Inventor · disambiguated record
Kostas Papathomas
Also filed as: PAPATHOMAS KOSTAS · PAPATHOMAS KOSTAS I
57 granted patents·8 pending applications·2,172 citations·filing 1989–2011
99Inventor score
Top patents by PatentIndex Score
65 records- 0197US7508076B2Information handling system including a circuitized substrate having a dielectric layer without continuous fibersENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 24, 2009·56 cites·18 claims
- 0297US5822856AManufacturing circuit board assemblies having filled viasIBM·Filed 1996·Granted Oct 20, 1998·223 cites·10 claims
- 0396US6323436B1High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layerIBM·Filed 1997·Granted Nov 27, 2001·156 cites·12 claims
- 0496US6178093B1Information handling system with circuit assembly having holes filled with filler materialIBM·Filed 1998·Granted Jan 23, 2001·168 cites·33 claims
- 0594US5268260APhotoresist develop and strip solvent compositions and method for their useIBM·Filed 1991·Granted Dec 7, 1993·102 cites·3 claims
- 0692US5194930ADielectric composition and solder interconnection structure for its useIBM·Filed 1991·Granted Mar 16, 1993·143 cites·8 claims
- 0791US7348677B2Method of providing printed circuit board with conductive holes and board resulting therefromENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 25, 2008·19 cites·16 claims
- 0891US5250848ASolder interconnection structureIBM·Filed 1991·Granted Oct 5, 1993·61 cites·24 claims
- 0991US5089440ASolder interconnection structure and process for makingIBM·Filed 1990·Granted Feb 18, 1992·62 cites·20 claims
- 1091US4999699ASolder interconnection structure and process for makingIBM·Filed 1990·Granted Mar 12, 1991·137 cites·21 claims
- 1190US8063315B2Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrateDAS RABINDRA N·Filed 2007·Granted Nov 22, 2011·15 cites·17 claims
- 1290US7470990B2Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Dec 30, 2008·16 cites·15 claims
- 1388US5656862ASolder interconnection structureIBM·Filed 1993·Granted Aug 12, 1997·86 cites·45 claims
- 1487US8198551B2Power core for use in circuitized substrate and method of making sameJAPP ROBERT M·Filed 2010·Granted Jun 12, 2012·9 cites·29 claims
- 1585US5668059ASolder interconnection structure and process for makingIBM·Filed 1996·Granted Sep 16, 1997·72 cites·24 claims
- 1684US7541265B2Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jun 2, 2009·12 cites·16 claims
- 1783US7646098B2Multilayered circuitized substrate with p-aramid dielectric layers and method of making sameENDICOTT INTERCONNECT TECH INC·Filed 2008·Granted Jan 12, 2010·9 cites·13 claims
- 1883US7078816B2Circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Jul 18, 2006·23 cites·15 claims
- 1983US6199751B1Polymer with transient liquid phase bondable particlesIBM·Filed 2000·Granted Mar 13, 2001·32 cites·12 claims
- 2083US5571593AVia fill compositions for direct attach of devices and methods for applying sameIBM·Filed 1995·Granted Nov 5, 1996·53 cites·7 claims
- 2182US6000129AProcess for manufacturing a circuit with filled holesIBM·Filed 1998·Granted Dec 14, 1999·43 cites·4 claims
- 2281US7416996B2Method of making circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Aug 26, 2008·7 cites·14 claims
- 2381US7270845B2Dielectric composition for forming dielectric layer for use in circuitized substratesENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Sep 18, 2007·19 cites·13 claims
- 2481US7211289B2Method of making multilayered printed circuit board with filled conductive holesENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted May 1, 2007·21 cites·10 claims
- 2579US7416972B2Method of making same low moisture absorptive circuitized substrave with reduced thermal expansionENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Aug 26, 2008·6 cites·4 claims
- 2679US6207595B1Laminate and method of manufacture thereofIBM·Filed 1998·Granted Mar 27, 2001·59 cites·8 claims
- 2779US6138350AProcess for manufacturing a circuit board with filled holesIBM·Filed 1998·Granted Oct 31, 2000·37 cites·12 claims
- 2879US6079100AMethod of making a printed circuit board having filled holes and fill member for use therewithIBM·Filed 1998·Granted Jun 27, 2000·48 cites·25 claims
- 2978US6106891AVia fill compositions for direct attach of devices and method for applying sameIBM·Filed 1998·Granted Aug 22, 2000·38 cites·6 claims
- 3077US5766670AVia fill compositions for direct attach of devices and methods for applying sameIBM·Filed 1993·Granted Jun 16, 1998·39 cites·3 claims
- 3174US8084863B2Circuitized substrate with continuous thermoplastic support film dielectric layersJAPP ROBERT M·Filed 2008·Granted Dec 27, 2011·5 cites·13 claims
- 3274US6555762B2Electronic package having substrate with electrically conductive through holes filled with polymer and conductive compositionIBM·Filed 1999·Granted Apr 29, 2003·38 cites·3 claims
- 3373US7931830B2Dielectric composition for use in circuitized substrates and circuitized substrate including sameENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Apr 26, 2011·1 cites·17 claims
- 3473US7429789B2Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including sameENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Sep 30, 2008·5 cites·19 claims
- 3573US5542602AStabilization of conductive adhesive by metallurgical bondingIBM·Filed 1994·Granted Aug 6, 1996·40 cites·9 claims
- 3671US5863332AFluid jet impregnating and coating device with thickness control capabilityIBM·Filed 1996·Granted Jan 26, 1999·26 cites·3 claims
- 3770US6127097APhotoresist develop and strip solvent compositions and method for their useIBM·Filed 1997·Granted Oct 3, 2000·27 cites·5 claims
- 3869US6127025ACircuit board with wiring sealing filled holesIBM·Filed 1998·Granted Oct 3, 2000·23 cites·24 claims
- 3968US8211790B2Multilayered circuitized substrate with P-aramid dielectric layers and method of making sameJAPP ROBERT M·Filed 2009·Granted Jul 3, 2012·3 cites·6 claims
- 4068US6066889AMethods of selectively filling aperturesIBM·Filed 1998·Granted May 23, 2000·30 cites·10 claims
- 4167US5713508AStabilization of conductive adhesive by metallurgical bondingIBM·Filed 1996·Granted Feb 3, 1998·29 cites·8 claims
- 4266US6376158B1Methods for selectively filling aperturesIBM·Filed 2000·Granted Apr 23, 2002·11 cites·8 claims
- 4366US6114098AMethod of filling an aperture in a substrateIBM·Filed 1998·Granted Sep 5, 2000·25 cites·13 claims
- 4465US5887345AMethod for applying curable fill compositon to apertures in a substrateIBM·Filed 1997·Granted Mar 30, 1999·21 cites·4 claims
- 4563US7145221B2Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Dec 5, 2006·10 cites·34 claims
- 4657US6125531AMethod of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement meansIBM·Filed 1999·Granted Oct 3, 2000·16 cites·26 claims
- 4756US6114019ACircuit board assemblies having filled vias free from bleed-outIBM·Filed 1998·Granted Sep 5, 2000·13 cites·23 claims
- 4856US6087021APolymer with transient liquid phase bondable particlesIBM·Filed 1998·Granted Jul 11, 2000·17 cites·4 claims
- 4954US5637442AMethod for treating photolithographic developer and stripper waste streams containing resist or solder mask and gamma butyrolactone or benzyl alcoholIBM·Filed 1995·Granted Jun 10, 1997·14 cites·2 claims
- 5052US9756724B2Method of making a circuitized substrateDAS RABINDRA N·Filed 2011·Granted Sep 5, 2017·0 cites·9 claims
Showing the top 50 of 65 patent records by PatentIndex Score.
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