Inventor · disambiguated record
Kenji Kameda
Also filed as: KAMEDA KENJI
31 granted patents·13 pending applications·109 citations·filing 2000–2023
95Inventor score
Files withHITACHI INT ELECTRIC INC17KOKUSAI ELECTRIC CORP8KAMEDA KENJI4SONY CORP4JAPAN AVIATION ELECTRONICS IND LTD3
Top patents by PatentIndex Score
44 records- 0190US9028648B1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted May 12, 2015·9 cites·18 claims
- 0288US10156012B2Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and a non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Dec 18, 2018·3 cites·15 claims
- 0384US8895457B2Method of manufacturing semiconductor device and substrate processing apparatusAKAE NAONORI·Filed 2011·Granted Nov 25, 2014·7 cites·20 claims
- 0481US7612777B2Animation generating apparatus, animation generating method, and animation generating programSONY CORP·Filed 2005·Granted Nov 3, 2009·13 cites·20 claims
- 0580US10153153B2Method for removing adhering matter and dry etching methodCENTRAL GLASS CO LTD·Filed 2017·Granted Dec 11, 2018·3 cites·21 claims
- 0679US8741783B2Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus and recording mediumKAMEDA KENJI·Filed 2012·Granted Jun 3, 2014·5 cites·17 claims
- 0778US8115764B2Map display system, map data processing apparatus, map display apparatus, and map display methodKAMEDA KENJI·Filed 2004·Granted Feb 14, 2012·32 cites·26 claims
- 0876US9856560B2Method for manufacturing semiconductor device and substrate processing apparatusKAMEDA KENJI·Filed 2009·Granted Jan 2, 2018·2 cites·19 claims
- 0973US9587308B2Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Mar 7, 2017·2 cites·16 claims
- 1071US2023343580A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1169US8679989B2Method of manufacturing semiconductor device including removal of deposits from process chamber and supply portionNAKASHIMA SADAO·Filed 2007·Granted Mar 25, 2014·2 cites·20 claims
- 1268US7047021B2Communication systemSONY CORP·Filed 2003·Granted May 16, 2006·11 cites·6 claims
- 1367US8679259B2Substrate processing apparatus, method of manufacturing semiconductor device and method of cleaning processing vesselKAMEDA KENJI·Filed 2011·Granted Mar 25, 2014·2 cites·8 claims
- 1466US9540727B2Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Jan 10, 2017·2 cites·14 claims
- 1565US2009149032A1Method for manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
- 1663US10724137B2Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, recording medium, and cleaning completion determining methodHITACHI INT ELECTRIC INC·Filed 2014·Granted Jul 28, 2020·1 cites·16 claims
- 1762US9683288B2Method of manufacturing semiconductor device and method of cleaning processing vesselHITACHI INT ELECTRIC INC·Filed 2014·Granted Jun 20, 2017·1 cites·10 claims
- 1860US10998647B2Harness with a wire terminalJAPAN AVIATION ELECTRONICS IND LTD·Filed 2018·Granted May 4, 2021·1 cites·9 claims
- 1959US8043438B2Device for cleaning CVD device and method of cleaning CVD deviceNAT INST OF ADVANCED IND SCIEN·Filed 2004·Granted Oct 25, 2011·4 cites·1 claims
- 2057US11735412B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Aug 22, 2023·0 cites·18 claims
- 2157US11616334B2Method of manufacturing cable assembly, horn chip used in the method and cable assembly manufactured by the methodJAPAN AVIATION ELECTRONICS IND LTD·Filed 2021·Granted Mar 28, 2023·0 cites·8 claims
- 2257US7177482B2Boundary line detection apparatus and method, and image processing apparatus and method as well as recording mediumSONY CORP·Filed 2000·Granted Feb 13, 2007·7 cites·6 claims
- 2354US11094532B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 17, 2021·0 cites·15 claims
- 2453US12053805B2Method of cleaning member in process container, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Aug 6, 2024·0 cites·21 claims
- 2549US10804100B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 13, 2020·0 cites·14 claims
- 2648US11705326B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Jul 18, 2023·0 cites·18 claims
- 2747US10968517B2Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Apr 6, 2021·0 cites·13 claims
- 2847US2006143266A1Communication systemSONY CORP·Filed 2006·Application pending·0 cites
- 2946US2008268644A1Manufacturing method of semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
- 3045US11515152B2Method of manufacturing semiconductor device, substrate processing apparatus, and method of processing substrateKOKUSAI ELECTRIC CORP·Filed 2020·Granted Nov 29, 2022·0 cites·16 claims
- 3145US10176988B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Jan 8, 2019·0 cites·14 claims
- 3245US9976214B2Cleaning method and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted May 22, 2018·0 cites·17 claims
- 3345US2016218012A1Method of forming fine pattern, method of manufacturing semiconductor device, substrate processing apparatus and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Application pending·0 cites
- 3445US2015275357A1Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
- 3545US2015031216A1Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Application pending·0 cites
- 3643US11398686B2Wire, wire with terminal, harness, manufacturing method for wire, and manufacturing method for wire with terminalJAPAN AVIATION ELECTRONICS IND LTD·Filed 2019·Granted Jul 26, 2022·0 cites·19 claims
- 3741US8277560B2CVD apparatus and method of cleaning the CVD apparatusSAKAI KATSUO·Filed 2003·Granted Oct 2, 2012·2 cites·6 claims
- 3841US2016211151A1Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2013·Application pending·0 cites
- 3940US2005252451A1Cvd apparatus having means for cleaning with fluorine gas and method of cleaning cvd apparatus with fluorine gasBEPPU TATSURO·Filed 2003·Application pending·0 cites
- 4039US2019127848A1Processing Method, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2018·Application pending·0 cites
- 4138US2006201533A1Cvd apparatus and method for cleaning cvd apparatusRES INST OF INNOVATIVE TECH FO·Filed 2004·Application pending·0 cites
- 4236US11001923B2Method of manufacturing semiconductor device and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted May 11, 2021·0 cites·16 claims
- 4335US2004255854A1Cvd apparatus and method of cleaning the cvd apparatusFiled 2003·Application pending·0 cites
- 4434US2016155630A1Substrate processing apparatus, method for manufacturing semiconductor device, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kenji Kameda files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →