Inventor · disambiguated record
Kentaro Kaneko
Also filed as: KANEKO KENTARO
53 granted patents·19 pending applications·267 citations·filing 2007–2025
98Inventor score
Top patents by PatentIndex Score
72 records- 0193US9210808B2Wiring substrate and method of manufacturing the sameKANEKO KENTARO·Filed 2012·Granted Dec 8, 2015·17 cites·18 claims
- 0293US7915088B2Wiring board manufacturing method, semiconductor device manufacturing method and wiring boardSHINKO ELECTRIC IND CO·Filed 2008·Granted Mar 29, 2011·25 cites·4 claims
- 0392USD996502SIndustrial cameraKOWA CO·Filed 2021·Granted Aug 22, 2023·15 cites·1 claims
- 0492US8797757B2Wiring substrate and manufacturing method thereofKANEKO KENTARO·Filed 2012·Granted Aug 5, 2014·16 cites·5 claims
- 0592US8357860B2Wiring board having a connecting pad area which is smaller than a surface plating layer areaSHINKO ELECTRIC IND CO·Filed 2008·Granted Jan 22, 2013·20 cites·18 claims
- 0692US8237270B2Wiring board manufacturing method, semiconductor device manufacturing method and wiring boardKOBAYASHI KAZUHIRO·Filed 2011·Granted Aug 7, 2012·11 cites·4 claims
- 0789US11756866B2Lead frame and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2021·Granted Sep 12, 2023·2 cites·20 claims
- 0889US9711590B2Semiconductor device, or crystalFLOSFIA INC·Filed 2013·Granted Jul 18, 2017·8 cites·20 claims
- 0989US8067695B2Wiring board and method of manufacturing the sameKANEKO KENTARO·Filed 2009·Granted Nov 29, 2011·18 cites·6 claims
- 1087US10580648B2Semiconductor device and method of manufacturing semiconductor deviceFLOSFIA INC·Filed 2018·Granted Mar 3, 2020·5 cites·18 claims
- 1186USD1022002SIndustrial cameraKOWA CO·Filed 2022·Granted Apr 9, 2024·9 cites·1 claims
- 1286US9313904B2Wiring board and method of manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2014·Granted Apr 12, 2016·8 cites·6 claims
- 1385US8225502B2Wiring board manufacturing methodKANEKO KENTARO·Filed 2008·Granted Jul 24, 2012·13 cites·15 claims
- 1483USD1016875SIndustrial cameraKOWA CO·Filed 2022·Granted Mar 5, 2024·12 cites·1 claims
- 1582USD978225SLens cover for cameraKOWA CO·Filed 2021·Granted Feb 14, 2023·12 cites·1 claims
- 1680US8810040B2Wiring substrate including projecting part having electrode pad formed thereonSHINKO ELECTRIC IND CO·Filed 2012·Granted Aug 19, 2014·5 cites·9 claims
- 1780US7954234B2Method of manufacturing a wiring boardSHINKO ELECTRIC IND CO·Filed 2008·Granted Jun 7, 2011·10 cites·6 claims
- 1879US10201917B2Lead frameSHINKO ELECTRIC IND CO·Filed 2018·Granted Feb 12, 2019·3 cites·5 claims
- 1979US7582551B2Wiring substrate and wiring substrate manufacturing methodSHINKO ELECTRIC IND CO·Filed 2008·Granted Sep 1, 2009·8 cites·5 claims
- 2078US9538664B2Wiring substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted Jan 3, 2017·5 cites·4 claims
- 2178US9253897B2Wiring substrate and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2014·Granted Feb 2, 2016·3 cites·14 claims
- 2278US9247644B2Wiring board and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2014·Granted Jan 26, 2016·4 cites·10 claims
- 2378US8754336B2Wiring board and method of producing the sameKANEKO KENTARO·Filed 2012·Granted Jun 17, 2014·4 cites·15 claims
- 2477US8399779B2Wiring board and method of manufacturing the sameOGAWA MICHIRO·Filed 2009·Granted Mar 19, 2013·8 cites·9 claims
- 2574US9258899B2Method of fabricating a wiring boardSHINKO ELECTRIC IND CO·Filed 2012·Granted Feb 9, 2016·2 cites·11 claims
- 2673US9433109B2Wiring substrate and semiconductor packageSHINKO ELECTRIC IND CO·Filed 2014·Granted Aug 30, 2016·2 cites·7 claims
- 2773US8183467B2Wiring board and method of producing the sameKANEKO KENTARO·Filed 2009·Granted May 22, 2012·4 cites·18 claims
- 2872US11916103B2P-type oxide semiconductor and method for manufacturing sameFLOSFIA INC·Filed 2022·Granted Feb 27, 2024·0 cites·9 claims
- 2972US11152208B2Semiconductor film, method of forming semiconductor film, complex compound for doping, and method of dopingFLOSFIA INC·Filed 2017·Granted Oct 19, 2021·1 cites·22 claims
- 3072US9089041B2Method of fabricating a wiring boardSHINKO ELECTRIC IND CO·Filed 2013·Granted Jul 21, 2015·2 cites·6 claims
- 3171US9236334B2Wiring substrate and method for manufacturing wiring substratesKANEKO KENTARO·Filed 2012·Granted Jan 12, 2016·4 cites·8 claims
- 3270US8749073B2Wiring board, method of manufacturing the same, and semiconductor deviceNAKAMURA JUNICHI·Filed 2011·Granted Jun 10, 2014·2 cites·6 claims
- 3368US10943857B2Substrate with multi-layer resin structure and semiconductor device including the substrateSHINKO ELECTRIC IND CO·Filed 2018·Granted Mar 9, 2021·1 cites·20 claims
- 3467US9024207B2Method of manufacturing a wiring board having pads highly resistant to peelingSHINKO ELECTRIC IND CO·Filed 2013·Granted May 5, 2015·1 cites·6 claims
- 3567US9006103B2Method of manufacturing wiring substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted Apr 14, 2015·2 cites·9 claims
- 3666US8476536B2Wiring substrate and method for manufacturing the sameKANEKO KENTARO·Filed 2007·Granted Jul 2, 2013·2 cites·21 claims
- 3765US11189846B2Electrically-conductive member and method of manufacturing the sameFLOSFIA INC·Filed 2018·Granted Nov 30, 2021·0 cites·27 claims
- 3865US10117336B2Method of manufacturing a wiring substrateSHINKO ELECTRIC IND CO·Filed 2015·Granted Oct 30, 2018·1 cites·9 claims
- 3963US2025054845A1Lead frame, semiconductor device, and lead frame manufacturing methodSHINKO ELECTRIC IND CO·Filed 2024·Application pending·0 cites
- 4060US8610287B2Wiring substrate and method of manufacturing the sameKANEKO KENTARO·Filed 2010·Granted Dec 17, 2013·1 cites·8 claims
- 4159US2025112131A1Lead frame and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2024·Application pending·0 cites
- 4256US2024250179A1Oxide semiconductor, semiconductor device and method of manufacturing an oxide semiconductorFLOSFIA INC·Filed 2024·Application pending·0 cites
- 4356US2024170285A1Crystalline oxide film and semiconductor deviceFLOSFIA INC·Filed 2024·Application pending·0 cites
- 4456US2024170542A1Oxide crystal, crystalline oxide film, crystalline multilayer structure, semiconductor device and manufacturing method of a crystalline multilayer structureFLOSFIA INC·Filed 2024·Application pending·0 cites
- 4556US2025379127A1Lead frame strip, method of making the same, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2025·Application pending·0 cites
- 4655US2010084163A1Wiring board and method of fabricating the sameSHINKO ELECTRIC IND CO·Filed 2009·Application pending·0 cites
- 4755US2012256320A1Wiring board manufacturing method, semiconductor device manufacturing method and wiring boardKANEKO KENTARO·Filed 2012·Application pending·0 cites
- 4854US11424320B2P-type oxide semiconductor and method for manufacturing sameFLOSFIA INC·Filed 2017·Granted Aug 23, 2022·0 cites·6 claims
- 4953US8502398B2Wiring board, semiconductor apparatus and method of manufacturing themKANEKO KENTARO·Filed 2008·Granted Aug 6, 2013·0 cites·11 claims
- 5052US10460934B2Crystalline film, semiconductor device including crystalline film, and method for producing crystalline filmFLOSFIA INC·Filed 2018·Granted Oct 29, 2019·0 cites·29 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →