Inventor · disambiguated record
Jun Kyu Lee
Also filed as: LEE JUN KYU
30 granted patents·8 pending applications·141 citations·filing 1996–2024
95Inventor score
Files withNEPES CO LTD14SOLUM CO LTD7SAMSUNG ELECTRONICS CO LTD3UPPTHERA INC3UNIV KOREA RES & BUS FOUND2
Top patents by PatentIndex Score
38 records- 0194US9653397B2Semiconductor package and method of manufacturing the sameNEPES CO LTD·Filed 2015·Granted May 16, 2017·14 cites·12 claims
- 0290US7736042B2Back light unitLS TECH CO LTD·Filed 2007·Granted Jun 15, 2010·57 cites·61 claims
- 0388US11011502B2Semiconductor packageNEPES CO LTD·Filed 2019·Granted May 18, 2021·6 cites·14 claims
- 0486US11065859B2Device and method for disassembling solar cell moduleKOREA INST ENERGY RES·Filed 2019·Granted Jul 20, 2021·2 cites·20 claims
- 0583US11939334B2Substituted pyrimido[4,5-b][1,4]diazepines as PLK1 degradation inducersUPPTHERA INC·Filed 2022·Granted Mar 26, 2024·1 cites·13 claims
- 0681US10957654B2Semiconductor package and method of manufacturing the sameNEPES CO LTD·Filed 2019·Granted Mar 23, 2021·5 cites·11 claims
- 0779US11476211B2Semiconductor package and manufacturing method thereofNEPES CO LTD·Filed 2020·Granted Oct 18, 2022·1 cites·18 claims
- 0879US8237276B2Bump structure and fabrication method thereofSONG CHI JUNG·Filed 2010·Granted Aug 7, 2012·8 cites·6 claims
- 0976US12334694B2Electric appliance and adapterSOLUM CO LTD·Filed 2024·Granted Jun 17, 2025·0 cites·16 claims
- 1076US9754892B2Stacked semiconductor package and manufacturing method thereofNEPES CO LTD·Filed 2012·Granted Sep 5, 2017·4 cites·17 claims
- 1176US2024334614A1Electrical device having heat dissipation structure using filler and manufacturing method of the sameSOLUM CO LTD·Filed 2024·Application pending·0 cites
- 1275US10381312B2Semiconductor package and method of manufacturing the sameNEPES CO LTD·Filed 2017·Granted Aug 13, 2019·2 cites·5 claims
- 1372US10468895B2Charger with improved heat radiation and the manufacturing method thereofSOLUM CO LTD·Filed 2016·Granted Nov 5, 2019·2 cites·14 claims
- 1471US9793251B2Semiconductor package and manufacturing method thereofNEPES CO LTD·Filed 2015·Granted Oct 17, 2017·2 cites·18 claims
- 1571US7416758B2Slit coaterLG DISPLAY CO LTD·Filed 2005·Granted Aug 26, 2008·5 cites·10 claims
- 1665US12028985B2Electrical device having heat dissipation structure using filler and manufacturing method of the sameSOLUM CO LTD·Filed 2021·Granted Jul 2, 2024·0 cites·20 claims
- 1763US11955755B2Electric appliance and adapterSOLUM CO LTD·Filed 2021·Granted Apr 9, 2024·0 cites·16 claims
- 1863US11912710B2Substituted pyrimido[4,5-b][1,4]diazepines as PLK1 degradation inducersUPPTHERA INC·Filed 2022·Granted Feb 27, 2024·0 cites·12 claims
- 1963US10799955B2Method of manufacturing metal powders and apparatus for manufacturing metal powders realizing the sameUNIV KOREA RES & BUS FOUND·Filed 2017·Granted Oct 13, 2020·0 cites·4 claims
- 2057US9855605B2Method of manufacturing metal powders and apparatus for manufacturing metal powders realizing the sameUNIV KOREA RES & BUS FOUND·Filed 2015·Granted Jan 2, 2018·0 cites·5 claims
- 2154US11825599B2Air-pocket prevention PCB, air-pocket prevention PCB module, electrical device including the same, and manufacturing method of electrical device including the sameSOLUM CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·13 claims
- 2254US2025073218A1Nlrp3 protein degradation inducing compoundUPPTHERA·Filed 2021·Application pending·0 cites
- 2353US5901716AWafer cleaning apparatus with rotating cleaning solution injection nozzlesSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted May 11, 1999·20 cites·7 claims
- 2451US2024317711A1Aurka selective degradation inducing compoundUPPTHERA INC·Filed 2022·Application pending·0 cites
- 2550US12479840B2HMG-CoA reductase degradation inducing compoundUPPTHERA·Filed 2021·Granted Nov 25, 2025·0 cites·3 claims
- 2647US2024253899A1Transfer deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2745US11898188B2Mutant microorganism having ability to produce 1,3-propanediol, and method for preparing 1,3-PDO by using sameKOREA ADVANCED INST SCI & TECH·Filed 2019·Granted Feb 13, 2024·0 cites·2 claims
- 2845US11783989B2TransformerSOLUM CO LTD·Filed 2019·Granted Oct 10, 2023·0 cites·8 claims
- 2945US2013334909A1MotorLG INNOTEK CO LTD·Filed 2013·Application pending·0 cites
- 3042US12205904B2Wafer-level design and wiring pattern for a semiconductor packageNEPES CO LTD·Filed 2019·Granted Jan 21, 2025·0 cites·10 claims
- 3142US12198997B2Semiconductor package comprising first molding layer and second molding layer with different thermal expansion coefficientsNEPES CO LTD·Filed 2019·Granted Jan 14, 2025·0 cites·13 claims
- 3240US2020273830A1Semiconductor device and method for manufacturing the sameNEPES CO LTD·Filed 2020·Application pending·0 cites
- 3337US11264330B2Chip package with connection portion that passes through an encapsulation portionNEPES CO LTD·Filed 2018·Granted Mar 1, 2022·0 cites·16 claims
- 3437US10880610B2Method for providing additional contents at terminal, and terminal using sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 29, 2020·0 cites·15 claims
- 3535US2017069564A1Semiconductor package and method of manufacturing the sameNEPES CO LTD·Filed 2016·Application pending·0 cites
- 3634US11450535B2Manufacturing method for semiconductor package including filling member and membrane memberNEPES CO LTD·Filed 2017·Granted Sep 20, 2022·0 cites·4 claims
- 3734US2016293580A1System in package and method for manufacturing the sameNEPES CO LTD·Filed 2015·Application pending·0 cites
- 3833US6447823B1Liquid yogurt with encapsulated lactic acid bacteria and method for producing the sameBING GRAE CO LTD·Filed 1998·Granted Sep 10, 2002·12 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →