Inventor · disambiguated record
Kuei-Sung Chang
Also filed as: CHANG KUEI-SUNG
90 granted patents·11 pending applications·310 citations·filing 2010–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD78TAIWAN SEMICONDUCTOR MFG13CHU CHIA-HUA3SHU CHIA-PAO2TSAI YI HENG2
Top patents by PatentIndex Score
101 records- 0198US9695039B1Multi-pressure MEMS packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 4, 2017·17 cites·20 claims
- 0298US9233839B2MEMS device and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 12, 2016·51 cites·17 claims
- 0397US9085456B2Support structure for TSV in MEMS structureTSAI YI HENG·Filed 2012·Granted Jul 21, 2015·53 cites·20 claims
- 0497US9065358B2MEMS structure and method of forming sameTSAI YI HENG·Filed 2011·Granted Jun 23, 2015·51 cites·14 claims
- 0595US8900905B1MEMS device and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 2, 2014·26 cites·18 claims
- 0694US11965731B2Package structure and measurement method for the package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 23, 2024·2 cites·20 claims
- 0793US12002780B2Package structure including a base and a lid disposed over the base and method of forming the package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 4, 2024·2 cites·20 claims
- 0893US8895360B2Integrated semiconductor device and wafer level method of fabricating the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 25, 2014·12 cites·20 claims
- 0992US9691725B2Integrated semiconductor device and wafer level method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 27, 2017·7 cites·20 claims
- 1089US10850976B2Method of making ohmic contact on low doped bulk silicon for optical alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 1, 2020·2 cites·20 claims
- 1188US9029961B2Wafer level method of sealing different pressure levels for MEMS sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 12, 2015·7 cites·20 claims
- 1288US2025354800A1Package structure and measurement method for the package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1387US12234141B2Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 1487US10654707B2Method of stiction prevention by patterned anti-stiction layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 19, 2020·2 cites·20 claims
- 1587US9567210B2Multi-pressure MEMS packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 14, 2017·4 cites·20 claims
- 1687US8878312B2Electrical bypass structure for MEMS deviceHUNG CHIA-MING·Filed 2011·Granted Nov 4, 2014·16 cites·15 claims
- 1787US2024367964A1Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1886US12455160B2Package structure and measurement method for the package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 28, 2025·0 cites·20 claims
- 1986US10131533B1Microelectromechanical system device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 20, 2018·3 cites·20 claims
- 2086US9221674B1Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stopTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 29, 2015·4 cites·20 claims
- 2185US12151932B2Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 2284US8232614B1Package systems having a conductive element through a substrate thereof and manufacturing methods of the sameCHU CHIA-HUA·Filed 2011·Granted Jul 31, 2012·6 cites·20 claims
- 2384US2023353066A1MEMS Structure and Method of Forming SameTAIWAN SEMICONDUCTOR MFG COMPANY CO LTD·Filed 2023·Application pending·0 cites
- 2483US12412863B2Die attached leveling control by metal stopper bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·20 claims
- 2583US11279611B2Micro-electro mechanical system device containing a bump stopper and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 22, 2022·2 cites·20 claims
- 2682US9403673B2Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stopTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 2, 2016·2 cites·20 claims
- 2782US9293431B2Integrated semiconductor device and wafer level method of fabricating the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 22, 2016·4 cites·20 claims
- 2881US12489074B2Package structure having a device inside a molding member and method of forming the package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 2981US12358783B2Wire-bond damper for shock absorptionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 3080US2024270565A1Composite spring structure to reinforce mechanical robustness of a mems deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3180US2025243051A1Bypass structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3279US8368152B2MEMS device etch stopTAIWAN SEMICONDUCTOR MFG·Filed 2011·Granted Feb 5, 2013·4 cites·20 claims
- 3379US2024375939A1Stopper bump structures for mems deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3479US2025112081A1Vacuum wafer chuck for manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3578US12322722B2Die attached leveling control by metal stopper bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 3678US11993510B2Composite spring structure to reinforce mechanical robustness of a MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 3778US10269743B2Semiconductor devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 23, 2019·3 cites·20 claims
- 3878US9466532B2Micro-electro mechanical system (MEMS) structures with through substrate vias and methods of forming the sameCHU CHIA-HUA·Filed 2012·Granted Oct 11, 2016·4 cites·20 claims
- 3978US9355896B2Package systemsTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted May 31, 2016·2 cites·20 claims
- 4078US9316704B2Magnetic sensor and forming methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 19, 2016·3 cites·20 claims
- 4178US9035451B2Wafer level sealing methods with different vacuum levels for MEMS sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 19, 2015·4 cites·20 claims
- 4277US11827513B2Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·20 claims
- 4377US9859819B2MEMS structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 2, 2018·1 cites·20 claims
- 4477US9502370B2Semiconductor bonding structure and processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 22, 2016·2 cites·20 claims
- 4577US9281287B2Semiconductor bonding structure and processTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 8, 2016·3 cites·20 claims
- 4677US2025162859A1Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4776US11530130B2Method of making ohmic contact on low doped bulk silicon for optical alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·0 cites·20 claims
- 4876US8633554B2MEMS device etch stopTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 21, 2014·3 cites·13 claims
- 4975US11814283B2Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 5075US11485631B2Method of making ohmic contact on low doped bulk silicon for optical alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 1, 2022·0 cites·20 claims
Showing the top 50 of 101 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →