Inventor · disambiguated record
Kenneth Robert Rhyner
Also filed as: RHYNER KENNETH · RHYNER KENNETH R · RHYNER KENNETH ROBERT
7 granted patents·4 pending applications·13 citations·filing 2007–2018
78Inventor score
Technology areasH10W
Files withTEXAS INSTRUMENTS INC6RHYNER KENNETH R2MURUGAN RAJEN1RHYNER KENNETH1RHYNER KENNETH ROBERT1
Top patents by PatentIndex Score
11 records- 0180US9666553B2Millimeter wave integrated circuit with ball grid array package including transmit and receive channelsTEXAS INSTRUMENTS INC·Filed 2015·Granted May 30, 2017·3 cites·20 claims
- 0277US8674505B2Integrated circuit packaging with ball grid array having differential pitch to enhance thermal performanceRHYNER KENNETH R·Filed 2012·Granted Mar 18, 2014·7 cites·16 claims
- 0366US8053349B2BGA package with traces for plating pads under the chipTEXAS INSTRUMENTS INC·Filed 2008·Granted Nov 8, 2011·3 cites·13 claims
- 0457US10262957B2Millimeter wave integrated circuit with ball grid array package including transmit and receive channelsTEXAS INSTRUMENTS INC·Filed 2018·Granted Apr 16, 2019·0 cites·19 claims
- 0554US9941228B2Millimeter wave integrated circuit with ball grid array package including transmit and receive channelsTEXAS INSTRUMENTS INC·Filed 2017·Granted Apr 10, 2018·0 cites·19 claims
- 0649US8828799B2Method of forming an integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect padTEXAS INSTRUMENTS INC·Filed 2013·Granted Sep 9, 2014·0 cites·2 claims
- 0744US2009289362A1Low Inductance Ball Grid Array Device Having Chip Bumps on Substrate ViasTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 0843US2010006987A1Integrated circuit package with emi shieldMURUGAN RAJEN·Filed 2008·Application pending·0 cites
- 0942US2009140419A1Extended plating trace in flip chip solder mask windowRHYNER KENNETH·Filed 2007·Application pending·0 cites
- 1040US2012013003A1Bga package with traces for plating pads under the chipRHYNER KENNETH R·Filed 2011·Application pending·0 cites
- 1139US8598048B2Integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect padRHYNER KENNETH ROBERT·Filed 2011·Granted Dec 3, 2013·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →