Inventor · disambiguated record
Kisup Chung
Also filed as: CHUNG KISUP
20 granted patents·4 pending applications·18 citations·filing 2015–2022
91Inventor score
Top patents by PatentIndex Score
24 records- 0188US10090378B1Efficient metal-insulator-metal capacitorIBM·Filed 2017·Granted Oct 2, 2018·4 cites·5 claims
- 0285US9589850B1Method for controlled recessing of materials in cavities in IC devicesGLOBALFOUNDRIES INC·Filed 2015·Granted Mar 7, 2017·5 cites·15 claims
- 0384US11476415B2Patterning magnetic tunnel junctions and the like while reducing detrimental resputtering of underlying featuresIBM·Filed 2018·Granted Oct 18, 2022·3 cites·18 claims
- 0482US10217839B2Field effect transistor (FET) with a gate having a recessed work function metal layer and method of forming the FETGLOBALFOUNDRIES INC·Filed 2017·Granted Feb 26, 2019·3 cites·7 claims
- 0577US11075281B2Additive core subtractive liner for metal cut etch processesIBM·Filed 2019·Granted Jul 27, 2021·1 cites·20 claims
- 0675US10651266B2Efficient metal-insulator-metal capacitorTESSERA INC·Filed 2018·Granted May 12, 2020·1 cites·17 claims
- 0771US12457905B2Patterning magnetic tunnel junctions and the like while reducing detrimental resputtering of underlying featuresIBM·Filed 2022·Granted Oct 28, 2025·0 cites·5 claims
- 0870US11990342B2Metal cut patterning and etching to minimize interlayer dielectric layer lossIBM·Filed 2021·Granted May 21, 2024·0 cites·17 claims
- 0970US10978550B2Efficient metal-insulator-metal capacitorTESSERA INC·Filed 2020·Granted Apr 13, 2021·0 cites·17 claims
- 1068US9881842B1Wimpy and nominal semiconductor device structures for vertical finFETsIBM·Filed 2017·Granted Jan 30, 2018·1 cites·20 claims
- 1166US10714683B2Multilayer hardmask for high performance MRAM devicesIBM·Filed 2019·Granted Jul 14, 2020·0 cites·17 claims
- 1265US11152489B2Additive core subtractive liner for metal cut etch processesIBM·Filed 2019·Granted Oct 19, 2021·0 cites·20 claims
- 1361US11133189B2Metal cut patterning and etching to minimize interlayer dielectric layer lossIBM·Filed 2019·Granted Sep 28, 2021·0 cites·7 claims
- 1460US10600884B2Additive core subtractive liner for metal cut etch processesIBM·Filed 2017·Granted Mar 24, 2020·0 cites·12 claims
- 1559US10256289B2Efficient metal-insulator-metal capacitor fabricationIBM·Filed 2017·Granted Apr 9, 2019·0 cites·12 claims
- 1658US10734234B2Metal cut patterning and etching to minimize interlayer dielectric layer lossIBM·Filed 2017·Granted Aug 4, 2020·0 cites·8 claims
- 1756US11276767B2Additive core subtractive liner for metal cut etch processesIBM·Filed 2017·Granted Mar 15, 2022·0 cites·6 claims
- 1856US10680169B2Multilayer hardmask for high performance MRAM devicesIBM·Filed 2018·Granted Jun 9, 2020·0 cites·10 claims
- 1952US2024218415A1Enzyme mutants directly attached to a nanogap deviceUNIVERSAL SEQUENCING TECH CORPORATION·Filed 2021·Application pending·0 cites
- 2050US2023002819A1Methods for Biomolecular Sensing and DetectionUNIVERSAL SEQUENCING TECH CORPORATION·Filed 2020·Application pending·0 cites
- 2149US2022260550A1Sequencing of Biopolymers By Motion-Controlled Electron TunnelingUNIVERSAL SEQUENCING TECH CORPORATION·Filed 2020·Application pending·0 cites
- 2246US2022186294A1Nanogap Device for Biopolymer IdentificationUNIVERSAL SEQUENCING TECH CORPORATION·Filed 2020·Application pending·0 cites
- 2345US10748962B2Method and structure for forming MRAM deviceIBM·Filed 2018·Granted Aug 18, 2020·0 cites·8 claims
- 2443US10693059B2MTJ stack etch using IBE to achieve vertical profileIBM·Filed 2018·Granted Jun 23, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →