Inventor · disambiguated record
Kadthala Ramaya Narendrnath
Also filed as: NARENDRNATH KADTHALA · NARENDRNATH KADTHALA R · NARENDRNATH KADTHALA RAMAYA
45 granted patents·10 pending applications·1,719 citations·filing 1995–2023
98Inventor score
Top patents by PatentIndex Score
55 records- 0198US6280584B1Compliant bond structure for joining ceramic to metalAPPLIED MATERIALS INC·Filed 1998·Granted Aug 28, 2001·167 cites·64 claims
- 0297US9993907B2Printed chemical mechanical polishing pad having printed windowAPPLIED MATERIALS INC·Filed 2014·Granted Jun 12, 2018·38 cites·12 claims
- 0397US6310755B1Electrostatic chuck having gas cavity and methodAPPLIED MATERIALS INC·Filed 1999·Granted Oct 30, 2001·325 cites·38 claims
- 0497US6108189AElectrostatic chuck having improved gas conduitsAPPLIED MATERIALS INC·Filed 1997·Granted Aug 22, 2000·255 cites·64 claims
- 0596US6721162B2Electrostatic chuck having composite dielectric layer and method of manufactureAPPLIED MATERIALS INC·Filed 2002·Granted Apr 13, 2004·76 cites·20 claims
- 0696US6538872B1Electrostatic chuck having heater and methodAPPLIED MATERIALS INC·Filed 2001·Granted Mar 25, 2003·123 cites·18 claims
- 0795US9685356B2Substrate support assembly having metal bonded protective layerAPPLIED MATERIALS INC·Filed 2013·Granted Jun 20, 2017·18 cites·13 claims
- 0895US6481886B1Apparatus for measuring pedestal and substrate temperature in a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 2000·Granted Nov 19, 2002·92 cites·24 claims
- 0994US6490146B2Electrostatic chuck bonded to base with a bond layer and methodAPPLIED MATERIALS INC·Filed 2001·Granted Dec 3, 2002·88 cites·28 claims
- 1094US6414834B1Dielectric covered electrostatic chuckAPPLIED MATERIALS INC·Filed 2000·Granted Jul 2, 2002·56 cites·34 claims
- 1193US9716012B2Methods of selective layer depositionAPPLIED MATERIALS INC·Filed 2014·Granted Jul 25, 2017·15 cites·18 claims
- 1293US9669653B2Electrostatic chuck refurbishmentAPPLIED MATERIALS INC·Filed 2014·Granted Jun 6, 2017·11 cites·20 claims
- 1393US6581275B2Fabricating an electrostatic chuck having plasma resistant gas conduitsAPPLIED MATERIALS INC·Filed 2001·Granted Jun 24, 2003·74 cites·20 claims
- 1489US6440221B2Process chamber having improved temperature controlAPPLIED MATERIALS INC·Filed 1998·Granted Aug 27, 2002·93 cites·40 claims
- 1588US11007619B2Carrier head membrane with regions of different roughnessAPPLIED MATERIALS INC·Filed 2018·Granted May 18, 2021·3 cites·9 claims
- 1687US11738421B2Method of making carrier head membrane with regions of different roughnessAPPLIED MATERIALS INC·Filed 2021·Granted Aug 29, 2023·1 cites·12 claims
- 1787US10056284B2Electrostatic chuck optimized for refurbishmentAPPLIED MATERIALS INC·Filed 2017·Granted Aug 21, 2018·3 cites·20 claims
- 1887US9627231B2Methods for bonding substratesAPPLIED MATERIALS INC·Filed 2013·Granted Apr 18, 2017·7 cites·3 claims
- 1987US8475231B2Carrier head membranePAIK YOUNG J·Filed 2009·Granted Jul 2, 2013·13 cites·16 claims
- 2086US10160093B2Carrier head membrane roughness to control polishing ratePAIK YOUNG J·Filed 2009·Granted Dec 25, 2018·8 cites·20 claims
- 2186US8662957B2Leak proof pad for CMP endpoint detectionPAIK YOUNG J·Filed 2010·Granted Mar 4, 2014·7 cites·12 claims
- 2286US8225927B2Method to substantially enhance shelf life of hygroscopic components and to improve nano-manufacturing process tool availablityNARENDRNATH KADTHALA R·Filed 2010·Granted Jul 24, 2012·9 cites·17 claims
- 2383US12172264B2Carrier head membrane with regions of different roughnessAPPLIED MATERIALS INC·Filed 2023·Granted Dec 24, 2024·0 cites·19 claims
- 2483US11179965B2Electrostatic chuck optimized for refurbishmentAPPLIED MATERIALS INC·Filed 2018·Granted Nov 23, 2021·2 cites·20 claims
- 2583US9613846B2Pad design for electrostatic chuck surfaceAPPLIED MATERIALS INC·Filed 2014·Granted Apr 4, 2017·5 cites·9 claims
- 2683US6462928B1Electrostatic chuck having improved electrical connector and methodAPPLIED MATERIALS INC·Filed 1999·Granted Oct 8, 2002·65 cites·13 claims
- 2783US5700327AMethod for cleaning hollow articles with plasmaPOLAR MATERIALS INC·Filed 1995·Granted Dec 23, 1997·44 cites·24 claims
- 2881US11161218B2Window in thin polishing padAPPLIED MATERIALS INC·Filed 2019·Granted Nov 2, 2021·1 cites·13 claims
- 2981US8464594B2Measuring flow properties of multiple gas nozzles of a gas distributorNARENDRNATH KADTHALA R·Filed 2011·Granted Jun 18, 2013·8 cites·43 claims
- 3081US6490144B1Support for supporting a substrate in a process chamberAPPLIED MATERIALS INC·Filed 1999·Granted Dec 3, 2002·57 cites·65 claims
- 3179US11826875B2Window in thin polishing padAPPLIED MATERIALS INC·Filed 2021·Granted Nov 28, 2023·0 cites·14 claims
- 3277US6370006B1Electrostatic chuck having a plurality of gas inlet channelsAPPLIED MATERIALS INC·Filed 2000·Granted Apr 9, 2002·19 cites·32 claims
- 3375US10213894B2Method of placing window in thin polishing padAPPLIED MATERIALS INC·Filed 2016·Granted Feb 26, 2019·1 cites·1 claims
- 3472US2021245322A1Printing chemical mechanical polishing pad having window or controlled porosityAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 3570US10131126B2Methods for bonding substratesAPPLIED MATERIALS INC·Filed 2017·Granted Nov 20, 2018·1 cites·18 claims
- 3668US10553473B2Edge ring for a substrate processing chamberAPPLIED MATERIALS INC·Filed 2015·Granted Feb 4, 2020·1 cites·20 claims
- 3768US10177014B2Thermal radiation barrier for substrate processing chamber componentsAPPLIED MATERIALS INC·Filed 2013·Granted Jan 8, 2019·2 cites·18 claims
- 3866US6220607B1Thermally conductive conformal mediaAPPLIED MATERIALS INC·Filed 1998·Granted Apr 24, 2001·30 cites·25 claims
- 3963US11417561B2Edge ring for a substrate processing chamberAPPLIED MATERIALS INC·Filed 2020·Granted Aug 16, 2022·0 cites·13 claims
- 4060US2024417854A1Modulating thermal conductivity to control cooling of showerheadLAM RES CORP·Filed 2022·Application pending·0 cites
- 4159US11569069B23D printed chamber components configured for lower film stress and lower operating temperatureAPPLIED MATERIALS INC·Filed 2020·Granted Jan 31, 2023·0 cites·14 claims
- 4255US9202736B2Method for refurbishing an electrostatic chuck with reduced plasma penetration and arcingNARENDRNATH KADTHALA RAMAYA·Filed 2007·Granted Dec 1, 2015·1 cites·15 claims
- 4355US2017345691A1Substrate support assemblyAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 4454US2017271179A1Substrate support assembly having metal bonded protective layerAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 4552US10399202B2Retaining ring for lower wafer defectsAPPLIED MATERIALS INC·Filed 2016·Granted Sep 3, 2019·0 cites·8 claims
- 4651US10777391B23D printed chamber components configured for lower film stress and lower operating temperatureAPPLIED MATERIALS INC·Filed 2016·Granted Sep 15, 2020·0 cites·21 claims
- 4750US10636690B2Laminated top plate of a workpiece carrier in micromechanical and semiconductor processingAPPLIED MATERIALS INC·Filed 2016·Granted Apr 28, 2020·0 cites·18 claims
- 4847US10005025B2Corrosion resistant abatement systemAPPLIED MATERIALS INC·Filed 2015·Granted Jun 26, 2018·0 cites·10 claims
- 4947US2009278081A1Pad properties using nanoparticle additivesAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 5047US2025062149A1Electrostatic chucks with self-sealing gas conduits and/or reduced clogging due to residueLAM RES CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →