Inventor · disambiguated record
Kazuhiro Baba
Also filed as: BABA KAZUHIRO
24 granted patents·4 pending applications·704 citations·filing 1996–2012
97Inventor score
Top patents by PatentIndex Score
28 records- 0198US7338884B2Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor deviceNEC CORP·Filed 2004·Granted Mar 4, 2008·286 cites·17 claims
- 0297US7397000B2Wiring board and semiconductor package using the sameNEC CORP·Filed 2005·Granted Jul 8, 2008·54 cites·18 claims
- 0394US5975534ASealing deviceNTN TOYO BEARING CO LTD·Filed 1997·Granted Nov 2, 1999·77 cites·7 claims
- 0492US7294393B2Sheet material and wiring boardNEC CORP·Filed 2005·Granted Nov 13, 2007·22 cites·23 claims
- 0592US6861757B2Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor deviceNEC CORP·Filed 2002·Granted Mar 1, 2005·55 cites·46 claims
- 0691US7566834B2Wiring board and semiconductor package using the sameNEC CORP·Filed 2008·Granted Jul 28, 2009·17 cites·11 claims
- 0789US8198140B2Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor packageMURAI HIDEYA·Filed 2010·Granted Jun 12, 2012·14 cites·12 claims
- 0887US6841862B2Semiconductor package board using a metal baseNEC CORP·Filed 2001·Granted Jan 11, 2005·33 cites·25 claims
- 0986US7745736B2Interconnecting substrate and semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted Jun 29, 2010·15 cites·28 claims
- 1084US8123411B2Sensor-equipped bearing for wheelNORIMATSU TAKAYUKI·Filed 2008·Granted Feb 28, 2012·7 cites·7 claims
- 1184US7696007B2Semiconductor package board using a metal baseNEC CORP·Filed 2009·Granted Apr 13, 2010·8 cites·21 claims
- 1283US7233066B2Multilayer wiring substrate, and method of producing sameNEC ELECTRONICS CORP·Filed 2006·Granted Jun 19, 2007·8 cites·7 claims
- 1380US7060604B2Multilayer wiring substrate, and method of producing sameNEC ELECTRONICS CORP·Filed 2003·Granted Jun 13, 2006·21 cites·32 claims
- 1479US7474538B2Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor packageNEC CORP·Filed 2004·Granted Jan 6, 2009·22 cites·38 claims
- 1575US5930077AMagnetic head for recording and reproducing a signal and comprising a slider provided with a protective film including an intermediate layer and an amorphous hard carbon layerNEC CORP·Filed 1996·Granted Jul 27, 1999·28 cites·13 claims
- 1673US7832941B2Bearing apparatus for a wheel of vehicleNTN TOYO BEARING CO LTD·Filed 2008·Granted Nov 16, 2010·4 cites·8 claims
- 1772US7816782B2Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor packageNEC CORP·Filed 2005·Granted Oct 19, 2010·4 cites·21 claims
- 1869US8313242B2Sensor-equipped bearing for wheelNORIMATSU TAKAYUKI·Filed 2012·Granted Nov 20, 2012·3 cites·2 claims
- 1969US7641394B2Bearing apparatus for a wheel of vehicleNTN TOYO BEARING CO LTD·Filed 2008·Granted Jan 5, 2010·4 cites·16 claims
- 2068US7748909B2Bearing apparatus for a wheel of vehicleNTN TOYO BEARING CO LTD·Filed 2008·Granted Jul 6, 2010·3 cites·12 claims
- 2166US8840313B2Bearing apparatus for a wheel of vehicleKOMORI KAZUO·Filed 2008·Granted Sep 23, 2014·3 cites·12 claims
- 2266US7585699B2Semiconductor package board using a metal baseNEC CORP·Filed 2006·Granted Sep 8, 2009·2 cites·19 claims
- 2349US2003211890A1Game execution method and equipment using player dataFiled 2003·Application pending·0 cites
- 2444US6607445B1Game execution method and equipment using player dataSEGA ENTERPRISES KK·Filed 1999·Granted Aug 19, 2003·12 cites·12 claims
- 2543US2005098875A1Semiconductor package board using a metal baseNEC CORP·Filed 2004·Application pending·0 cites
- 2642US2007098315A1Bearing apparatus for a wheel of vehicleNTN TOYO BEARING CO LTD·Filed 2004·Application pending·0 cites
- 2740US2004089470A1Printed circuit board, semiconductor package, base insulating film, and manufacturing method for interconnect substrateNEC CORP·Filed 2003·Application pending·0 cites
- 2819US6364819B1Fastening device for joining two plates togetherMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Apr 2, 2002·2 cites·30 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →