Inventor · disambiguated record
Jun Wei
Also filed as: WEI JUN · WEI JUN GYEN
6 granted patents·11 pending applications·42 citations·filing 2002–2024
78Inventor score
Top patents by PatentIndex Score
17 records- 0179US7192841B2Method of wafer/substrate bondingAGENCY SCIENCE TECH & RES·Filed 2002·Granted Mar 20, 2007·30 cites·21 claims
- 0268US7405466B2Method of fabricating microelectromechanical system structuresAGENCY SCIENCE TECH & RES·Filed 2006·Granted Jul 29, 2008·4 cites·25 claims
- 0358US12446209B2Semiconductor structure and method for fabricating the sameCHANGXIN MEMORY TECH INC·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 0453US2020208264A1Semiconductor processing apparatus and control method thereofYANGTZE MEMORY TECH CO LTD·Filed 2019·Application pending·0 cites
- 0550US2024429042A1Semiconductor structure and method for manufacturing sameCXMT CORP·Filed 2024·Application pending·0 cites
- 0649US11141854B2Cutting mat assembly and method for making the sameYING SIN CO LTD·Filed 2019·Granted Oct 12, 2021·0 cites·4 claims
- 0748US7153759B2Method of fabricating microelectromechanical system structuresAGENCY SCIENCE TECH & RES·Filed 2004·Granted Dec 26, 2006·4 cites·33 claims
- 0846US2024079457A1Method for manufacturing semiconductor structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 0945US2025022749A1Semiconductor Structure And Method For Fabricating The SameCHANGXIN MEMORY TECH INC·Filed 2022·Application pending·0 cites
- 1044US7115182B2Anodic bonding process for ceramicsAGENCY SCIENCE TECH & RES·Filed 2004·Granted Oct 3, 2006·4 cites·90 claims
- 1144US2011226841A1Room temperature direct metal-metal bondingWEI JUN·Filed 2008·Application pending·0 cites
- 1242US2022293422A1Semiconductor structure and preparation method for semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Application pending·0 cites
- 1339US2011237000A1Method for detecting an analyte moleculeAGENCY SCIENCE TECH & RES·Filed 2011·Application pending·0 cites
- 1439US2006286388A1Anodic bonding process for ceramicsWEI JUN·Filed 2006·Application pending·0 cites
- 1536US2006179940A1Ultra-small Profile, Low Cost Chip Scale Accelerometers of Two and Three Axes Based on Wafer Level PackagingFINEMEMS INC·Filed 2005·Application pending·0 cites
- 1634US2020086624A1Method and system of manufacturing a load-bearing structure and a load-bearing structure manufactured thereofAGENCY SCIENCE TECH & RES·Filed 2017·Application pending·0 cites
- 1727US2018236604A1Method of forming an elongated body with an embedded channelAGENCY SCIENCE TECH & RES·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →