Inventor · disambiguated record

Jung Ko

Also filed as: KO JUNG · KO JUNG MIN

18 granted patents·3 pending applications·87 citations·filing 2006–2025

91Inventor score

Technology areasH10W C30B G06F H10P B23K

Files withLG CHEMICAL LTD9 ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC4 XCELSIS CORP3 ADEIA SEMICONDUCTOR INC2 SAMSUNG ELECTRONICS CO LTD2

Top patents by PatentIndex Score

21 records

0198US11916076B2Device disaggregation for improved performanceADEIA SEMICONDUCTOR INC·Filed 2020·Granted Feb 27, 2024·12 cites·32 claims
0298US11721653B2Circuitry for electrical redundancy in bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Aug 8, 2023·12 cites·21 claims
0397US12308332B2Circuitry for electrical redundancy in bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted May 20, 2025·2 cites·22 claims
0493US8901727B2Semiconductor packages, methods of manufacturing semiconductor packages, and systems including semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 2, 2014·30 cites·27 claims
0592US10700094B2Device disaggregation for improved performanceXCELSIS CORP·Filed 2018·Granted Jun 30, 2020·6 cites·25 claims
0683US2025343183A1Circuitry for electrical redundancy in bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
0782US7862059B2Torsion beam axle having connecting tube between torsion beam and trailing armAUSTEM CO LTD·Filed 2006·Granted Jan 4, 2011·19 cites·6 claims
0881US12431449B2Circuitry for electrical redundancy in bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Sep 30, 2025·0 cites·23 claims
0976US7985358B2Process of making mold for optical filmLG CHEMICAL LTD·Filed 2009·Granted Jul 26, 2011·5 cites·8 claims
1076US2024234424A1Device Disaggregation For Improved PerformanceADEIA SEMICONDUCTOR INC·Filed 2024·Application pending·0 cites
1172US11046617B2Tape casting slurry composition for preparing silicon nitride sintered bodyLG CHEMICAL LTD·Filed 2018·Granted Jun 29, 2021·1 cites·15 claims
1265US11157670B2Systems and methods for inter-die block level designXCELSIS CORP·Filed 2020·Granted Oct 26, 2021·0 cites·18 claims
1360US10664564B2Systems and methods for inter-die block level designXCELSIS CORP·Filed 2018·Granted May 26, 2020·0 cites·18 claims
1458US11873576B2Silicon based melting composition and manufacturing method for silicon carbide single crystal using the sameLG CHEMICAL LTD·Filed 2019·Granted Jan 16, 2024·0 cites·7 claims
1555US11203818B2Silicon based fusion composition and manufacturing method of silicon carbide single crystal using the sameLG CHEMICAL LTD·Filed 2018·Granted Dec 21, 2021·0 cites·10 claims
1655US2024055337A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
1748US8883665B2Alkali-free glass and preparation thereofLG CHEMICAL LTD·Filed 2013·Granted Nov 11, 2014·0 cites·14 claims
1845US11193217B2Silicon-based molten composition and method for manufacturing silicon carbide single crystal using the sameLG CHEMICAL LTD·Filed 2018·Granted Dec 7, 2021·0 cites·10 claims
1943US10662547B2Silicon-based molten composition and manufacturing method of SiC single crystal using the sameLG CHEMICAL LTD·Filed 2016·Granted May 26, 2020·0 cites·18 claims
2042US11427926B2Silicon-based molten composition and method for manufacturing silicon carbide single crystal using the sameLG CHEMICAL LTD·Filed 2017·Granted Aug 30, 2022·0 cites·7 claims
2135US10718065B2Silicon-based molten composition and manufacturing method of SiC single crystal using the sameLG CHEMICAL LTD·Filed 2016·Granted Jul 21, 2020·0 cites·10 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →