Inventor · disambiguated record
Kazuyoshi Ebe
Also filed as: EBE KAZUYOSHI
28 granted patents·2 pending applications·1,326 citations·filing 1986–2003
98Inventor score
Top patents by PatentIndex Score
30 records- 0193US5882956AProcess for producing semiconductor deviceTEXAS INSTRUMENTS JAPAN·Filed 1997·Granted Mar 16, 1999·161 cites·9 claims
- 0293US5118567AAdhesive tape and use thereofLINTEC CORP·Filed 1989·Granted Jun 2, 1992·100 cites·4 claims
- 0393US5110388AMethod of dicing and bonding semiconductor chips using a photocurable and heat curable adhesive tapeLINTEC CORP·Filed 1991·Granted May 5, 1992·150 cites·8 claims
- 0488US6007920AWafer dicing/bonding sheet and process for producing semiconductor deviceTEXAS INSTRUMENTS JAPAN·Filed 1998·Granted Dec 28, 1999·92 cites·5 claims
- 0587US6702910B2Process for producing a chipLINTEC CORP·Filed 2001·Granted Mar 9, 2004·36 cites·3 claims
- 0687US6398892B1Method of using pressure sensitive adhesive double coated sheetLINTEC CORP·Filed 1999·Granted Jun 4, 2002·91 cites·14 claims
- 0787US4756968AAdhesive sheetsFSK KK·Filed 1986·Granted Jul 12, 1988·71 cites·11 claims
- 0886US5356949AAdhesive composition comprising (meth)acrylate polymer and epoxy resinLINTEC CORP·Filed 1992·Granted Oct 18, 1994·75 cites·1 claims
- 0985US6977024B2Method for manufacturing semiconductor device using adhesive sheet with embedded conductor bodiesLINTEC CORP·Filed 2003·Granted Dec 20, 2005·23 cites·15 claims
- 1082US6465330B1Method for grinding a wafer backLINTEC CORP·Filed 1999·Granted Oct 15, 2002·64 cites·8 claims
- 1182US5187007AAdhesive sheetsLINTEC CORP·Filed 1990·Granted Feb 16, 1993·80 cites·15 claims
- 1282US4946728AAdhesive paper for copyingFSK KK·Filed 1988·Granted Aug 7, 1990·41 cites·15 claims
- 1377US6718223B1Method of processing semiconductor wafer and semiconductor wafer supporting memberLINTEC CORP·Filed 2000·Granted Apr 6, 2004·22 cites·9 claims
- 1476US6436795B2Process for producing semiconductor chipLINTEC CORP·Filed 2001·Granted Aug 20, 2002·20 cites·4 claims
- 1576US5976691AProcess for producing chip and pressure sensitive adhesive sheet for said processLINTEC CORP·Filed 1997·Granted Nov 2, 1999·42 cites·4 claims
- 1676US4929486ACover tape for sealing chip-holding parts of carrier tapeFSK KK·Filed 1988·Granted May 29, 1990·24 cites·4 claims
- 1775US6911720B2Semiconductor device adhesive sheet with conductor bodies buried thereinLINTEC CORP·Filed 2002·Granted Jun 28, 2005·8 cites·13 claims
- 1875US6225194B1Process for producing chip and pressure sensitive adhesive sheet for said processLINTEC CORP·Filed 1999·Granted May 1, 2001·40 cites·3 claims
- 1973US4965127AAdhesive sheetsFSK KK·Filed 1987·Granted Oct 23, 1990·35 cites·10 claims
- 2065US6139953AAdhesive tape, base material for adhesive tape and their manufacturing methodsLINTEC CORP·Filed 1997·Granted Oct 31, 2000·34 cites·27 claims
- 2163US6900550B2Semiconductor device including adhesive agent layer with embedded conductor bodiesLINTEC CORP·Filed 2003·Granted May 31, 2005·7 cites·4 claims
- 2263US6312800B1Pressure sensitive adhesive sheet for producing a chipLINTEC CORP·Filed 1998·Granted Nov 6, 2001·24 cites·11 claims
- 2359US6855418B2Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing sameLINTEC CORP·Filed 2002·Granted Feb 15, 2005·8 cites·9 claims
- 2459US6723619B2Pressure sensitive adhesive sheet for semiconductor wafer processingLINTEC CORP·Filed 2002·Granted Apr 20, 2004·6 cites·8 claims
- 2557US6297076B1Process for preparing a semiconductor waferLINTEC CORP·Filed 1994·Granted Oct 2, 2001·25 cites·13 claims
- 2655US6171672B1Cover tape for chip transportation and sealed structureLINTEC CORP·Filed 1998·Granted Jan 9, 2001·20 cites·8 claims
- 2754US6156423ABase material and adhesive tape using the sameLINTEC CORP·Filed 1998·Granted Dec 5, 2000·19 cites·13 claims
- 2848US4994300AMethod of making a cover tape for sealing chip-holding parts of carrier tapeLINTEC CORP·Filed 1989·Granted Feb 19, 1991·8 cites·7 claims
- 2942US2005124739A1Sheet and formed product thereofDENKI KAGAKU KOGYO KK·Filed 2003·Application pending·0 cites
- 3040US2003031866A1Pressure sensitive adhesive double coated sheetLINTEC CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →