Inventor · disambiguated record
Kai-Hung Yu
Also filed as: YU KAI · YU KAI-HUNG
45 granted patents·21 pending applications·224 citations·filing 1998–2025
97Inventor score
Files withTOKYO ELECTRON LTD44GOOGLE LLC4PERICOM SEMICONDUCTOR CORP3BEIJING HORIZON ROBOTICS TECH RES & DEVELOPMENT CO LTD2JUNENG INDUSTRY CO LTD2
Top patents by PatentIndex Score
66 records- 0197US11456212B2Platform and method of operating for integrated end-to-end fully self-aligned interconnect processTOKYO ELECTRON LTD·Filed 2020·Granted Sep 27, 2022·4 cites·7 claims
- 0296US10770479B2Three-dimensional device and method of forming the sameTOKYO ELECTRON LTD·Filed 2019·Granted Sep 8, 2020·20 cites·20 claims
- 0396US10027332B1Referenceless clock and data recovery circuitsPERICOM SEMICONDUCTOR CORP·Filed 2017·Granted Jul 17, 2018·18 cites·20 claims
- 0494US10498523B1Multipath clock and data recoveryDIODES INC·Filed 2018·Granted Dec 3, 2019·15 cites·22 claims
- 0594US10378105B2Selective deposition with surface treatmentTOKYO ELECTRON LTD·Filed 2017·Granted Aug 13, 2019·12 cites·5 claims
- 0693US10425124B1Repeaters with fast transitions from low-power standby to low-frequency signal transmissionPERICOM SEMICONDUCTOR CORP·Filed 2018·Granted Sep 24, 2019·15 cites·23 claims
- 0792US10861744B2Platform and method of operating for integrated end-to-end CMP-less interconnect processTOKYO ELECTRON LTD·Filed 2019·Granted Dec 8, 2020·7 cites·18 claims
- 0888US11024535B2Method for filling recessed features in semiconductor devices with a low-resistivity metalTOKYO ELECTRON LTD·Filed 2019·Granted Jun 1, 2021·4 cites·19 claims
- 0985US12346386B2Visual and audio multimodal searching systemGOOGLE LLC·Filed 2023·Granted Jul 1, 2025·1 cites·20 claims
- 1084US11515203B2Selective deposition of conductive cap for fully-aligned-via (FAV)TOKYO ELECTRON LTD·Filed 2020·Granted Nov 29, 2022·2 cites·20 claims
- 1184US10014213B2Selective bottom-up metal feature filling for interconnectsTOKYO ELECTRON LTD·Filed 2016·Granted Jul 3, 2018·4 cites·16 claims
- 1283US10886173B2Platform and method of operating for integrated end-to-end fully self-aligned interconnect processTOKYO ELECTRON LTD·Filed 2019·Granted Jan 5, 2021·2 cites·16 claims
- 1382US10157784B2Integration of a self-forming barrier layer and a ruthenium metal liner in copper metallizationTOKYO ELECTRON LTD·Filed 2017·Granted Dec 18, 2018·4 cites·18 claims
- 1481US12321401B1Multimodal query predictionGOOGLE LLC·Filed 2024·Granted Jun 3, 2025·1 cites·20 claims
- 1580US6548687B1Chromium L-threonate, process for preparation of the same and their useFiled 1999·Granted Apr 15, 2003·25 cites·4 claims
- 1679US6727288B2Method for treating bone fractureJUNENG INDUSTRY CO LTD·Filed 2001·Granted Apr 27, 2004·21 cites·6 claims
- 1777US9408556B2Integrated analysis device for simultaneously detecting EBCs and VOCs in human exhaled breathWANG PING·Filed 2010·Granted Aug 9, 2016·11 cites·8 claims
- 1876US10291241B2Referenceless clock and data recovery circuitsPERICOM SEMICONDUCTOR CORP·Filed 2018·Granted May 14, 2019·2 cites·24 claims
- 1974US11594451B2Platform and method of operating for integrated end-to-end fully self-aligned interconnect processTOKYO ELECTRON LTD·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
- 2074US9607888B2Integration of ALD barrier layer and CVD Ru liner for void-free Cu fillingTOKYO ELECTRON LTD·Filed 2015·Granted Mar 28, 2017·2 cites·20 claims
- 2173US10056328B2Ruthenium metal feature fill for interconnectsTOKYO ELECTRON LTD·Filed 2017·Granted Aug 21, 2018·1 cites·19 claims
- 2273US2025291862A1Visual and Audio Multimodal Searching SystemGOOGLE LLC·Filed 2025·Application pending·0 cites
- 2372US10923392B2Interconnect structure and method of forming the sameTOKYO ELECTRON LTD·Filed 2019·Granted Feb 16, 2021·1 cites·11 claims
- 2472US9425093B2Copper wiring forming method, film forming system, and storage mediumTOKYO ELECTRON LTD·Filed 2014·Granted Aug 23, 2016·2 cites·11 claims
- 2570US10950444B2Metal hard mask layers for processing of microelectronic workpiecesTOKYO ELECTRON LTD·Filed 2019·Granted Mar 16, 2021·1 cites·21 claims
- 2670US9711449B2Ruthenium metal feature fill for interconnectsTOKYO ELECTRON LTD·Filed 2016·Granted Jul 18, 2017·1 cites·20 claims
- 2769US10580691B2Method of integrated circuit fabrication with dual metal power railTOKYO ELECTRON LTD·Filed 2018·Granted Mar 3, 2020·1 cites·19 claims
- 2864US11621190B2Method for filling recessed features in semiconductor devices with a low-resistivity metalTOKYO ELECTRON LTD·Filed 2021·Granted Apr 4, 2023·0 cites·20 claims
- 2963US12482667B2Thermal etching of rutheniumTOKYO ELECTRON LTD·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 3063US10923394B2Platform and method of operating for integrated end-to-end fully self-aligned interconnect processTOKYO ELECTRON LTD·Filed 2019·Granted Feb 16, 2021·0 cites·8 claims
- 3162US12417925B2Method of conductive material depositionTOKYO ELECTRON LTD·Filed 2022·Granted Sep 16, 2025·0 cites·20 claims
- 3262US6713513B2Method for treating cartilage related diseasesJUNENG INDUSTRY CO LTD·Filed 2001·Granted Mar 30, 2004·3 cites·9 claims
- 3362US6313170B1L-threonate ferrous, as well as pharmaceutical composition and use for improving and treating human anemia thereofFiled 1998·Granted Nov 6, 2001·26 cites·12 claims
- 3461US2025256703A1Method and apparatus for activating esc of intelligent driving vehicleSHENZHEN YINWANG INTELLIGENT TECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 3560US12508907B2Method and apparatus for displaying window, medium and in-vehicle infotainment terminalXIAOMI EV TECH CO LTD·Filed 2024·Granted Dec 30, 2025·0 cites·20 claims
- 3659US12341009B2Variable hardness amorphous carbon maskTOKYO ELECTRON LTD·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 3758US2025308931A1Method for removing metal-containing materials in small pitch structuresTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 3857US6077872AUse of calcium L-threonate in preventing, inhibiting and curing osteoporosis and ricketsBEIJING JUENG ASIA PACIFIC LIF·Filed 1998·Granted Jun 20, 2000·18 cites·4 claims
- 3957US2025154643A1Area selective deposition of metals for electronic devicesTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 4056US2024363410A1Methods for making semiconductor devices that include metal cap layersTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 4156US2024213093A1Catalyst-enhanced chemical vapor depositionTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 4255US12237216B2Method for filling recessed features in semiconductor devices with a low-resistivity metalTOKYO ELECTRON LTD·Filed 2022·Granted Feb 25, 2025·0 cites·21 claims
- 4354US2023411142A1Metal oxide precleaning prior to metal fillingTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 4454US2025303323A1Multi-mode anti-matrix extraction columnHUNAN DEMETER INSTR CO LTD·Filed 2023·Application pending·0 cites
- 4554US2025379101A1Surface passivation for achieving controllable queue time for post-planarization processTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 4653US11450562B2Method of bottom-up metallization in a recessed featureTOKYO ELECTRON LTD·Filed 2020·Granted Sep 20, 2022·0 cites·19 claims
- 4753US2024339217A1Medical Condition Visual SearchGOOGLE LLC·Filed 2024·Application pending·0 cites
- 4852US10541174B2Interconnect structure and method of forming the sameTOKYO ELECTRON LTD·Filed 2018·Granted Jan 21, 2020·0 cites·9 claims
- 4952US2024087891A1Method for Processing a SubstrateTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 5052US2025105059A1Method of via fillingTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →