Inventor · disambiguated record
King-Ning Tu
Also filed as: TU KING-NING
22 granted patents·7 pending applications·574 citations·filing 1975–2023
96Inventor score
Top patents by PatentIndex Score
29 records- 0195US3996095AEpitaxial process of forming ferrite, Fe3 O4 and γFe2 O3 thin films on special materialsIBM·Filed 1975·Granted Dec 7, 1976·56 cites·14 claims
- 0293US10094033B2Electrodeposited nano-twins copper layer and method of fabricating the sameUNIV NATIONAL CHIAO TUNG·Filed 2016·Granted Oct 9, 2018·12 cites·14 claims
- 0392US6063506ACopper alloys for chip and package interconnectionsIBM·Filed 1998·Granted May 16, 2000·116 cites·59 claims
- 0490US4394673ARare earth silicide Schottky barriersIBM·Filed 1980·Granted Jul 19, 1983·74 cites·10 claims
- 0586US6090710AMethod of making copper alloys for chip and package interconnectionsIBM·Filed 1997·Granted Jul 18, 2000·73 cites·16 claims
- 0685US9476140B2Electrodeposited nano-twins copper layer and method of fabricating the sameUNIV NAT CHIAO TUNG·Filed 2012·Granted Oct 25, 2016·7 cites·14 claims
- 0782US4803539ADopant control of metal silicide formationIBM·Filed 1985·Granted Feb 7, 1989·50 cites·23 claims
- 0880US4001049AMethod for improving dielectric breakdown strength of insulating-glassy-material layer of a device including ion implantation thereinIBM·Filed 1975·Granted Jan 4, 1977·35 cites·7 claims
- 0978US8575566B2Specimen box for electron microscopeCHEN CHIH·Filed 2012·Granted Nov 5, 2013·4 cites·21 claims
- 1074US8405047B2Specimen box for electron microscopeCHEN CHIH·Filed 2012·Granted Mar 26, 2013·3 cites·21 claims
- 1168US2024009777A1Solder alloy composition, its preparation method and uses in room-temperature rapid solid-state solderingUNIV CITY HONG KONG·Filed 2023·Application pending·0 cites
- 1267US2023284628A1Copper filter with fast virus killing abilityUNIV CITY HONG KONG·Filed 2023·Application pending·0 cites
- 1366US4728626AMethod for making planar 3D heterepitaxial semiconductor structures with buried epitaxial silicidesIBM·Filed 1985·Granted Mar 1, 1988·33 cites·24 claims
- 1465US6280794B1Method of forming dielectric material suitable for microelectronic circuitsCONEXANT SYSTEMS INC·Filed 1999·Granted Aug 28, 2001·30 cites·20 claims
- 1564US7772117B2Methods of fabricating highly conductive regions in semiconductor substrates for radio frequency applicationsUNIV CALIFORNIA·Filed 2007·Granted Aug 10, 2010·2 cites·13 claims
- 1657US5463254AFormation of 3-dimensional silicon silicide structuresIBM·Filed 1994·Granted Oct 31, 1995·24 cites·27 claims
- 1755US11688054B2Auxiliary prediction system for predicting reliability, and method and computer program product thereofNATIONAL YANG MING CHIAO TUNG UNIV·Filed 2021·Granted Jun 27, 2023·0 cites·9 claims
- 1852US5308794AAluminum-germanium alloys for VLSI metallizationIBM·Filed 1993·Granted May 3, 1994·20 cites·26 claims
- 1947US7176129B2Methods of fabricating highly conductive regions in semiconductor substrates for radio frequency applicationsUNIV CALIFORNIA·Filed 2002·Granted Feb 13, 2007·2 cites·7 claims
- 2044US2015064496A1Single crystal copper, manufacturing method thereof and substrate comprising the sameUNIV NAT CHIAO TUNG·Filed 2014·Application pending·0 cites
- 2144US2008290554A1Oriented Polymer Fibers and Methods for Fabricating ThereofUNIV CALIFORNIA·Filed 2005·Application pending·0 cites
- 2243US5294486ABarrier improvement in thin filmsIBM·Filed 1993·Granted Mar 15, 1994·13 cites·4 claims
- 2341US2007117475A1Prevention of Sn whisker growth for high reliability electronic devicesUNIV CALIFORNIA·Filed 2005·Application pending·0 cites
- 2441US2006234079A1Smart-cut of a thin foil of poruous Ni from a Si waferUNIV CALIFORNIA LOS ANGELES·Filed 2006·Application pending·0 cites
- 2539US8835300B2Method for inhibiting growth of intermetallic compoundsCHEN CHIH·Filed 2012·Granted Sep 16, 2014·0 cites·5 claims
- 2639US5504375AAsymmetric studs and connecting lines to minimize stressIBM·Filed 1993·Granted Apr 2, 1996·11 cites·8 claims
- 2739US2006027933A1Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder jointsCHEN CHIH·Filed 2005·Application pending·0 cites
- 2838US5882953ADopant activation of heavily-doped semiconductor by high current densitiesUNIV CALIFORNIA·Filed 1996·Granted Mar 16, 1999·8 cites·19 claims
- 2929US4980751AElectrical multilayer contact for microelectronic structureIBM·Filed 1989·Granted Dec 25, 1990·1 cites·16 claims
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