Inventor · disambiguated record
Keiichiro Kata
Also filed as: KATA KEIICHIRO
21 granted patents·1 pending application·947 citations·filing 1991–2010
97Inventor score
Top patents by PatentIndex Score
22 records- 0197US7397000B2Wiring board and semiconductor package using the sameNEC CORP·Filed 2005·Granted Jul 8, 2008·54 cites·18 claims
- 0294US5897337AProcess for adhesively bonding a semiconductor chip to a carrier filmNEC CORP·Filed 1995·Granted Apr 27, 1999·182 cites·20 claims
- 0392US5683942AMethod for manufacturing bump leaded film carrier type semiconductor deviceNEC CORP·Filed 1995·Granted Nov 4, 1997·133 cites·52 claims
- 0491US7566834B2Wiring board and semiconductor package using the sameNEC CORP·Filed 2008·Granted Jul 28, 2009·17 cites·11 claims
- 0591US5844304AProcess for manufacturing semiconductor device and semiconductor waferNEC CORP·Filed 1995·Granted Dec 1, 1998·120 cites·12 claims
- 0689US8198140B2Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor packageMURAI HIDEYA·Filed 2010·Granted Jun 12, 2012·14 cites·12 claims
- 0788US5726489AFilm carrier semiconductor deviceNEC CORP·Filed 1995·Granted Mar 10, 1998·95 cites·20 claims
- 0885US5905303AMethod for manufacturing bump leaded film carrier type semiconductor deviceNEC CORP·Filed 1997·Granted May 18, 1999·77 cites·23 claims
- 0983US7233066B2Multilayer wiring substrate, and method of producing sameNEC ELECTRONICS CORP·Filed 2006·Granted Jun 19, 2007·8 cites·7 claims
- 1080US7060604B2Multilayer wiring substrate, and method of producing sameNEC ELECTRONICS CORP·Filed 2003·Granted Jun 13, 2006·21 cites·32 claims
- 1179US5759873AMethod of manufacturing chip-size package-type semiconductor deviceNEC CORP·Filed 1996·Granted Jun 2, 1998·63 cites·7 claims
- 1272US7816782B2Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor packageNEC CORP·Filed 2005·Granted Oct 19, 2010·4 cites·21 claims
- 1366US6339337B1Method for inspecting semiconductor chip bonding pads using infrared raysNEC CORP·Filed 1998·Granted Jan 15, 2002·26 cites·9 claims
- 1464USRE39603EProcess for manufacturing semiconductor device and semiconductor waferNEC ELECTRONICS CORP·Filed 2003·Granted May 1, 2007·10 cites·22 claims
- 1559US6201298B1Semiconductor device using wiring tapeNEC CORP·Filed 1999·Granted Mar 13, 2001·24 cites·12 claims
- 1659US5757068ACarrier film with peripheral slitsNEC CORP·Filed 1995·Granted May 26, 1998·25 cites·3 claims
- 1753US6114754ATape automated bonding filmNEC CORP·Filed 1998·Granted Sep 5, 2000·16 cites·3 claims
- 1849US5292574ACeramic substrate having wiring of silver seriesNEC CORP·Filed 1991·Granted Mar 8, 1994·17 cites·8 claims
- 1949US5283081AProcess for manufacturing a ceramic wiring substrate having a low dielectric constantNEC CORP·Filed 1992·Granted Feb 1, 1994·18 cites·12 claims
- 2048US5977617ASemiconductor device having multilayer film carrierNEC CORP·Filed 1997·Granted Nov 2, 1999·14 cites·10 claims
- 2140US2004089470A1Printed circuit board, semiconductor package, base insulating film, and manufacturing method for interconnect substrateNEC CORP·Filed 2003·Application pending·0 cites
- 2239US5283210ALow temperature sintering low dielectric inorganic compositionNEC CORP·Filed 1992·Granted Feb 1, 1994·9 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →