Inventor · disambiguated record
Kazuichi Hayashi
Also filed as: HAYASHI KAZUICHI
10 granted patents·2 pending applications·810 citations·filing 1996–2011
92Inventor score
Top patents by PatentIndex Score
12 records- 0195US8038835B2Processing device, electrode, electrode plate, and processing methodTOKYO ELECTRON LTD·Filed 2010·Granted Oct 18, 2011·529 cites·4 claims
- 0279US6368450B2Processing apparatusTOKYO ELECTRON LTD·Filed 1999·Granted Apr 9, 2002·60 cites·23 claims
- 0376US6156107ATrap apparatusTOKYO ELECTRON LTD·Filed 1999·Granted Dec 5, 2000·55 cites·14 claims
- 0473US5904757ATrap apparatusTOKYO ELECTRON LTD·Filed 1997·Granted May 18, 1999·48 cites·10 claims
- 0571US5879139AVacuum pump with gas heatingTOKYO ELECTRON LTD·Filed 1996·Granted Mar 9, 1999·41 cites·3 claims
- 0668US8003535B2Semiconductor device manufacturing method and target substrate processing systemTOKYO ELECTRON LTD·Filed 2008·Granted Aug 23, 2011·2 cites·5 claims
- 0768US5942282AMethod for depositing a titanium filmTOKYO ELECTRON LTD·Filed 1998·Granted Aug 24, 1999·36 cites·2 claims
- 0867US6149729AFilm forming apparatus and methodTOKYO ELECTRON LTD·Filed 1998·Granted Nov 21, 2000·34 cites·17 claims
- 0950US8310054B2Semiconductor device manufacturing method and target substrate processing systemMIYOSHI HIDENORI·Filed 2011·Granted Nov 13, 2012·0 cites·10 claims
- 1046US2010108108A1Substrate mounting table, substrate processing apparatus and method for treating surface of substrate mounting tableTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 1142US2005092435A1Processing device, electrode, electrode plate, and processing methodTOKYO ELECTRON LTD·Filed 2004·Application pending·0 cites
- 1235US6253029B1Vacuum processing apparatusTOKYO ELECTRON LTD·Filed 1998·Granted Jun 26, 2001·5 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when Kazuichi Hayashi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →