Inventor · disambiguated record
Katsuyuki Masuda
Also filed as: MASUDA KATSUYUKI
31 granted patents·13 pending applications·124 citations·filing 1994–2017
95Inventor score
Top patents by PatentIndex Score
44 records- 0185US7367870B2Polishing fluid and polishing methodHITACHI CHEMICAL CO LTD·Filed 2003·Granted May 6, 2008·29 cites·19 claims
- 0284US7519049B2Mobile phone system for allowing a user to transmit voice messagesEVOLIUM SAS·Filed 2004·Granted Apr 14, 2009·37 cites·11 claims
- 0382US9457406B2Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid compositionNAKAKO HIDEO·Filed 2010·Granted Oct 4, 2016·5 cites·13 claims
- 0481US7758951B2Prepreg, metal-clad laminate and printed circuit board using sameHITACHI CHEMICAL CO LTD·Filed 2005·Granted Jul 20, 2010·4 cites·12 claims
- 0579US7964289B2Formation method of metal layer on resin layer, printed wiring board, and production method thereofHITACHI CHEMICAL CO LTD·Filed 2009·Granted Jun 21, 2011·5 cites·21 claims
- 0676US7871694B2Prepreg, metal-clad laminate and printed circuit board using sameHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jan 18, 2011·2 cites·20 claims
- 0775US8956732B2Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring boardTAKEUCHI MASAKI·Filed 2007·Granted Feb 17, 2015·3 cites·14 claims
- 0873US9883427B2Wireless communication system and wireless communication methodFUJITSU LTD·Filed 2015·Granted Jan 30, 2018·2 cites·20 claims
- 0973US8524921B2Liquid tetracarboxylic dianhydrides and process for the preparation thereofKIKUCHI TOORU·Filed 2009·Granted Sep 3, 2013·2 cites·2 claims
- 1070US7615277B2Formation method of metal layer on resin layer, printed wiring board, and production method thereofHITACHI CHEMICAL CO LTD·Filed 2004·Granted Nov 10, 2009·10 cites·18 claims
- 1169US7947332B2Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2005·Granted May 24, 2011·2 cites·14 claims
- 1267US8236906B2Polyamide-imide resin, process for production of polyamide resin, and curable resin compositionEJIRI TAKAKO·Filed 2007·Granted Aug 7, 2012·3 cites·7 claims
- 1363US8801971B2Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solutionNAKAKO HIDEO·Filed 2008·Granted Aug 12, 2014·3 cites·7 claims
- 1462US7629045B2Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2005·Granted Dec 8, 2009·2 cites·19 claims
- 1562US2008138505A1Formation method of metal layer on resin layer, printed wiring board, and production method thereofTAKAI KENJI·Filed 2008·Application pending·0 cites
- 1661US8696929B2Polishing slurry and polishing methodKURATA YASUSHI·Filed 2007·Granted Apr 15, 2014·1 cites·11 claims
- 1760US2012315438A1Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheetTANAKA KENJI·Filed 2012·Application pending·0 cites
- 1858US9446576B2Adhesive agent, adhesive material using the same, and method of use thereofMASUDA KATSUYUKI·Filed 2012·Granted Sep 20, 2016·0 cites·8 claims
- 1958US5886211AProcess for producing 2-(halomethyl)phenylacetic acid estersSAGAMI CHEM RES·Filed 1996·Granted Mar 23, 1999·8 cites·12 claims
- 2056US7648770B2Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheetHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jan 19, 2010·4 cites·11 claims
- 2154US10328683B2Adhesive agent, adhesive material using the same, and method of use thereofMASUDA KATSUYUKI·Filed 2012·Granted Jun 25, 2019·0 cites·22 claims
- 2254US10322572B2Adhesive agent, adhesive material using the same, and method of use thereofMASUDA KATSUYUKI·Filed 2012·Granted Jun 18, 2019·0 cites·19 claims
- 2354US8815334B2Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring boardTAKAI KENJI·Filed 2009·Granted Aug 26, 2014·0 cites·7 claims
- 2454US7818877B2Formation method of metal layer on resin layerHITACHI CHEMICAL CO LTD·Filed 2007·Granted Oct 26, 2010·0 cites·12 claims
- 2553US7862889B2Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2009·Granted Jan 4, 2011·0 cites·18 claims
- 2651US2012244275A1Flexible laminate board, process for manufacture of the board, and flexible print wiring boardSUZUKI MASAHIKO·Filed 2012·Application pending·0 cites
- 2749US8592546B2Silicon-containing alicyclic polyimide resin, polyamic acid resin, and manufacturing method for sameKIKUCHI TOORU·Filed 2011·Granted Nov 26, 2013·0 cites·3 claims
- 2849US8501279B2Flexible laminate board, process for manufacturing of the board, and flexible print wiring boardSUZUKI MASAHIKO·Filed 2006·Granted Aug 6, 2013·0 cites·10 claims
- 2949US2013295276A1Method for forming a copper wiring patternHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 3048US8507100B2Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheetTANAKA KENJI·Filed 2010·Granted Aug 13, 2013·0 cites·12 claims
- 3148US2009323300A1Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring BoardFUJIMOTO DAISUKE·Filed 2007·Application pending·0 cites
- 3248US2010233011A1Method for forming a copper wiring pattern, and copper oxide particle dispersed slurry used thereinNAKAKO HIDEO·Filed 2008·Application pending·0 cites
- 3347US9980143B2Communication system, base station, and terminalFUJITSU LTD·Filed 2016·Granted May 22, 2018·0 cites·11 claims
- 3445US8486837B2Polishing slurry for metal, and polishing methodONO HIROSHI·Filed 2008·Granted Jul 16, 2013·0 cites·18 claims
- 3542US2010243303A1Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit memberHITACHI CHEMICAL CO LTD·Filed 2007·Application pending·0 cites
- 3641US5612289A4-imino-oxazolidine-2-one derivatives, a process for producing such derivatives and a herbicide containing them as an active ingredientSAGAMI CHEM RES·Filed 1994·Granted Mar 18, 1997·2 cites·11 claims
- 3739US2012170241A1Printing ink, metal nanoparticles used in the same, wiring, circuit board, and semiconductor packageNAKAKO HIDEO·Filed 2010·Application pending·0 cites
- 3838US2017303096A1Terminal device and communication methodFUJITSU LTD·Filed 2017·Application pending·0 cites
- 3937US2017374673A1Radio device, base station, and terminal deviceFUJITSU LTD·Filed 2017·Application pending·0 cites
- 4036US2017273118A1Base station device for controlling automatic driving,mobile communcation system for controlling automatic driving,and control,method for mobile control system for controlling automatic drivingFUJITSU LTD·Filed 2017·Application pending·0 cites
- 4135US2006143990A1Polishing fluid for metal, and polishing methodONO HIROSHI·Filed 2003·Application pending·0 cites
- 4235US2015281934A1Wireless communication systemFUJITSU LTD·Filed 2015·Application pending·0 cites
- 4334US9386411B2Radio access system, controlling apparatus, and terminal apparatusFUJITSU LTD·Filed 2015·Granted Jul 5, 2016·0 cites·9 claims
- 4421US6090946AProcess for the preparation of 3-(substituted phenyl)-5-alkylidene-1,3-oxazolidine-2,4-dione derivativesSAGAMI CHEM RES·Filed 1996·Granted Jul 18, 2000·0 cites·4 claims
Join the waitlist — get patent alerts
Get an alert when Katsuyuki Masuda files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →