Inventor · disambiguated record
Jung-Huei Peng
Also filed as: PENG JUNG-HUEI
100 granted patents·4 pending applications·931 citations·filing 2008–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD58TAIWAN SEMICONDUCTOR MFG23WU TING-HAU7ILLUMINA INC3HUANG HSIN-TING2
Top patents by PatentIndex Score
104 records- 0199US9394161B2MEMS and CMOS integration with low-temperature bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 19, 2016·225 cites·20 claims
- 0299US8377798B2Method and structure for wafer to wafer bonding in semiconductor packagingTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 19, 2013·222 cites·23 claims
- 0398US9695039B1Multi-pressure MEMS packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 4, 2017·17 cites·20 claims
- 0498US9238581B2Triple-axis MEMS accelerometerTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 19, 2016·50 cites·20 claims
- 0598US9233839B2MEMS device and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 12, 2016·51 cites·17 claims
- 0698US9181083B2MEMS devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 10, 2015·52 cites·20 claims
- 0797US9834435B1Structure and formation method of semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 5, 2017·20 cites·20 claims
- 0897US9138994B2MEMS devices and methods of fabrication thereofPENG JUNG-HUEI·Filed 2010·Granted Sep 22, 2015·49 cites·20 claims
- 0996US9643838B1Semiconductor device and package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 9, 2017·20 cites·20 claims
- 1095US11932534B2MEMS device having a metallization structure embedded in a dielectric structure with laterally offset sidewalls of a first portion and a second portionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 19, 2024·2 cites·20 claims
- 1195US9919914B2MEMS devices including MEMS dies and connectors theretoTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·9 cites·20 claims
- 1295US9656260B2Method to produce chemical pattern in micro-fluidic structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 23, 2017·7 cites·7 claims
- 1395US8900905B1MEMS device and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 2, 2014·26 cites·18 claims
- 1494US10486153B2Method to produce chemical pattern in micro-fluidic structureILLUMINA INC·Filed 2017·Granted Nov 26, 2019·6 cites·20 claims
- 1592US9352315B2Method to produce chemical pattern in micro-fluidic structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 31, 2016·8 cites·20 claims
- 1692US8647962B2Wafer level packaging bondLIU MARTIN·Filed 2010·Granted Feb 11, 2014·14 cites·13 claims
- 1791US9938134B2Getter electrode to improve vacuum level in a microelectromechanical systems (MEMS) deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·7 cites·20 claims
- 1891US9828234B2Semiconductor MEMS structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 28, 2017·4 cites·20 claims
- 1991US8941152B1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 27, 2015·11 cites·20 claims
- 2090US10273142B2Semiconductor MEMS structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·3 cites·20 claims
- 2190US8905293B2Self-removal anti-stiction coating for bonding processLIU PING-YIN·Filed 2010·Granted Dec 9, 2014·12 cites·19 claims
- 2290US8841201B2Systems and methods for post-bonding wafer edge sealTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 23, 2014·12 cites·20 claims
- 2390US8580594B2Method of fabricating a semiconductor device having recessed bonding siteHUANG HSIN-TING·Filed 2011·Granted Nov 12, 2013·13 cites·18 claims
- 2488US11298697B2Method to produce chemical pattern in micro-fluidic structureILLUMINA INC·Filed 2019·Granted Apr 12, 2022·2 cites·12 claims
- 2588US9352956B2MEMS devices and methods for forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 31, 2016·5 cites·20 claims
- 2687US12221337B2Semiconductor MEMS structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 2787US10710871B2MEMS devices including MEMS dies and connectors theretoTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 14, 2020·2 cites·20 claims
- 2887US9054121B2MEMS structures and methods for forming the sameLIU PING-YIN·Filed 2011·Granted Jun 9, 2015·5 cites·20 claims
- 2987US8455999B2Method for reducing chip warpageWU TING-HAU·Filed 2011·Granted Jun 4, 2013·5 cites·20 claims
- 3086US11767216B2Semiconductor MEMS structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 26, 2023·1 cites·20 claims
- 3186US10266390B2Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·2 cites·20 claims
- 3285US10779100B2Method for manufacturing a microphoneTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 15, 2020·3 cites·20 claims
- 3385US10508023B2MEMS devices including MEMS dies and connectors theretoTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·2 cites·20 claims
- 3485US10294098B2Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 21, 2019·4 cites·20 claims
- 3585US9114396B2Method of making flowcell with micro-fluid structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 25, 2015·7 cites·20 claims
- 3684US8232614B1Package systems having a conductive element through a substrate thereof and manufacturing methods of the sameCHU CHIA-HUA·Filed 2011·Granted Jul 31, 2012·6 cites·20 claims
- 3781US12303888B2Method to produce chemical pattern in micro-fluidic structureILLUMINA INC·Filed 2022·Granted May 20, 2025·0 cites·17 claims
- 3881US2025324794A1Methods Of Forming Optical ModulesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3981US2025321406A1Flat optics camera module for high quality imagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4079US11279615B2Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 22, 2022·2 cites·20 claims
- 4179US8053336B2Method for reducing chip warpageTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Nov 8, 2011·5 cites·19 claims
- 4278US9355896B2Package systemsTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted May 31, 2016·2 cites·20 claims
- 4377US10266396B2MEMS device with enhanced sensing structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
- 4477US9998843B2Method for manufacturing a microphoneTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 12, 2018·1 cites·7 claims
- 4577US9212050B2Cap and substrate electrical connection at wafer levelTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 15, 2015·2 cites·20 claims
- 4675US11104129B2MEMS devices and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 31, 2021·0 cites·20 claims
- 4775US9150404B2Semiconductor device with through molding viasTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 6, 2015·3 cites·20 claims
- 4874US12468130B2Optical device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 4973US12376401B2Methods of forming optical modulesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 5073US11312623B2Semiconductor structure for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·0 cites·20 claims
Showing the top 50 of 104 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →