Inventor · disambiguated record
Kiran Shrestha
Also filed as: SHRESTHA KIRAN · SHRESTHA KIRAN L · SHRESTHA KIRAN LALL
24 granted patents·10 pending applications·728 citations·filing 2012–2024
94Inventor score
Top patents by PatentIndex Score
34 records- 0198US10734497B2Methods for forming a semiconductor device structure and related semiconductor device structuresASM IP HOLDING BV·Filed 2018·Granted Aug 4, 2020·279 cites·20 claims
- 0298US10190213B2Deposition of metal boridesASM IP HOLDING BV·Filed 2016·Granted Jan 29, 2019·413 cites·20 claims
- 0397US11581220B2Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structuresASM IP HOLDING BV·Filed 2021·Granted Feb 14, 2023·4 cites·20 claims
- 0496US11780047B2Determination of substrate layer thickness with polishing pad wear compensationAPPLIED MATERIALS INC·Filed 2021·Granted Oct 10, 2023·4 cites·14 claims
- 0596US11295980B2Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structuresASM IP HOLDING BV·Filed 2018·Granted Apr 5, 2022·14 cites·17 claims
- 0695US11847776B2System using film thickness estimation from machine learning based processing of substrate imagesAPPLIED MATERIALS INC·Filed 2021·Granted Dec 19, 2023·4 cites·18 claims
- 0792US11836913B2Film thickness estimation from machine learning based processing of substrate imagesAPPLIED MATERIALS INC·Filed 2021·Granted Dec 5, 2023·2 cites·20 claims
- 0888US2025081588A1Methods for forming a semiconductor device structure and related semiconductor device structuresASM IP HOLDING BV·Filed 2024·Application pending·0 cites
- 0987US11658078B2Using a trained neural network for use in in-situ monitoring during polishing and polishing systemAPPLIED MATERIALS INC·Filed 2021·Granted May 23, 2023·1 cites·17 claims
- 1085US12166099B2Methods for forming a semiconductor device structure and related semiconductor device structuresASM IP HOLDING BV·Filed 2023·Granted Dec 10, 2024·0 cites·18 claims
- 1185US11164955B2Methods for forming a semiconductor device structure and related semiconductor device structuresASM IP HOLDING BV·Filed 2020·Granted Nov 2, 2021·1 cites·20 claims
- 1284US10607895B2Method for forming a semiconductor device structure comprising a gate fill metalASM IP HOLDING BV·Filed 2017·Granted Mar 31, 2020·3 cites·65 claims
- 1383US12136574B2Technique for training neural network for use in in-situ monitoring during polishing and polishing systemAPPLIED MATERIALS INC·Filed 2023·Granted Nov 5, 2024·0 cites·17 claims
- 1483US11056344B2Layer forming methodASM IP HOLDING BV·Filed 2017·Granted Jul 6, 2021·3 cites·20 claims
- 1582US12169925B2System using film thickness estimation from machine learning based processing of substrate imagesAPPLIED MATERIALS INC·Filed 2023·Granted Dec 17, 2024·0 cites·18 claims
- 1681US12272047B2Residue measurement from machine learning based processing of substrate imagesAPPLIED MATERIALS INC·Filed 2023·Granted Apr 8, 2025·0 cites·16 claims
- 1781US12057354B2Trained neural network in in-situ monitoring during polishing and polishing systemAPPLIED MATERIALS INC·Filed 2023·Granted Aug 6, 2024·0 cites·21 claims
- 1881US2024153817A1Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structuresASM IP HOLDING BV·Filed 2024·Application pending·0 cites
- 1977US11908736B2Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structuresASM IP HOLDING BV·Filed 2022·Granted Feb 20, 2024·0 cites·17 claims
- 2077US11695054B2Methods for forming a semiconductor device structure and related semiconductor device structuresASM IP HOLDING BV·Filed 2021·Granted Jul 4, 2023·0 cites·20 claims
- 2175US2025029834A1Methods for depositing a molybdenum metal film on a dielectric surface of a substrate and related semiconductor device structuresASM IP HOLDING BV·Filed 2024·Application pending·0 cites
- 2274US11791224B2Technique for training neural network for use in in-situ monitoring during polishing and polishing systemAPPLIED MATERIALS INC·Filed 2021·Granted Oct 17, 2023·0 cites·16 claims
- 2374US2024096711A1Method for forming a semiconductor device structure and related semiconductor device structuresASM IP HOLDING BV·Filed 2023·Application pending·0 cites
- 2473US10851456B2Deposition of metal boridesASM IP HOLDING BV·Filed 2019·Granted Dec 1, 2020·0 cites·20 claims
- 2571US12090599B2Determination of substrate layer thickness with polishing pad wear compensationAPPLIED MATERIALS INC·Filed 2023·Granted Sep 17, 2024·0 cites·13 claims
- 2661US2020227325A1Method for forming a semiconductor device structure and related semiconductor device structuresASM IP HOLDING BV·Filed 2020·Application pending·0 cites
- 2760US2021313182A1Layer forming methodASM IP HOLDING BV·Filed 2021·Application pending·0 cites
- 2854US12447578B2Compensation for substrate doping in edge reconstruction for in-situ electromagnetic inductive monitoringAPPLIED MATERIALS INC·Filed 2018·Granted Oct 21, 2025·0 cites·24 claims
- 2953US2019067003A1Methods for depositing a molybdenum metal film on a dielectric surface of a substrate and related semiconductor device structuresASM IP HOLDING BV·Filed 2018·Application pending·0 cites
- 3053US2024185058A1Semiconductor film thickness prediction using machine-learningAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3145US9679823B2Metric for recognizing correct library spectrumAPPLIED MATERIALS INC·Filed 2013·Granted Jun 13, 2017·0 cites·18 claims
- 3243US9482610B2Techniques for matching spectraAPPLIED MATERIALS INC·Filed 2012·Granted Nov 1, 2016·0 cites·21 claims
- 3341US2019067014A1Methods for filling a gap feature on a substrate surface and related semiconductor device structuresASM IP HOLDING BV·Filed 2018·Application pending·0 cites
- 3440US2019067095A1Layer forming methodASM IP HOLDING BV·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →