Inventor · disambiguated record
Judith M. Rubino
Also filed as: RUBINO JUDITH M · RUBINO JUDITH MARIE
19 granted patents·6 pending applications·1,559 citations·filing 1999–2008
96Inventor score
Top patents by PatentIndex Score
25 records- 0199US6342733B1Reduced electromigration and stressed induced migration of Cu wires by surface coatingIBM·Filed 1999·Granted Jan 29, 2002·506 cites·11 claims
- 0297US6335104B1Method for preparing a conductive pad for electrical connection and conductive pad formedIBM·Filed 2000·Granted Jan 1, 2002·155 cites·45 claims
- 0396US6323128B1Method for forming Co-W-P-Au filmsIBM·Filed 1999·Granted Nov 27, 2001·292 cites·20 claims
- 0495US6975032B2Copper recess process with application to selective capping and electroless platingIBM·Filed 2002·Granted Dec 13, 2005·85 cites·19 claims
- 0595US6259408B1RFID transponders with paste antennas and flip-chip attachmentINTERMEC IP CORP·Filed 1999·Granted Jul 10, 2001·223 cites·24 claims
- 0694US6503834B1Process to increase reliability CuBEOL structuresIBM·Filed 2000·Granted Jan 7, 2003·79 cites·16 claims
- 0792US7468320B2Reduced electromigration and stressed induced migration of copper wires by surface coatingIBM·Filed 2005·Granted Dec 23, 2008·14 cites·9 claims
- 0892US7064064B2Copper recess process with application to selective capping and electroless platingIBM·Filed 2005·Granted Jun 20, 2006·22 cites·10 claims
- 0990US6646345B2Method for forming Co-W-P-Au filmsIBM·Filed 2001·Granted Nov 11, 2003·45 cites·5 claims
- 1085US7217655B2Electroplated CoWP composite structures as copper barrier layersIBM·Filed 2005·Granted May 15, 2007·11 cites·25 claims
- 1183US6457234B1Process for manufacturing self-aligned corrosion stop for copper C4 and wirebondIBM·Filed 1999·Granted Oct 1, 2002·53 cites·12 claims
- 1281US7407605B2Manufacturable CoWP metal cap process for copper interconnectsIBM·Filed 2007·Granted Aug 5, 2008·8 cites·3 claims
- 1377US6779711B2Self-aligned corrosion stop for copper C4 and wirebondIBM·Filed 2002·Granted Aug 24, 2004·18 cites·10 claims
- 1472US7259025B2Ferromagnetic liner for conductive lines of magnetic memory cellsIBM·Filed 2006·Granted Aug 21, 2007·4 cites·26 claims
- 1567US7193323B2Electroplated CoWP composite structures as copper barrier layersIBM·Filed 2003·Granted Mar 20, 2007·11 cites·18 claims
- 1662US7081680B2Self-aligned corrosion stop for copper C4 and wirebondIBM·Filed 2004·Granted Jul 25, 2006·7 cites·24 claims
- 1759US6656750B1Method for testing chips on flat solder bumpsIBM·Filed 1999·Granted Dec 2, 2003·17 cites·7 claims
- 1859US6339024B1Reinforced integrated circuitsIBM·Filed 2000·Granted Jan 15, 2002·8 cites·4 claims
- 1959US2009142924A1Reduced electromigration and stressed induced migration of cu wires by surface coatingIBM·Filed 2008·Application pending·0 cites
- 2045US7253106B2Manufacturable CoWP metal cap process for copper interconnectsIBM·Filed 2004·Granted Aug 7, 2007·1 cites·41 claims
- 2142US2002098681A1Reduced electromigration and stressed induced migration of Cu wires by surface coatingFiled 2001·Application pending·0 cites
- 2242US2004087046A1Method for testing chips on flat solder bumpsIBM·Filed 2003·Application pending·0 cites
- 2339US2006022286A1Ferromagnetic liner for conductive lines of magnetic memory cellsLEUSCHNER RAINER·Filed 2004·Application pending·0 cites
- 2439US2007284654A1Metal alloy layer over conductive region of transistor device of different conductive material than conductive regionRUBINO JUDITH M·Filed 2006·Application pending·0 cites
- 2535US2002081842A1Electroless metal liner formation methodsFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →