method of fabricating sameASML NETHERLANDS BV·Filed 2020·Granted Dec 14, 2021·0 cites·20 claims
- 1667US8022609B2Thermal field emission cathodeHERMES MICROVISION INC·Filed 2008·Granted Sep 20, 2011·1 cites·21 claims
- 1767US2024371599A1Method, apparatus, and system for wafer groundingASML NETHERIANDS B V·Filed 2024·Application pending·0 cites
- 1858US12051562B2Method, apparatus, and system for wafer groundingASML NETHERLANDS BV·Filed 2020·Granted Jul 30, 2024·0 cites·10 claims
- 1950US2011084591A1Thermal field emission cathodeHERMES MICROVISION INC·Filed 2010·Application pending·0 cites
- 2043US2025003505A1Valves with reduced particle generation and increased cycle lifeASML NETHERLANDS BV·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →