Inventor · disambiguated record
Kenneth B. Gilleo
Also filed as: GILLEO KENNETH B · GILLEO KENNETH BURTON
25 granted patents·8 pending applications·1,622 citations·filing 1973–2005
97Inventor score
Top patents by PatentIndex Score
33 records- 0196US5971253AMicroelectronic component mounting with deformable shell terminalsTESSERA INC·Filed 1996·Granted Oct 26, 1999·196 cites·19 claims
- 0294US6020220ACompliant semiconductor chip assemblies and methods of making sameTESSERA INC·Filed 1996·Granted Feb 1, 2000·147 cites·17 claims
- 0393US5477611AMethod of forming interface between die and chip carrierTESSERA INC·Filed 1993·Granted Dec 26, 1995·164 cites·39 claims
- 0492US5502889AMethod for electrically and mechanically connecting at least two conductive layersSHELDAHL INC·Filed 1993·Granted Apr 2, 1996·175 cites·32 claims
- 0591US6228678B1Flip chip with integrated mask and underfillFRY METALS INC·Filed 1999·Granted May 8, 2001·138 cites·15 claims
- 0688US6204455B1Microelectronic component mounting with deformable shell terminalsTESSERA INC·Filed 1999·Granted Mar 20, 2001·80 cites·20 claims
- 0788US5688584AMultilayer electronic circuit having a conductive adhesiveSHELDAHL INC·Filed 1995·Granted Nov 18, 1997·114 cites·18 claims
- 0887US5637176AMethods for producing ordered Z-axis adhesive materials, materials so produced, and devices, incorporating such materialsFRY METALS INC·Filed 1994·Granted Jun 10, 1997·77 cites·11 claims
- 0986US6228681B1Flip chip having integral mask and underfill providing two-stage bump formationFRY METALS INC·Filed 1999·Granted May 8, 2001·82 cites·23 claims
- 1086US6194788B1Flip chip with integrated flux and underfillALPHA METALS·Filed 1999·Granted Feb 27, 2001·77 cites·9 claims
- 1186US5727310AMethod of manufacturing a multilayer electronic circuitSHELDAHL INC·Filed 1996·Granted Mar 17, 1998·77 cites·28 claims
- 1285US6252301B1Compliant semiconductor chip assemblies and methods of making sameTESSERA INC·Filed 1999·Granted Jun 26, 2001·67 cites·17 claims
- 1384US6936644B2Releasable microcapsule and adhesive curing system using the sameCOOKSON ELECTRONICS INC·Filed 2002·Granted Aug 30, 2005·39 cites·42 claims
- 1474US4409264ABoss formation using low surface energy damsNORTHERN ENGRAVING CORP·Filed 1981·Granted Oct 11, 1983·19 cites·22 claims
- 1571US4747968ALow temperature cure having single component conductive adhesiveSHELDAHL INC·Filed 1987·Granted May 31, 1988·30 cites·4 claims
- 1666US4747211AMethod and apparatus for preparing conductive screened through holes employing metallic plated polymer thick filmsSHELDAHL INC·Filed 1987·Granted May 31, 1988·29 cites·20 claims
- 1763US3943100ANylon flame retardants based on certain organic acidsALLIED CHEM·Filed 1973·Granted Mar 9, 1976·9 cites·5 claims
- 1860US6863447B2Photon-conducting media alignment using a thermokinetic materialFRY METALS INC·Filed 2002·Granted Mar 8, 2005·6 cites·34 claims
- 1957US6323062B1Wafer coating method for flip chipsALPHA METALS·Filed 1999·Granted Nov 27, 2001·27 cites·14 claims
- 2057US5531942AMethod of making electroconductive adhesive particles for Z-axis applicationFRY METALS INC·Filed 1994·Granted Jul 2, 1996·27 cites·14 claims
- 2152US6838372B2Via interconnect forming process and electronic component product thereofCOOKSON ELECTRONICS INC·Filed 2002·Granted Jan 4, 2005·5 cites·67 claims
- 2245US3956236ASynergistic compositions for increasing flame resistance of polymersALLIED CHEM·Filed 1974·Granted May 11, 1976·4 cites·9 claims
- 2343US6067709AApplying encapsulating material to substratesMPM CORP·Filed 1996·Granted May 30, 2000·18 cites·5 claims
- 2443US2005012191A1Reconnectable chip interface and chip packageCOOKSON ELECTRONICS INC·Filed 2004·Application pending·0 cites
- 2541US2005012212A1Reconnectable chip interface and chip packageCOOKSON ELECTRONICS INC·Filed 2003·Application pending·0 cites
- 2641US2006012020A1Wafer-level assembly method for semiconductor devicesGILLEO KENNETH B·Filed 2005·Application pending·0 cites
- 2739US2001017414A1Flip chip with integrated mask and underfillFiled 2001·Application pending·0 cites
- 2839US2005056946A1Electrical circuit assembly with improved shock resistanceCOOKSON ELECTRONICS INC·Filed 2003·Application pending·0 cites
- 2937US2001003058A1Flip chip with integrated flux and underfillFiled 2000·Application pending·0 cites
- 3037US2004108588A1Package for microchipsCOOKSON ELECTRONICS INC·Filed 2003·Application pending·0 cites
- 3136US4353858AMethod for forming a boss upon a thermoplastic polymer surface and resulting articleNORTHERN ENGRAVING CORP·Filed 1980·Granted Oct 12, 1982·10 cites·19 claims
- 3236US2004163717A1MEMS device assemblyCOOKSON ELECTRONICS INC·Filed 2003·Application pending·0 cites
- 3334US4468425ABoss formation using low surface energy damsNORTHERN ENGRAVING CORP·Filed 1982·Granted Aug 28, 1984·5 cites·7 claims
Join the waitlist — get patent alerts
Get an alert when Kenneth B. Gilleo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →