Inventor · disambiguated record
Kuo-Hsien Liao
Also filed as: LIAO KUO-HSIEN
25 granted patents·6 pending applications·630 citations·filing 2005–2024
97Inventor score
Files withADVANCED SEMICONDUCTOR ENG14LIAO KUO-HSIEN7UNIVERSAL SCIENT IND CO LTD4LI KUAN-HSING2LIN I-CHIA1
Top patents by PatentIndex Score
31 records- 0198US7989928B2Semiconductor device packages with electromagnetic interference shieldingADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Aug 2, 2011·113 cites·18 claims
- 0296US8247889B2Package having an inner shield and method for making the sameLIAO KUO-HSIEN·Filed 2010·Granted Aug 21, 2012·31 cites·10 claims
- 0395US9269673B1Semiconductor device packagesADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Feb 23, 2016·43 cites·20 claims
- 0495US8786060B2Semiconductor package integrated with conformal shield and antennaYEN HAN-CHEE·Filed 2012·Granted Jul 22, 2014·93 cites·18 claims
- 0595US8378466B2Wafer-level semiconductor device packages with electromagnetic interference shieldingADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Feb 19, 2013·68 cites·25 claims
- 0695US8212340B2Chip package and manufacturing method thereofLIAO KUO-HSIEN·Filed 2009·Granted Jul 3, 2012·41 cites·20 claims
- 0794US8212339B2Semiconductor device packages with electromagnetic interference shieldingLIAO KUO-HSIEN·Filed 2010·Granted Jul 3, 2012·28 cites·20 claims
- 0892US9070793B2Semiconductor device packages having electromagnetic interference shielding and related methodsLIAO KUO-HSIEN·Filed 2011·Granted Jun 30, 2015·58 cites·20 claims
- 0991US9190367B1Semiconductor package structure and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Nov 17, 2015·14 cites·23 claims
- 1091US8653633B2Semiconductor device packages with electromagnetic interference shieldingLIAO KUO-HSIEN·Filed 2011·Granted Feb 18, 2014·13 cites·20 claims
- 1190US9871005B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jan 16, 2018·8 cites·22 claims
- 1290US7787250B2Metallic cover of miniaturization moduleUNIVERSAL SCIENT IND SHANGHAI·Filed 2007·Granted Aug 31, 2010·27 cites·7 claims
- 1389US9007273B2Semiconductor package integrated with conformal shield and antennaLIAO KUO-HSIEN·Filed 2011·Granted Apr 14, 2015·24 cites·17 claims
- 1489US8704341B2Semiconductor packages with thermal dissipation structures and EMI shieldingLIN I-CHIA·Filed 2012·Granted Apr 22, 2014·25 cites·19 claims
- 1587US9484313B2Semiconductor packages with thermal-enhanced conformal shielding and related methodsADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Nov 1, 2016·10 cites·14 claims
- 1686US10784208B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Sep 22, 2020·6 cites·19 claims
- 1785US9984983B2Semiconductor packages with thermal-enhanced conformal shielding and related methodsADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted May 29, 2018·5 cites·23 claims
- 1880US7312518B2Miniaturized multi-chip module and method for manufacturing the sameUNIVERSAL SCIENT IND CO LTD·Filed 2005·Granted Dec 25, 2007·14 cites·18 claims
- 1976US10431554B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 1, 2019·2 cites·19 claims
- 2065US10910329B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Feb 2, 2021·1 cites·19 claims
- 2165US8039930B2Package structure for wireless communication moduleADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Oct 18, 2011·4 cites·17 claims
- 2262US8144479B2Wireless communication moduleLIAO KUO-HSIEN·Filed 2007·Granted Mar 27, 2012·2 cites·7 claims
- 2358US12009312B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jun 11, 2024·0 cites·17 claims
- 2454US2025079414A1Electronic package module and method for fabrication of the sameUNIVERSAL GLOBAL TECH KUNSHAN CO LTD·Filed 2024·Application pending·0 cites
- 2548US11239178B2Semiconductor package structures and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Feb 1, 2022·0 cites·19 claims
- 2647US2008291637A1Small-sized communication module packageUNIVERSAL SCIENT IND CO LTD·Filed 2007·Application pending·0 cites
- 2745US11837686B2Optical device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 5, 2023·0 cites·9 claims
- 2843US2008291654A1Wireless communication nodule assemblyUNIVERSAL SCIENT IND CO LTD·Filed 2007·Application pending·0 cites
- 2943US2008291639A1Communication module package assemblyUNIVERSAL SCIENT IND CO LTD·Filed 2007·Application pending·0 cites
- 3042US2008207016A1Communications moduleLI KUAN-HSING·Filed 2007·Application pending·0 cites
- 3139US2009162976A1Method of manufacturing pins of miniaturization chip moduleLI KUAN-HSING·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →