Inventor · disambiguated record
Kock Liang Heng
Also filed as: HENG KOCK LIANG
10 granted patents·381 citations·filing 2008–2013
91Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0198US7838337B2Semiconductor device and method of forming an interposer package with through silicon viasSTATS CHIPPAC LTD·Filed 2008·Granted Nov 23, 2010·166 cites·20 claims
- 0297US8263439B2Semiconductor device and method of forming an interposer package with through silicon viasMARIMUTHU PANDI CHELVAM·Filed 2010·Granted Sep 11, 2012·91 cites·31 claims
- 0397US7741148B1Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural supportSTATS CHIPPAC LTD·Filed 2008·Granted Jun 22, 2010·57 cites·17 claims
- 0493US8659162B2Semiconductor device having an interconnect structure with TSV using encapsulant for structural supportSUTHIWONGSUNTHORN NATHAPONG·Filed 2011·Granted Feb 25, 2014·19 cites·25 claims
- 0593US8067308B2Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural supportSUTHIWONGSUNTHORN NATHAPONG·Filed 2009·Granted Nov 29, 2011·28 cites·27 claims
- 0682US9054083B2Semiconductor device and method of making TSV interconnect structures using encapsulant for structural supportSTATS CHIPPAC LTD·Filed 2013·Granted Jun 9, 2015·4 cites·25 claims
- 0779US9029193B2Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural supportMARIMUTHU PANDI CHELVAM·Filed 2010·Granted May 12, 2015·4 cites·23 claims
- 0878US8125073B2Wafer integrated with permanent carrier and method thereforHAN BYUNG JOON·Filed 2011·Granted Feb 28, 2012·4 cites·33 claims
- 0977US7880293B2Wafer integrated with permanent carrier and method thereforSTATS CHIPPAC LTD·Filed 2008·Granted Feb 1, 2011·6 cites·25 claims
- 1071US8049328B2Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural supportSTATS CHIPPAC LTD·Filed 2010·Granted Nov 1, 2011·2 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →