Inventor · disambiguated record
Kui Kam Lam
Also filed as: LAM KUI KAM
16 granted patents·5 pending applications·31 citations·filing 2003–2023
88Inventor score
Files withLAM KUI KAM7ASM TECH SINGAPORE PTE LTD6ASM ASSEMBLY AUTOMATION LTD5CHUNG KWOK KEE2ASMPT SINGAPORE PTE LTD1
Top patents by PatentIndex Score
21 records- 0179US7648901B2Manufacturing process and apparatus therefor utilizing reducing gasASM ASSEMBLY AUTOMATION LTD·Filed 2006·Granted Jan 19, 2010·6 cites·12 claims
- 0270US7977231B1Die bonder incorporating dual-head dispenserASM ASSEMBLY AUTOMATION LTD·Filed 2010·Granted Jul 12, 2011·5 cites·20 claims
- 0361US10399170B2Die attachment apparatus and method utilizing activated forming gasLAM KUI KAM·Filed 2013·Granted Sep 3, 2019·2 cites·18 claims
- 0458US10882298B2System for adjusting relative positions between components of a bonding apparatusASM TECH SINGAPORE PTE LTD·Filed 2016·Granted Jan 5, 2021·1 cites·15 claims
- 0558US7179346B2Semiconductor apparatus with multiple delivery devices for componentsASM ASSEMBLY AUTOMATION LTD·Filed 2003·Granted Feb 20, 2007·7 cites·17 claims
- 0657US7735715B2Dispensing solder for mounting semiconductor chipsASM ASSEMBLY AUTOMATION LTD·Filed 2007·Granted Jun 15, 2010·2 cites·8 claims
- 0755US6991967B2Apparatus and method for die attachmentASM ASSEMBLY AUTOMATION LTD·Filed 2004·Granted Jan 31, 2006·8 cites·16 claims
- 0850US2024264524A1Combined dispensing and stamping apparatus and method for applying adhesive fluid during a bonding processASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 0945US9989587B2Apparatus for testing multiple semiconductor dice with increased throughputASM TECH SINGAPORE PTE LTD·Filed 2015·Granted Jun 5, 2018·0 cites·17 claims
- 1044US11136202B2Direct transfer apparatus for electronic componentsASM TECH SINGAPORE PTE LTD·Filed 2020·Granted Oct 5, 2021·0 cites·16 claims
- 1143US10311597B2Apparatus and method of determining a bonding position of a dieASM TECH SINGAPORE PTE LTD·Filed 2017·Granted Jun 4, 2019·0 cites·18 claims
- 1240US11056377B2Collet inspection in a semiconductor pick and place apparatusASM TECH SINGAPORE PTE LTD·Filed 2019·Granted Jul 6, 2021·0 cites·19 claims
- 1340US2013119113A1System for dispensing soft solder for mounting semiconductor chips using multiple solder wiresLAM KUI KAM·Filed 2013·Application pending·0 cites
- 1440US2014341691A1Bonding apparatus having a plurality of rotary transfer arms for transferring electronic devices for bondingLAM KUI KAM·Filed 2014·Application pending·0 cites
- 1539US8956892B2Method and apparatus for fabricating a light-emitting diode packageLAM KUI KAM·Filed 2012·Granted Feb 17, 2015·0 cites·18 claims
- 1638US10014203B2Pick and place device comprising pick arm correction moduleASM TECH SINGAPORE PTE LTD·Filed 2016·Granted Jul 3, 2018·0 cites·20 claims
- 1737US8804136B2Apparatus and method for locating a plurality of placement positions on a carrier objectLAM KUI KAM·Filed 2012·Granted Aug 12, 2014·0 cites·19 claims
- 1835US8590143B2Apparatus for delivering semiconductor components to a substrateLAM KUI KAM·Filed 2011·Granted Nov 26, 2013·0 cites·8 claims
- 1935US2011272452A1System for dispensing soft solder for mounting semiconductor chips using multiple solder wiresLAM KUI KAM·Filed 2010·Application pending·0 cites
- 2031US8293043B2Automatic level adjustment for die bonderCHUNG KWOK KEE·Filed 2006·Granted Oct 23, 2012·0 cites·14 claims
- 2127US2012094440A1Method of die bonding onto dispensed adhesivesCHUNG KWOK KEE·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →