Inventor · disambiguated record
Kuei-Wei Huang
Also filed as: HUANG KUEI-WEI
65 granted patents·7 pending applications·260 citations·filing 2008–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD34TAIWAN SEMICONDUCTOR MFG15CHEN MENG-TSE6HUANG KUEI-WEI4CHENG MING-DA2
Top patents by PatentIndex Score
72 records- 0198US9418971B2Package-on-package structure including a thermal isolation material and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 16, 2016·42 cites·20 claims
- 0297US8884431B2Packaging methods and structures for semiconductor devicesLIN CHIH-WEI·Filed 2011·Granted Nov 11, 2014·35 cites·20 claims
- 0397US8381965B2Thermal compress bondingTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 26, 2013·30 cites·14 claims
- 0496US8975741B2Process for forming package-on-package structuresLIN CHIH-WEI·Filed 2011·Granted Mar 10, 2015·21 cites·20 claims
- 0595US9799631B2Semiconductor packaging structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 24, 2017·8 cites·20 claims
- 0693US9865574B2Alignment in the packaging of integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 9, 2018·9 cites·20 claims
- 0792US9666572B2Process for forming package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 30, 2017·6 cites·20 claims
- 0890US9263412B2Packaging methods and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 16, 2016·8 cites·19 claims
- 0989US9117816B2Process for forming package-on-package structuresTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Aug 25, 2015·5 cites·20 claims
- 1088US9412689B2Semiconductor packaging structure and methodLIN CHUN-CHENG·Filed 2012·Granted Aug 9, 2016·6 cites·20 claims
- 1188US8900922B2Fine-pitch package-on-package structures and methods for forming the sameLIN CHENG-CHUNG·Filed 2012·Granted Dec 2, 2014·11 cites·14 claims
- 1285US9397062B2Package on package bonding structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 19, 2016·5 cites·20 claims
- 1385US9343386B2Alignment in the packaging of integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 17, 2016·6 cites·16 claims
- 1484US8928134B2Package on package bonding structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 6, 2015·5 cites·20 claims
- 1584US8603860B2Process for forming packagesCHEN MENG-TSE·Filed 2011·Granted Dec 10, 2013·7 cites·20 claims
- 1684US2024395767A1Tools and systems for processing semiconductor devices, and methods of processing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1783US11069671B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 20, 2021·3 cites·20 claims
- 1881US10192804B2Bump-on-trace packaging structure and method for forming the sameCHEN MENG TSE·Filed 2012·Granted Jan 29, 2019·5 cites·19 claims
- 1981US9082636B2Packaging methods and structures for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 14, 2015·4 cites·20 claims
- 2079US12040309B2Bonding through multi-shot laser reflowTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 2179US9786622B2Semiconductor packageCHENG MING-DA·Filed 2011·Granted Oct 10, 2017·5 cites·20 claims
- 2279US9673182B2Package on package bonding structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 6, 2017·2 cites·20 claims
- 2379US8609462B2Methods for forming 3DIC packageCHEN MENG-TSE·Filed 2011·Granted Dec 17, 2013·4 cites·20 claims
- 2479US8556158B2Thermal compress bondingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 15, 2013·4 cites·20 claims
- 2578US8111226B2Liquid crystal display deviceTSAI YI-CHENG·Filed 2009·Granted Feb 7, 2012·4 cites·13 claims
- 2678US2023378153A1Package-on-Package Structure Including a Thermal Isolation MaterialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2777US12368149B2Methods of forming semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 2877US12142594B2Tools and systems for processing semiconductor devices, and methods of processing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 12, 2024·0 cites·19 claims
- 2976US2025316670A1Methods of forming semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3075US10373941B2Package-on-package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 6, 2019·1 cites·20 claims
- 3175US8586408B2Contact and method of formationCHEN MENG-TSE·Filed 2011·Granted Nov 19, 2013·3 cites·13 claims
- 3274US10522452B2Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substratesHUANG KUEI WEI·Filed 2011·Granted Dec 31, 2019·4 cites·22 claims
- 3374US9412723B2Package on-package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 9, 2016·2 cites·20 claims
- 3473US10832999B2Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 10, 2020·1 cites·20 claims
- 3571US11462507B2Bonding through multi-shot laser reflowTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 4, 2022·0 cites·20 claims
- 3670US9373610B2Process for forming package-on-package structuresTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 21, 2016·1 cites·20 claims
- 3769US8616433B2Forming low stress joints using thermal compress bondingTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Dec 31, 2013·2 cites·13 claims
- 3869US8054297B2Touch display panelCHUNGHWA PICTURE TUBES LTD·Filed 2008·Granted Nov 8, 2011·4 cites·13 claims
- 3968US9589861B2Semiconductor packaging having warpage control and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 7, 2017·1 cites·20 claims
- 4067US8390651B2Driving method and driving apparatus for displaying apparatusHUANG KUEI-WEI·Filed 2009·Granted Mar 5, 2013·2 cites·14 claims
- 4166US11942464B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 26, 2024·0 cites·20 claims
- 4266US8846448B2Warpage control in a package-on-package structureCHEN MENG-TSE·Filed 2012·Granted Sep 30, 2014·2 cites·13 claims
- 4365US9379032B2Semiconductor packaging having warpage control and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 28, 2016·1 cites·20 claims
- 4464US11776945B2Package-on-package structure including a thermal isolation materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 3, 2023·0 cites·20 claims
- 4564US11101261B2Package-on-package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 24, 2021·0 cites·20 claims
- 4662US12119238B2Semiconductor bonding structures and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 15, 2024·0 cites·20 claims
- 4762US8360303B2Forming low stress joints using thermal compress bondingTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 29, 2013·1 cites·7 claims
- 4861US11158605B2Semiconductor packaging structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 26, 2021·0 cites·20 claims
- 4960US11355471B2System for processing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 7, 2022·0 cites·20 claims
- 5060US10790261B2Bonding through multi-shot laser reflowTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·0 cites·20 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →