Inventor · disambiguated record
Kuan-Liang Liu
Also filed as: LIU KUAN-LIANG
46 granted patents·18 pending applications·83 citations·filing 2009–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD44UNITED MICROELECTRONICS CORP18BAI MINGSIAN R1INTERFACE TECH CHENGDU CO LTD1
Top patents by PatentIndex Score
64 records- 0197US11545443B2Method for forming hybrid-bonding structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·3 cites·20 claims
- 0296US9490158B2Bond chuck, methods of bonding, and tool including bond chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 8, 2016·15 cites·20 claims
- 0395US11495489B2Method for forming a semiconductor-on-insulator (SOI) substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·3 cites·20 claims
- 0494US11887987B2Semiconductor wafer with devices having different top layer thicknessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 30, 2024·2 cites·20 claims
- 0594US10553474B1Method for forming a semiconductor-on-insulator (SOI) substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 4, 2020·6 cites·20 claims
- 0694US9741850B1Semiconductor device and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 22, 2017·12 cites·25 claims
- 0793US11676969B2Semiconductor-on-insulator wafer having a composite insulator layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 0893US10497667B2Apparatus for bond wave propagation controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 3, 2019·3 cites·20 claims
- 0991US10373872B2Transistor structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 6, 2019·5 cites·15 claims
- 1091US9985129B2High-voltage metal-oxide-semiconductor transistor and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 29, 2018·6 cites·7 claims
- 1191US2025359336A1Multi-function substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1289US10727218B2Seal ring structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·5 cites·20 claims
- 1389US2025344506A1Semiconductor-on-insulator wafer having a composite insulator layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1488US12471379B2Multi-function substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 11, 2025·0 cites·20 claims
- 1588US10280076B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 7, 2019·3 cites·20 claims
- 1688US9754813B2Bond chuck, methods of bonding, and tool including bond chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 5, 2017·5 cites·20 claims
- 1787US11925033B2Embedded backside memory on a field effect transistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·1 cites·20 claims
- 1887US9859417B2High-voltage metal-oxide-semiconductor transistor and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jan 2, 2018·4 cites·14 claims
- 1984US12165911B2Method for forming a semiconductor-on-insulator (SOI) substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 2083US12302637B2Semiconductor wafer with devices having different top layer thicknessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 13, 2025·0 cites·20 claims
- 2182US12408430B2Semiconductor-on-insulator wafer having a composite insulator layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 2, 2025·0 cites·20 claims
- 2281US12213323B2Embedded backside memory on a field effect transistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 2381US12113071B2Multi-function substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 8, 2024·0 cites·20 claims
- 2481US12087635B2Transistor structureUNITED MICROELECTRONICS CORP·Filed 2023·Granted Sep 10, 2024·0 cites·15 claims
- 2581US2025248118A1Semiconductor wafer with devices having different top layer thicknessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2680US11830764B2Method for forming a semiconductor-on-insulator (SOI) substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 2780US10903334B2High voltage semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jan 26, 2021·1 cites·7 claims
- 2880US2024381667A1Embedded backside memory on a field effect transistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2979US2025306270A1Photonic semiconductor-on-insulator (soi) substrate and method for forming the photonic soi substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3075US2025056894A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3174US11532642B2Multi-function substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
- 3274US11031369B2Apparatus for bond wave propagation controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 8, 2021·1 cites·20 claims
- 3374US10373876B2Method for preventing dishing during the manufacture of semiconductor devicesUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 6, 2019·1 cites·7 claims
- 3473US12360314B2Photonic semiconductor-on-insulator (SOI) substrate and method for forming the photonic SOI substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 3573US11721587B2Transistor structureUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 8, 2023·0 cites·17 claims
- 3672US11088027B2Transistor structureUNITED MICROELECTRONICS CORP·Filed 2020·Granted Aug 10, 2021·0 cites·6 claims
- 3771US11842992B2Seal ring structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 12, 2023·0 cites·20 claims
- 3871US11742321B2Apparatus for bond wave propagation controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 3969US10453832B2Seal ring structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 22, 2019·1 cites·20 claims
- 4069US9978647B2Method for preventing dishing during the manufacture of semiconductor devicesUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 22, 2018·1 cites·15 claims
- 4168US11348944B2Semiconductor wafer with devices having different top layer thicknessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·0 cites·20 claims
- 4267US10147800B2Method of fabricating a transistor with reduced hot carrier injection effectsUNITED MICROELECTRONICS CORP·Filed 2016·Granted Dec 4, 2018·1 cites·14 claims
- 4365US12159873B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 3, 2024·0 cites·20 claims
- 4464US11342322B2Seal ring structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 4564US10950631B1Semiconductor-on-insulator wafer having a composite insulator layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 4664US10796964B2Transistor structureUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 6, 2020·0 cites·7 claims
- 4763US10781098B2Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 22, 2020·0 cites·20 claims
- 4863US2021119014A1High voltage semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2020·Application pending·0 cites
- 4961US2024161998A1Direct writing system used for electron beam lithographyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 5060US2025016972A1Semiconductor device and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
Showing the top 50 of 64 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →