Inventor · disambiguated record
Katsuhito Fukuda
Also filed as: FUKUDA KATSUHITO
7 granted patents·2 pending applications·135 citations·filing 1981–2020
85Inventor score
Files withMORESCO CORP4FUKUDA METAL FOIL POWDER3FUKUDA METAL FOIL AND POWDER C1MATSUMURA OIL RES CORP1
Top patents by PatentIndex Score
9 records- 0188US4387006AMethod of treating the surface of the copper foil used in printed wire boardsFUKUDA METAL FOIL POWDER·Filed 1981·Granted Jun 7, 1983·58 cites·8 claims
- 0282US10400142B2Hot melt adhesiveMORESCO CORP·Filed 2015·Granted Sep 3, 2019·2 cites·7 claims
- 0381US10975272B2Hot melt composition, hot melt composition production method, seal material, electronic device, and lampMORESCO CORP·Filed 2016·Granted Apr 13, 2021·1 cites·15 claims
- 0470US5338619ACopper foil for printed circuits and method of producing sameFUKUDA METAL FOIL AND POWDER C·Filed 1992·Granted Aug 16, 1994·30 cites·4 claims
- 0570US4981560AMethod of surface treatment of copper foil or a copper clad laminate for internal layerFUKUDA METAL FOIL POWDER·Filed 1989·Granted Jan 1, 1991·31 cites·16 claims
- 0650US11208578B2Hot melt composition, hot melt composition production method, seal material, electronic device, and lampMORESCO CORP·Filed 2016·Granted Dec 28, 2021·0 cites·10 claims
- 0749US5356528ACopper foil for printed circuits and method of producing sameFUKUDA METAL FOIL POWDER·Filed 1993·Granted Oct 18, 1994·13 cites·8 claims
- 0844US2009110925A1Adhesive CompositionMATSUMURA OIL RES CORP·Filed 2005·Application pending·0 cites
- 0940US2022154049A1Ethylene vinyl acetate hot melt adhesive manufacturing method, and hot melt adhesiveMORESCO CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →