Inventor · disambiguated record
Kazuaki Mawatari
Also filed as: MAWATARI KAZUAKI
15 granted patents·24 pending applications·51 citations·filing 2010–2025
87Inventor score
Top patents by PatentIndex Score
39 records- 0193US8294261B2Protruding TSV tips for enhanced heat dissipation for IC devicesMAWATARI KAZUAKI·Filed 2010·Granted Oct 23, 2012·37 cites·19 claims
- 0285US8757474B2Bonding structure manufacturing method, heating and melting treatment method, and system thereforABE HIDEYUKI·Filed 2011·Granted Jun 24, 2014·7 cites·20 claims
- 0384US11355357B2Semiconductor device and method for producing the semiconductor deviceDENSO CORP·Filed 2020·Granted Jun 7, 2022·2 cites·9 claims
- 0482US9119336B2Bonding structure manufacturing method, heating and melting treatment method, and system thereforABE HIDEYUKI·Filed 2014·Granted Aug 25, 2015·5 cites·5 claims
- 0577US12487137B2Piezoelectric element, piezoelectric device, and method of manufacturing piezoelectric elementDENSO CORP·Filed 2023·Granted Dec 2, 2025·0 cites·14 claims
- 0676US2025052685A1Sensing system and storage medium storing data structure used in sensing systemDENSO CORP·Filed 2024·Application pending·0 cites
- 0771US2025387862A1Tool abnormality detection systemDENSO CORP·Filed 2025·Application pending·0 cites
- 0866US12125813B2Semiconductor device and method for manufacturing sameDENSO CORP·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 0966US11699672B2Semiconductor device and method for manufacturing sameDENSO CORP·Filed 2021·Granted Jul 11, 2023·0 cites·5 claims
- 1066US2025313415A1Conveyance systemDENSO CORP·Filed 2025·Application pending·0 cites
- 1166US2025269482A1Equipment state monitoring systemDENSO CORP·Filed 2025·Application pending·0 cites
- 1265US2024357287A1Sound conversion deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 1364US2024248006A1Abnormal sound detection deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 1464US2024094720A1Facility state monitoring systemDENSO CORP·Filed 2023·Application pending·0 cites
- 1562US2025130287A1Battery evaluation system and battery evaluation methodDENSO CORP·Filed 2024·Application pending·0 cites
- 1662US2025123335A1Charging system and chargerDENSO CORP·Filed 2024·Application pending·0 cites
- 1761US12163894B2Sensing system and storage medium storing data structure used in sensing systemDENSO CORP·Filed 2021·Granted Dec 10, 2024·0 cites·17 claims
- 1861US2024345174A1Battery monitoring device, and battery management unitDENSO CORP·Filed 2024·Application pending·0 cites
- 1961US2024347795A1Battery monitoring device, battery transport apparatus, and battery monitoring methodDENSO CORP·Filed 2024·Application pending·0 cites
- 2061US2024345173A1Battery monitoring device, and battery management systemDENSO CORP·Filed 2024·Application pending·0 cites
- 2161US2022242723A1Physical quantity sensor and semiconductor deviceDENSO CORP·Filed 2022·Application pending·0 cites
- 2261US2024345169A1Battery-monitoring systemDENSO CORP·Filed 2024·Application pending·0 cites
- 2357US12470875B2Piezoelectric element, piezoelectric device, and manufacturing method of piezoelectric elementDENSO CORP·Filed 2023·Granted Nov 11, 2025·0 cites·11 claims
- 2457US2024344921A1Failure sign detection system, failure sign detection method, and non-transitory computer-readable mediumDENSO CORP·Filed 2024·Application pending·0 cites
- 2556US2020407216A1Physical quantity sensor and semiconductor deviceDENSO CORP·Filed 2020·Application pending·0 cites
- 2655US2023363280A1Piezoelectric element, piezoelectric device, and method for manufacturing piezoelectric elementDENSO CORP·Filed 2023·Application pending·0 cites
- 2754US2023341282A1Sensor element and sensor device having sameDENSO CORP·Filed 2023·Application pending·0 cites
- 2853US11565659B2Raindrop recognition device, vehicular control apparatus, method of training model, and trained modelDENSO CORP·Filed 2020·Granted Jan 31, 2023·0 cites·17 claims
- 2950US11027360B2Bonded body and method for manufacturing the sameDENSO CORP·Filed 2019·Granted Jun 8, 2021·0 cites·14 claims
- 3049US11127702B2Semiconductor device and method for manufacturing sameDENSO CORP·Filed 2019·Granted Sep 21, 2021·0 cites·5 claims
- 3148US2019256349A1Physical quantity sensor and semiconductor deviceDENSO CORP·Filed 2019·Application pending·0 cites
- 3246US11183480B2Semiconductor deviceDENSO CORP·Filed 2019·Granted Nov 23, 2021·0 cites·10 claims
- 3346US10983022B2Pressure sensorDENSO CORP·Filed 2019·Granted Apr 20, 2021·0 cites·8 claims
- 3446US2015314385A1Bonding structure manufacturing method, heating and melting treatment method, and system thereforAYUMI INDUSTRY CO LTD·Filed 2015·Application pending·0 cites
- 3545US2022232328A1Piezoelectric element, piezoelectric device, and manufacturing method of piezoelectric elementDENSO CORP·Filed 2022·Application pending·0 cites
- 3640US8587122B2Semiconductor flip-chip system having three-dimensional solder jointsMAWATARI KAZUAKI·Filed 2011·Granted Nov 19, 2013·0 cites·14 claims
- 3737US2013032270A1Thermal compression bonding with separate bond headsTEXAS INSTRUMENTS INC·Filed 2011·Application pending·0 cites
- 3836US2013228916A1Two-solder method for self-aligning solder bumps in semiconductor assemblyMAWATARI KAZUAKI·Filed 2012·Application pending·0 cites
- 3934US2012193778A1Integrated circuit having protruding bonding features with reinforcing dielectric supportsMAWATARI KAZUAKI·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kazuaki Mawatari files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →