Inventor · disambiguated record
Junnan Zhao
Also filed as: ZHAO JUNNAN
34 granted patents·14 pending applications·52 citations·filing 2017–2025
95Inventor score
Top patents by PatentIndex Score
48 records- 0197US11557579B2Microelectronic assemblies having an integrated capacitorINTEL CORP·Filed 2020·Granted Jan 17, 2023·5 cites·23 claims
- 0296US11696407B2Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrateINTEL CORP·Filed 2021·Granted Jul 4, 2023·3 cites·21 claims
- 0391US11521914B2Microelectronic assemblies having a cooling channelINTEL CORP·Filed 2018·Granted Dec 6, 2022·8 cites·13 claims
- 0491US11443885B2Thin film barrier seed metallization in magnetic-plugged through hole inductorINTEL CORP·Filed 2018·Granted Sep 13, 2022·4 cites·12 claims
- 0591US11387224B2Phase change material in substrate cavityINTEL CORP·Filed 2018·Granted Jul 12, 2022·7 cites·20 claims
- 0690US11646254B2Electronic device including a lateral traceTAHOE RES LTD·Filed 2020·Granted May 9, 2023·2 cites·25 claims
- 0790US10804188B2Electronic device including a lateral traceINTEL CORP·Filed 2018·Granted Oct 13, 2020·5 cites·9 claims
- 0888US10373951B1Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling sameINTEL CORP·Filed 2018·Granted Aug 6, 2019·4 cites·23 claims
- 0983US2024405006A1Microelectronic assemblies having an integrated capacitorINTEL CORP·Filed 2024·Application pending·0 cites
- 1082US10643994B2Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling sameINTEL CORP·Filed 2019·Granted May 5, 2020·2 cites·21 claims
- 1180US12087746B2Microelectronic assemblies having an integrated capacitorINTEL CORP·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 1277US11894282B2Vented lids for integrated circuit packagesINTEL CORP·Filed 2019·Granted Feb 6, 2024·2 cites·20 claims
- 1377US11557489B2Cavity structures in integrated circuit package supportsINTEL CORP·Filed 2018·Granted Jan 17, 2023·2 cites·20 claims
- 1475US11721677B2Microelectronic assemblies having an integrated capacitorINTEL CORP·Filed 2018·Granted Aug 8, 2023·1 cites·24 claims
- 1574US11217534B2Galvanic corrosion protection for semiconductor packagesINTEL CORP·Filed 2017·Granted Jan 4, 2022·2 cites·20 claims
- 1673US2023352385A1Electronic device including a lateral traceTAHOE RES LTD·Filed 2023·Application pending·0 cites
- 1772US12154715B2Methods to selectively embed magnetic materials in substrate and corresponding structuresINTEL CORP·Filed 2022·Granted Nov 26, 2024·0 cites·25 claims
- 1872US11735537B2Methods to embed magnetic material as first layer on coreless substrates and corresponding structuresINTEL CORP·Filed 2022·Granted Aug 22, 2023·0 cites·23 claims
- 1971US11443892B2Substrate assembly with encapsulated magnetic featureINTEL CORP·Filed 2018·Granted Sep 13, 2022·1 cites·17 claims
- 2070US11335632B2Magnetic inductor structures for package devicesINTEL CORP·Filed 2017·Granted May 17, 2022·1 cites·15 claims
- 2170US10790159B2Semiconductor package substrate with through-hole magnetic core inductor using conductive pasteINTEL CORP·Filed 2018·Granted Sep 29, 2020·1 cites·15 claims
- 2270US10777514B2Techniques for an inductor at a second level interfaceINTEL CORP·Filed 2018·Granted Sep 15, 2020·1 cites·16 claims
- 2369US10971492B2Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling sameINTEL CORP·Filed 2020·Granted Apr 6, 2021·0 cites·21 claims
- 2468US11901115B2Substrate assembly with encapsulated magnetic featureINTEL CORP·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 2568US2023187205A1Substrate package with glass dielectricINTEL CORP·Filed 2023·Application pending·0 cites
- 2667US11495555B2Magnetic bilayer structure for a cored or coreless semiconductor packageINTEL CORP·Filed 2018·Granted Nov 8, 2022·1 cites·13 claims
- 2766US11031360B2Techniques for an inductor at a second level interfaceINTEL CORP·Filed 2020·Granted Jun 8, 2021·0 cites·13 claims
- 2864US2022230800A1Techniques for an inductor at a first level interfaceINTEL CORP·Filed 2022·Application pending·0 cites
- 2964US2022230951A1Magnetic inductor structures for package devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 3060US11651885B2Magnetic core inductorsINTEL CORP·Filed 2017·Granted May 16, 2023·0 cites·11 claims
- 3156US11830809B2Magnetic structures in integrated circuit package supportsINTEL CORP·Filed 2020·Granted Nov 28, 2023·0 cites·19 claims
- 3256US11450471B2Methods to selectively embed magnetic materials in substrate and corresponding structuresINTEL CORP·Filed 2018·Granted Sep 20, 2022·0 cites·19 claims
- 3356US11322290B2Techniques for an inductor at a first level interfaceINTEL CORP·Filed 2018·Granted May 3, 2022·0 cites·6 claims
- 3456US11246218B2Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrateINTEL CORP·Filed 2018·Granted Feb 8, 2022·0 cites·22 claims
- 3555US11417614B2Methods to embed magnetic material as first layer on coreless substrates and corresponding structuresINTEL CORP·Filed 2018·Granted Aug 16, 2022·0 cites·22 claims
- 3651US2020027728A1Substrate package with glass dielectricINTEL CORP·Filed 2018·Application pending·0 cites
- 3751US2025171120A1Method for evaluating anchorage state and device thereofUNIV WUHAN TECH·Filed 2025·Application pending·0 cites
- 3847US11355459B2Embedding magnetic material, in a cored or coreless semiconductor packageINTEL CORP·Filed 2018·Granted Jun 7, 2022·0 cites·25 claims
- 3947US2023197351A1Film capacitor on a glass substrateZHANG CHONG·Filed 2021·Application pending·0 cites
- 4045US2022412743A1Method and device for calculating anchoring area of shipUNIV WUHAN TECH·Filed 2022·Application pending·0 cites
- 4144US11502017B2Effective heat conduction from hotspot to heat spreader through package substrateINTEL CORP·Filed 2018·Granted Nov 15, 2022·0 cites·21 claims
- 4244US11276634B2High density package substrate formed with dielectric bi-layerINTEL CORP·Filed 2017·Granted Mar 15, 2022·0 cites·19 claims
- 4344US2020119250A1In-situ formation of a thermoelectric device in a substrate packagingINTEL CORP·Filed 2018·Application pending·0 cites
- 4443US11482471B2Thermal management solutions for integrated circuit packagesINTEL CORP·Filed 2019·Granted Oct 25, 2022·0 cites·18 claims
- 4543US2019272936A1Fully embedded magnetic-core in core layer for custom inductor in ic substrateINTEL CORP·Filed 2018·Application pending·0 cites
- 4642US2020312738A1Thermal management solutions using compartmentalized phase change materialsINTEL CORP·Filed 2019·Application pending·0 cites
- 4741US2019295937A1Non-roughened cu trace with anchoring to reduce insertion loss of high speed io routing in package substrateINTEL CORP·Filed 2018·Application pending·0 cites
- 4840US2020006210A1Chip package and method of manufacturingINTEL CORP·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Junnan Zhao files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →