Inventor · disambiguated record
Kentaro Wada
Also filed as: WADA KENTARO
15 granted patents·8 pending applications·25 citations·filing 2005–2025
86Inventor score
Files withIBIDEN CO LTD6DISCO CORP5TOSHIBA KK5IMPERIAL COLLEGE INNOVATIONS LTD2APPLIED MATERIALS INC1
Top patents by PatentIndex Score
23 records- 0197US11538704B2Processing method of workpieceDISCO CORP·Filed 2020·Granted Dec 27, 2022·6 cites·9 claims
- 0286US8278108B2Automatic analyzerWADA KENTARO·Filed 2010·Granted Oct 2, 2012·15 cites·6 claims
- 0378US12477662B2Printed wiring boardIBIDEN CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 0470US7354288B2Substrate support with clamping electrical connectorAPPLIED MATERIALS INC·Filed 2005·Granted Apr 8, 2008·4 cites·23 claims
- 0563US2025012741A1Entrance management system and entrance management control deviceTOSHIBA KK·Filed 2024·Application pending·0 cites
- 0662US12279368B2Printed wiring boardIBIDEN CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·20 claims
- 0760US2025266615A1Antenna device and communication deviceTOSHIBA KK·Filed 2025·Application pending·0 cites
- 0860US2025372886A1Antenna device and wireless deviceTOSHIBA KK·Filed 2025·Application pending·0 cites
- 0959US12512333B2Cleaning apparatusDISCO CORP·Filed 2023·Granted Dec 30, 2025·0 cites·12 claims
- 1057US12260582B2Image processing system and methodIMPERIAL COLLEGE INNOVATIONS LTD·Filed 2022·Granted Mar 25, 2025·0 cites·20 claims
- 1157US2024316779A1Robotic system with object handling mechanism for loading and unloading of cargo carriersMUJIN INC·Filed 2024·Application pending·0 cites
- 1256US12494578B2Antenna device and radar deviceTOSHIBA KK·Filed 2023·Granted Dec 9, 2025·0 cites·19 claims
- 1356US12193156B2Wiring substrate and method for manufacturing wiring substrateIBIDEN CO LTD·Filed 2022·Granted Jan 7, 2025·0 cites·20 claims
- 1455US2025171880A1Use of aluminum-copper alloy as hydrogen device, and hydrogen-resistant member for hydrogen device and method for using sameTAKATORI SEISAKUSHO CO LTD·Filed 2023·Application pending·0 cites
- 1554US2024349430A1Wiring substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1653US12094776B2Wafer processing methodDISCO CORP·Filed 2021·Granted Sep 17, 2024·0 cites·10 claims
- 1751US2024040692A1Printed wiring boardIBIDEN CO LTD·Filed 2023·Application pending·0 cites
- 1850US2024241220A1Antenna device and radar systemTOSHIBA KK·Filed 2023·Application pending·0 cites
- 1949US11992916B2Fine adjustment thread assembly and processing apparatusDISCO CORP·Filed 2021·Granted May 28, 2024·0 cites·2 claims
- 2048US11363719B2Wiring substrate and component built-in wiring substrateIBIDEN CO LTD·Filed 2021·Granted Jun 14, 2022·0 cites·20 claims
- 2148US11171009B2Processing method of waferDISCO CORP·Filed 2020·Granted Nov 9, 2021·0 cites·14 claims
- 2247US12380592B2Image processing system and methodIMPERIAL COLLEGE INNOVATIONS LTD·Filed 2022·Granted Aug 5, 2025·0 cites·18 claims
- 2335US8997589B2Automatic analysis apparatus and automatic analysis methodKOMATSU HIDENOBU·Filed 2010·Granted Apr 7, 2015·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →