Inventor · disambiguated record
Jyh Chwen Frank Lee
Also filed as: LEE JYH CHWEN FRANK
15 granted patents·9 pending applications·144 citations·filing 2007–2025
89Inventor score
Top patents by PatentIndex Score
24 records- 0197US11967591B2Info packages including thermal dissipation blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 23, 2024·4 cites·20 claims
- 0297US7895548B2Filler cells for design optimization in a place-and-route systemSYNOPSYS INC·Filed 2007·Granted Feb 22, 2011·128 cites·34 claims
- 0393US11842946B2Semiconductor package having an encapsulant comprising conductive fillers and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 12, 2023·2 cites·20 claims
- 0484US8504969B2Filler cells for design optimization in a place-and-route systemLIN XI-WEI·Filed 2010·Granted Aug 6, 2013·8 cites·12 claims
- 0582US12368148B2Info packages including thermal dissipation blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 0682US2025309218A1Info packages including thermal dissipation blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0781US12400989B2Arrangement of power-grounds in package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 26, 2025·0 cites·20 claims
- 0881US2025391797A1Arrangement of power-grounds in package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0980US12261095B2Semiconductor package having an encapulant comprising conductive fillers and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 1080US12159791B2Info packages including thermal dissipation blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 1180US2025364496A1Thermally-aware semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1280US2025054775A1Info packages including thermal dissipation blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1378US2024371839A1Heat Dissipation in Semiconductor Packages and Methods of Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1478US2025349804A1Semiconductor structure with integrated passive device having opposed solder bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1577US12074148B2Heat dissipation in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·20 claims
- 1674US2025232105A1Systems and methods of estimating thermal properties of semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1773US2025210452A1Semiconductor package having an encapulant comprising conductive fillers and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1872US11817324B2Info packages including thermal dissipation blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 1972US8694942B2Filler cells for design optimization in a place-and-route systemSYNOPSYS INC·Filed 2013·Granted Apr 8, 2014·2 cites·13 claims
- 2070US11929340B2Arrangement of power-grounds in package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·0 cites·20 claims
- 2168US11527518B2Heat dissipation in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·0 cites·20 claims
- 2267US12299369B2Systems and methods of estimating thermal properties of semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 2364US2023387078A1Semiconductor structure with integrated passive device having opposed solder bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2461US12512445B2Package structure, semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 30, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →