Inventor · disambiguated record
Keung Beum Kim
Also filed as: KIM KEUNG BEUM
20 granted patents·4 pending applications·39 citations·filing 2011–2025
92Inventor score
Top patents by PatentIndex Score
24 records- 0198US11862618B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 2, 2024·9 cites·19 claims
- 0286US9721644B2Semiconductor memory device for improving signal integrity issue in center pad type of stacked chip structureSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 1, 2017·5 cites·20 claims
- 0385US11605584B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 14, 2023·1 cites·20 claims
- 0485US10037938B2Semiconductor packagesKIM KEUNG BEUM·Filed 2017·Granted Jul 31, 2018·7 cites·20 claims
- 0583US9520373B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 13, 2016·4 cites·20 claims
- 0681US12308363B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 20, 2025·0 cites·19 claims
- 0779US9659852B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 23, 2017·4 cites·19 claims
- 0878US2025266415A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0977US12237256B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 1073US2025167098A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1169US12482801B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·15 claims
- 1269US8736032B2Semiconductor device, semiconductor package, and electronic deviceKIM YONG-HOON·Filed 2012·Granted May 27, 2014·2 cites·9 claims
- 1363US9557616B2Source driver, an image display assembly and an image display apparatusCHUNG YE-CHUNG·Filed 2011·Granted Jan 31, 2017·2 cites·15 claims
- 1463US8629547B2Semiconductor chip packageCHO KYONG-SOON·Filed 2011·Granted Jan 14, 2014·2 cites·19 claims
- 1561US8866310B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 21, 2014·1 cites·10 claims
- 1661US2025286030A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1760US2025266397A1Semiconductor package including multiple chip structuresSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1859US9099326B2Stack-type semiconductor packageKIM YONGHOON·Filed 2013·Granted Aug 4, 2015·2 cites·20 claims
- 1956US9496226B2Semiconductor device, semiconductor package, and electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 15, 2016·0 cites·30 claims
- 2054US9041222B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 26, 2015·0 cites·10 claims
- 2152US9830973B2Semiconductor memory device for improving signal integrity issue in center pad type of stacked chip structureSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 28, 2017·0 cites·20 claims
- 2249US10163942B2Source driver, an image display assembly and an image display apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 25, 2018·0 cites·20 claims
- 2336US9799591B2Semiconductor packages including thermal blocksSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 24, 2017·0 cites·18 claims
- 2429US10553514B2Substrate strip including conductive plane around periphery of chip mounting regions and method of manufacturing semiconductor package using the sameKIM KEUNG BEUM·Filed 2015·Granted Feb 4, 2020·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →