Inventor · disambiguated record
Koowoong Jeong
Also filed as: JEONG KOOWOONG
3 granted patents·1 pending application·9 citations·filing 2016–2024
60Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0192US10032705B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jul 24, 2018·9 cites·18 claims
- 0280US2024332159A1Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0372US12009289B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 0457US11152296B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Oct 19, 2021·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →