Inventor · disambiguated record
Kensuke Ishikawa
Also filed as: ISHIKAWA KENSUKE
24 granted patents·2 pending applications·144 citations·filing 2002–2024
95Inventor score
Files withRENESAS ELECTRONICS CORP11RENESAS TECH CORP7SANDISK TECHNOLOGIES LLC6HONDA MOTOR CO LTD1NOGUCHI JUNJI1
Top patents by PatentIndex Score
26 records- 0196US10115735B2Semiconductor device containing multilayer titanium nitride diffusion barrier and method of making thereofSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Oct 30, 2018·24 cites·9 claims
- 0295US11935784B2Three-dimensional memory device containing self-aligned bit line contacts and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Mar 19, 2024·4 cites·20 claims
- 0393US9064870B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 23, 2015·7 cites·15 claims
- 0490US7323781B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2004·Granted Jan 29, 2008·30 cites·24 claims
- 0589US9659867B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2016·Granted May 23, 2017·2 cites·4 claims
- 0689US6838772B2Semiconductor deviceRENESAS TECH CORP·Filed 2003·Granted Jan 4, 2005·47 cites·21 claims
- 0788US8617981B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted Dec 31, 2013·4 cites·12 claims
- 0887US8431480B2Semiconductor device and manufacturing method thereofNOGUCHI JUNJI·Filed 2011·Granted Apr 30, 2013·4 cites·12 claims
- 0984US8053893B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2009·Granted Nov 8, 2011·6 cites·14 claims
- 1079US7459786B2Semiconductor deviceRENESAS TECH CORP·Filed 2005·Granted Dec 2, 2008·9 cites·10 claims
- 1177US8810034B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted Aug 19, 2014·1 cites·9 claims
- 1275US10304726B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2018·Granted May 28, 2019·0 cites·11 claims
- 1375US2019244855A1Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 1473US7777343B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2006·Granted Aug 17, 2010·2 cites·6 claims
- 1572US10121693B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 6, 2018·0 cites·11 claims
- 1670US9818639B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 14, 2017·0 cites·4 claims
- 1766US9490213B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 8, 2016·0 cites·8 claims
- 1860US12451451B2Bonded assembly including interconnect-level bonding pads and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 1960US7777346B2Semiconductor integrated circuit device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2008·Granted Aug 17, 2010·1 cites·12 claims
- 2059US12456699B2Semiconductor devices containing copper bonding pads with different conductive barrier layers and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Oct 28, 2025·0 cites·10 claims
- 2159US2025285887A1Method of making a semiconductor device using an edge bevel removal system containing a gas nozzleSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 2258US9779312B2Environment recognition systemHONDA MOTOR CO LTD·Filed 2016·Granted Oct 3, 2017·1 cites·7 claims
- 2351US12087626B2High aspect ratio via fill process employing selective metal deposition and structures formed by the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Sep 10, 2024·0 cites·19 claims
- 2449US7569476B2Semiconductor integrated circuit device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Aug 4, 2009·0 cites·12 claims
- 2547US7018919B2Method of manufacturing a semiconductor integrated circuit device including a hole formed in an insulating film and a first conductive film formed over a bottom region and sidewalls of the holeRENESAS TECH CORP·Filed 2002·Granted Mar 28, 2006·2 cites·18 claims
- 2639US7095120B2Semiconductor integrated circuit device with a connective portion for multilevel interconnectionRENESAS TECH CORP·Filed 2002·Granted Aug 22, 2006·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →