Inventor · disambiguated record
Kazuya Hirata
Also filed as: HIRATA KAZUYA
84 granted patents·32 pending applications·568 citations·filing 2004–2025
99Inventor score
Top patents by PatentIndex Score
116 records- 0199US11958132B2SiC ingot processing method and laser processing apparatusDISCO CORP·Filed 2020·Granted Apr 16, 2024·10 cites·3 claims
- 0299US9878397B2SiC wafer producing methodDISCO CORP·Filed 2017·Granted Jan 30, 2018·50 cites·3 claims
- 0399US9868177B2Wafer producing methodDISCO CORP·Filed 2017·Granted Jan 16, 2018·36 cites·1 claims
- 0499US9815138B2Wafer producing methodDISCO CORP·Filed 2016·Granted Nov 14, 2017·26 cites·4 claims
- 0598US10406635B2Wafer producing method and processing feed direction detecting methodDISCO CORP·Filed 2017·Granted Sep 10, 2019·13 cites·2 claims
- 0698US9789565B2Wafer producing methodDISCO CORP·Filed 2015·Granted Oct 17, 2017·28 cites·2 claims
- 0798US9620415B2Wafer processing methodDISCO CORP·Filed 2016·Granted Apr 11, 2017·49 cites·4 claims
- 0898US9481051B2Wafer producing methodDISCO CORP·Filed 2016·Granted Nov 1, 2016·48 cites·3 claims
- 0997US10155323B2SiC wafer producing methodDISCO CORP·Filed 2017·Granted Dec 18, 2018·22 cites·6 claims
- 1097US9517530B2Wafer producing methodDISCO CORP·Filed 2016·Granted Dec 13, 2016·31 cites·1 claims
- 1196US10870176B2SiC wafer producing methodDISCO CORP·Filed 2017·Granted Dec 22, 2020·16 cites·2 claims
- 1296US9925619B2Wafer producing methodDISCO CORP·Filed 2016·Granted Mar 27, 2018·23 cites·3 claims
- 1396US9808884B2Polycrystalline SiC wafer producing methodDISCO CORP·Filed 2016·Granted Nov 7, 2017·16 cites·4 claims
- 1495US10357851B2Wafer producing methodDISCO CORP·Filed 2017·Granted Jul 23, 2019·15 cites·2 claims
- 1595US9764420B2Wafer producing methodDISCO CORP·Filed 2015·Granted Sep 19, 2017·14 cites·2 claims
- 1695US9764428B2Wafer producing methodDISCO CORP·Filed 2015·Granted Sep 19, 2017·15 cites·2 claims
- 1794US11881407B2Processed wafer and method of manufacturing chip formation waferDENSO CORP·Filed 2021·Granted Jan 23, 2024·10 cites·5 claims
- 1894US10201907B2SiC wafer producting methodDISCO CORP·Filed 2017·Granted Feb 12, 2019·12 cites·6 claims
- 1993US10755946B2Method for producing a wafer from a hexagonal single crystal ingot by applying a laser beam to form a first production history, an exfoliation layer, and a second production historyDISCO CORP·Filed 2018·Granted Aug 25, 2020·6 cites·3 claims
- 2092US10112256B2SiC wafer producing methodDISCO CORP·Filed 2017·Granted Oct 30, 2018·4 cites·2 claims
- 2192US9981339B2Wafer producing methodDISCO CORP·Filed 2016·Granted May 29, 2018·8 cites·4 claims
- 2291US10573505B2SiC wafer producing methodDISCO CORP·Filed 2018·Granted Feb 25, 2020·6 cites·2 claims
- 2391US9884389B2SiC ingot slicing methodDISCO CORP·Filed 2015·Granted Feb 6, 2018·7 cites·2 claims
- 2490US11901231B2Separation method of waferDISCO CORP·Filed 2021·Granted Feb 13, 2024·2 cites·18 claims
- 2590US10828726B2SiC wafer producing method using ultrasonic waveDISCO CORP·Filed 2018·Granted Nov 10, 2020·6 cites·5 claims
- 2690US10081076B2Wafer producing methodDISCO CORP·Filed 2016·Granted Sep 25, 2018·4 cites·3 claims
- 2790US9975202B2Method of producing SiC waferDISCO CORP·Filed 2017·Granted May 22, 2018·3 cites·1 claims
- 2889US10319593B2Wafer thinning methodDISCO CORP·Filed 2016·Granted Jun 11, 2019·6 cites·4 claims
- 2988US10872757B2Semiconductor substrate processing methodDISCO CORP·Filed 2019·Granted Dec 22, 2020·4 cites·10 claims
- 3087US10076804B2Wafer producing methodDISCO CORP·Filed 2016·Granted Sep 18, 2018·3 cites·3 claims
- 3186US11534890B2SiC ingot forming methodDISCO CORP·Filed 2018·Granted Dec 27, 2022·2 cites·14 claims
- 3286US10872758B2SiC wafer producing methodDISCO CORP·Filed 2018·Granted Dec 22, 2020·4 cites·5 claims
- 3385US10105792B2SiC substrate separating methodDISCO CORP·Filed 2016·Granted Oct 23, 2018·4 cites·3 claims
- 3485US10094047B2Wafer producing methodDISCO CORP·Filed 2016·Granted Oct 9, 2018·2 cites·1 claims
- 3584US10319594B2Wafer thinning methodDISCO CORP·Filed 2016·Granted Jun 11, 2019·4 cites·4 claims
- 3684US9899262B2Wafer processing methodDISCO CORP·Filed 2016·Granted Feb 20, 2018·4 cites·4 claims
- 3783US10625371B2Wafer producing methodDISCO CORP·Filed 2016·Granted Apr 21, 2020·2 cites·2 claims
- 3882US7677596B2Side airbag intensifier pocketNISSAN TECH CT NORTH AMERICA·Filed 2006·Granted Mar 16, 2010·25 cites·14 claims
- 3981US10071442B2Laser processing apparatusDISCO CORP·Filed 2016·Granted Sep 11, 2018·3 cites·2 claims
- 4081US9941130B2Thin plate separating methodDISCO CORP·Filed 2016·Granted Apr 10, 2018·3 cites·5 claims
- 4180US11340163B2Method and apparatus for detecting facet region, wafer producing method, and laser processing apparatusDISCO CORP·Filed 2019·Granted May 24, 2022·2 cites·2 claims
- 4279US11469094B2Method of producing waferDISCO CORP·Filed 2019·Granted Oct 11, 2022·2 cites·3 claims
- 4376US10916460B2Wafer producing apparatusDISCO CORP·Filed 2018·Granted Feb 9, 2021·2 cites·9 claims
- 4476US10207224B2Seawater desalination system and energy recovery apparatusEBARA CORP·Filed 2014·Granted Feb 19, 2019·2 cites·6 claims
- 4576US8399024B2Water-insoluble medicineKATO HIROYUKI·Filed 2010·Granted Mar 19, 2013·2 cites·9 claims
- 4675US9884390B2Wafer producing methodDISCO CORP·Filed 2015·Granted Feb 6, 2018·2 cites·6 claims
- 4774US10655632B2Shaft seal device and vertical pump with this shaft seal deviceEBARA CORP·Filed 2016·Granted May 19, 2020·2 cites·9 claims
- 4873US2025010519A1Method of manufacturing wafer and separating apparatusDISCO CORP·Filed 2024·Application pending·0 cites
- 4970US2025262690A1Method of processing monocrystalline silicon waferDISCO CORP·Filed 2025·Application pending·0 cites
- 5070US2025326064A1Laser processing apparatus, workpiece chamfering method, and wafer manufacturing methodDISCO CORP·Filed 2025·Application pending·0 cites
Showing the top 50 of 116 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →