Inventor · disambiguated record
Kai-Ming Yang
Also filed as: YANG KAI · YANG KAI-MING
45 granted patents·16 pending applications·111 citations·filing 1996–2024
96Inventor score
Files withUNIMICRON TECHNOLOGY CORP48ADNANOTEK CORP2UNIMICRON TECH CORPORATION2HTC CORP1JIANGSU CONTEMPORARY AMPEREX TECH LTD1
Top patents by PatentIndex Score
61 records- 0195US11516910B1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Nov 29, 2022·4 cites·10 claims
- 0285US11943877B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Mar 26, 2024·1 cites·6 claims
- 0385US5765665ABrake assembly for simultaneously holding a pair of wheelsFiled 1996·Granted Jun 16, 1998·67 cites·12 claims
- 0482US11541493B2Multi-axis mechanism deviceADNANOTEK CORP·Filed 2019·Granted Jan 3, 2023·2 cites·10 claims
- 0580US9906715B2Electronic device and method for increasing a frame rate of a plurality of pictures photographed by an electronic deviceHTC CORP·Filed 2015·Granted Feb 27, 2018·3 cites·18 claims
- 0678US11445617B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Sep 13, 2022·2 cites·13 claims
- 0777US10993332B2Circuit substrateUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Apr 27, 2021·1 cites·8 claims
- 0874US11127664B2Circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Sep 21, 2021·2 cites·10 claims
- 0972US12266616B2Integrated circuit package structureUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Apr 1, 2025·0 cites·4 claims
- 1071US10658282B2Package substrate structure and bonding method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted May 19, 2020·1 cites·7 claims
- 1168US12504591B2Co-packaged structure for optics and electricsUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Dec 23, 2025·0 cites·13 claims
- 1267US12414243B2Manufacturing method of package structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Sep 9, 2025·0 cites·10 claims
- 1366US11637047B2Manufacturing method of chip package structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Apr 25, 2023·0 cites·11 claims
- 1462US11462452B2Chip package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Oct 4, 2022·0 cites·10 claims
- 1562US6711760B1Self-lock hub unit of lower frame of a foldable playyardMISSION HILLS INVEST CORP·Filed 2002·Granted Mar 30, 2004·23 cites·18 claims
- 1661US2025323232A1Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1761US2025149426A1Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1861US2024248264A1Package structureUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1959US11895780B2Manufacturing method of package structureUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Feb 6, 2024·0 cites·5 claims
- 2059US11824012B2Integrated circuit package structure and method of manufacturing the sameUNIMICRON TECH CORPORATION·Filed 2020·Granted Nov 21, 2023·0 cites·7 claims
- 2159US2025331101A1Collapse-free circuit structure with low capacitance effectUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2258US12255279B2Light-emitting diode package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Mar 18, 2025·0 cites·5 claims
- 2357US11523503B2Wiring board and method of forming hole thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Dec 6, 2022·0 cites·12 claims
- 2457US11013103B2Method for forming circuit board stacked structureUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted May 18, 2021·0 cites·6 claims
- 2557US10588214B2Stacked structure and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Mar 10, 2020·0 cites·12 claims
- 2657US2024413067A1Electronic package module and method for fabrication of the sameUNIMICRON TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 2756US12218017B2Glass carrier having protection structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Feb 4, 2025·0 cites·5 claims
- 2856US12160953B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Dec 3, 2024·0 cites·19 claims
- 2956US2025331108A1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 3055US11697594B2Method for recycling spent carbon cathode of aluminum electrolysisUNIV CENTRAL SOUTH·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
- 3155US11424216B2Electronic device bonding structure and fabrication method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Aug 23, 2022·0 cites·8 claims
- 3255US10178755B2Circuit board stacked structure and method for forming the sameUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Jan 8, 2019·0 cites·8 claims
- 3354US7931517B2LED-based white-light lighting module for preventing glare and providing adjustable color temperatureYANG JOE·Filed 2009·Granted Apr 26, 2011·5 cites·15 claims
- 3453US2024251504A1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 3552US11764344B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Sep 19, 2023·0 cites·20 claims
- 3652US11410933B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Aug 9, 2022·0 cites·10 claims
- 3752US2023335419A1Etching device and etching methodUNIMICRON TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 3851US12369250B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Jul 22, 2025·0 cites·16 claims
- 3950US12438060B2Chip package and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Oct 7, 2025·0 cites·14 claims
- 4050US2023178520A1Light-emitting diode package and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 4150US2010254126A1LED-based lighting module for emitting white light with easily adjustable color temperatureYANG KAI-MING·Filed 2009·Application pending·0 cites
- 4249US11710690B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 4348US11764120B2Chip packaging structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Sep 19, 2023·0 cites·4 claims
- 4448US11682612B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Jun 20, 2023·0 cites·8 claims
- 4548US11665832B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted May 30, 2023·0 cites·6 claims
- 4648US11219130B2Circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jan 4, 2022·0 cites·9 claims
- 4748US10756050B2Package structure and bonding method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Aug 25, 2020·0 cites·10 claims
- 4848US2022069489A1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 4948US2022328387A1Package carrier and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 5047US10897823B2Circuit board, package structure and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jan 19, 2021·0 cites·8 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →