Inventor · disambiguated record
Katsuhiko Oyama
Also filed as: OYAMA KATSUHIKO
16 granted patents·7 pending applications·192 citations·filing 1995–2017
92Inventor score
Top patents by PatentIndex Score
23 records- 0194US9406537B2Cover opening/closing apparatus, thermal processing apparatus using the same, and cover opening/closing methodTOKYO ELECTRON LTD·Filed 2013·Granted Aug 2, 2016·18 cites·10 claims
- 0289US7205670B2Semiconductor device and manufacturing method thereforTOSHIBA KK·Filed 2003·Granted Apr 17, 2007·61 cites·17 claims
- 0384US8338287B2Semiconductor device and method for manufacturing the sameMIURA MASAYUKI·Filed 2011·Granted Dec 25, 2012·8 cites·17 claims
- 0480US10096504B2Method for managing atmosphere in storage containerTOKYO ELECTRON LTD·Filed 2014·Granted Oct 9, 2018·5 cites·20 claims
- 0578US7073999B2Receiving container body for object to be processedTOKYO ELECTRON LTD·Filed 2003·Granted Jul 11, 2006·22 cites·9 claims
- 0671US7905700B2Vertical-type heat processing apparatus and method of controlling transfer mechanism in vertical-type heat processing apparatusTOKYO ELECTRON LTD·Filed 2007·Granted Mar 15, 2011·4 cites·8 claims
- 0766US5677246AMethod of manufacturing semiconductor devicesTOSHIBA KK·Filed 1995·Granted Oct 14, 1997·38 cites·22 claims
- 0856US6429372B1Semiconductor device of surface mounting type and method for fabricating the sameTOSHIBA KK·Filed 1999·Granted Aug 6, 2002·26 cites·34 claims
- 0955US9368384B2Substrate conveying method, recording medium in which program is recorded for causing substrate conveying method to be executed, and substrate conveyorYAMAGISHI DAISUKE·Filed 2012·Granted Jun 14, 2016·1 cites·8 claims
- 1054US6617678B2Semiconductor deviceTOSHIBA KK·Filed 2002·Granted Sep 9, 2003·6 cites·30 claims
- 1152US10428425B2Film deposition apparatus, method of depositing film, and non-transitory computer-readable recording mediumTOKYO ELECTRON LTD·Filed 2017·Granted Oct 1, 2019·0 cites·20 claims
- 1248US6861738B2Laminated-chip semiconductor deviceTOSHIBA KK·Filed 2002·Granted Mar 1, 2005·3 cites·20 claims
- 1347US9202768B2Semiconductor moduleTOSHIBA KK·Filed 2013·Granted Dec 1, 2015·0 cites·19 claims
- 1447US2017241018A1Film deposition apparatus, film deposition method and computer readable mediumTOKYO ELECTRON LTD·Filed 2017·Application pending·0 cites
- 1545US9679794B2Spacer, spacer transferring method, processing method and processing apparatusTOKYO ELECTRON LTD·Filed 2013·Granted Jun 13, 2017·0 cites·4 claims
- 1643US2014086712A1Transportng apparatus and processing apparatusTOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
- 1741US2006270118A1Surface mount type semiconductor device and method of manufacturing the sameOKURA HIROYUKI·Filed 2006·Application pending·0 cites
- 1841US2007238062A1Vertical-type heat processing apparatus and method of controlling transfer mechanism in vertical-type heat processing apparatusASARI SATOSHI·Filed 2007·Application pending·0 cites
- 1938US2008056861A1Processing apparatus and processing methodTAKAHASHI KIICHI·Filed 2007·Application pending·0 cites
- 2036US9136152B2Substrate transport apparatus, substrate transport method, and recording mediumOYAMA KATSUHIKO·Filed 2012·Granted Sep 15, 2015·0 cites·7 claims
- 2135US9048273B2Substrate conveying container opening/closing device, lid opening/closing device and semiconductor manufacturing apparatusOYAMA KATSUHIKO·Filed 2012·Granted Jun 2, 2015·0 cites·8 claims
- 2234US2007110548A1Processing apparatusOYAMA KATSUHIKO·Filed 2004·Application pending·0 cites
- 2333US2015214080A1Substrate heat treatment apparatus, method of installing substrate heat treatment apparatusTOKYO ELECTRON LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →