Inventor · disambiguated record
Kin Yik Hung
Also filed as: HUNG KIN YIK
6 granted patents·2 pending applications·63 citations·filing 2002–2023
79Inventor score
Files withASM ASSEMBLY AUTOMATION LTD4ASM TECH SINGAPORE PTE LTD1ASMPT SINGAPORE PTE LTD1CHAN CHI FUNG1HUNG KIN YIK1
Top patents by PatentIndex Score
8 records- 0184US7002283B2Ultrasonic transducer assemblyASM ASSEMBLY AUTOMATION LTD·Filed 2003·Granted Feb 21, 2006·50 cites·16 claims
- 0272US7667355B2Apparatus for generating amplified cooling air flowsASM ASSEMBLY AUTOMATION LTD·Filed 2008·Granted Feb 23, 2010·7 cites·11 claims
- 0361US8857486B2Flip arm module for a bonding apparatus incorporating changeable collet toolsCHAN CHI FUNG·Filed 2011·Granted Oct 14, 2014·2 cites·10 claims
- 0460US7402778B2Oven for controlled heating of compounds at varying temperaturesASM ASSEMBLY AUTOMATION LTD·Filed 2005·Granted Jul 22, 2008·2 cites·15 claims
- 0556US9281290B2Bond head for thermal compression die bondingHUNG KIN YIK·Filed 2012·Granted Mar 8, 2016·2 cites·13 claims
- 0652US2024339430A1System and method for fluxless thermocompression bondingASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 0733US2004003891A1Apparatus and method for application of adhesive substances to objectsASM ASSEMBLY AUTOMATION LTD·Filed 2002·Application pending·0 cites
- 0831US10475763B2Die bonding apparatus comprising an inert gas environmentASM TECH SINGAPORE PTE LTD·Filed 2016·Granted Nov 12, 2019·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →