Inventor · disambiguated record
Kuo-Yuh Yang
Also filed as: YANG KUO-YUH
41 granted patents·6 pending applications·75 citations·filing 2000–2025
96Inventor score
Files withUNITED MICROELECTRONICS CORP39HSU CHANG-SHENG3LIN CHIA-HUEI1LIN YU-TSUNG1UNITED MICROELECTRONICS CORPS1
Top patents by PatentIndex Score
47 records- 0197US11205609B2Semiconductor structure with an air gapUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 21, 2021·7 cites·13 claims
- 0297US11205605B2Semiconductor structure with back gate and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 21, 2021·5 cites·12 claims
- 0397US10460980B2Semiconductor device comprising a deep trench isolation structure and a trap rich isolation structure in a substrate and a method of making the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 29, 2019·17 cites·8 claims
- 0496US11127700B1Integrated circuit deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Sep 21, 2021·4 cites·29 claims
- 0588US11133270B1Integrated circuit device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2020·Granted Sep 28, 2021·2 cites·15 claims
- 0686US9048285B2Semiconductor structure and method of forming a harmonic-effect-suppression structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jun 2, 2015·6 cites·8 claims
- 0785US10636892B2Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 28, 2020·3 cites·18 claims
- 0885US8274124B2Backside illuminated image sensorLIN CHIA-HUEI·Filed 2010·Granted Sep 25, 2012·7 cites·19 claims
- 0983US8536709B1Wafer with eutectic bonding carrier and method of manufacturing the sameHSU CHANG-SHENG·Filed 2012·Granted Sep 17, 2013·8 cites·7 claims
- 1082US10411110B1Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Sep 10, 2019·3 cites·19 claims
- 1181US11152485B2Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 19, 2021·1 cites·30 claims
- 1278US2025324724A1Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1377US12382702B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2023·Granted Aug 5, 2025·0 cites·9 claims
- 1477US12087712B2Method for fabricating an integrated circuit deviceUNITED MICROELECTRONICS CORP·Filed 2023·Granted Sep 10, 2024·0 cites·14 claims
- 1576US11658118B2Transistor structure in low noise amplifierUNITED MICROELECTRONICS CORP·Filed 2021·Granted May 23, 2023·0 cites·1 claims
- 1675US2024379492A1Semiconductor structure with heat dissipation structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1773US11114562B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Sep 7, 2021·1 cites·9 claims
- 1872US11658087B2High resistivity wafer with heat dissipation structure and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted May 23, 2023·0 cites·5 claims
- 1972US11652017B2High resistivity wafer with heat dissipation structure and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted May 16, 2023·0 cites·5 claims
- 2072US11521891B2Semiconductor device comprising a deep trench isolation structure and a trap rich isolation structure in a substrate and a method of making the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Dec 6, 2022·0 cites·8 claims
- 2170US11637080B2Method for fabricating an integrated circuit deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Apr 25, 2023·0 cites·15 claims
- 2270US11476192B2Transistor structure in low noise amplifierUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 18, 2022·0 cites·10 claims
- 2369US10347712B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 9, 2019·1 cites·16 claims
- 2467US11462489B2Integrated circuit device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Oct 4, 2022·0 cites·15 claims
- 2566US11152484B2Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 19, 2021·0 cites·24 claims
- 2666US8776363B2Method for supporting semiconductor wafer and wafer supporting assemblyHSU CHANG-SHENG·Filed 2012·Granted Jul 15, 2014·3 cites·11 claims
- 2765US11721757B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 8, 2023·0 cites·11 claims
- 2864US11101165B2Method for fabricating semiconductor device comprising a deep trench isolation structure and a trap rich isolation structure in a substrateUNITED MICROELECTRONICS CORP·Filed 2019·Granted Aug 24, 2021·0 cites·10 claims
- 2963US11894439B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Feb 6, 2024·0 cites·6 claims
- 3063US11848253B2Semiconductor structure with an air gapUNITED MICROELECTRONICS CORP·Filed 2021·Granted Dec 19, 2023·0 cites·10 claims
- 3163US11201115B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 14, 2021·0 cites·10 claims
- 3261US12131976B2Semiconductor structure with heat dissipation structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 29, 2024·0 cites·8 claims
- 3361US10854529B2High resistivity wafer with heat dissipation structure and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 1, 2020·0 cites·11 claims
- 3460US8754504B2Thinned wafer and fabricating method thereofHSU CHANG-SHENG·Filed 2012·Granted Jun 17, 2014·1 cites·13 claims
- 3558US12132011B2Integrated circuit device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Oct 29, 2024·0 cites·11 claims
- 3657US12249545B2Integrated circuit deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 11, 2025·0 cites·15 claims
- 3756US10600734B2Transistor structure in low noise amplifierUNITED MICROELECTRONICS CORP·Filed 2018·Granted Mar 24, 2020·0 cites·1 claims
- 3855US10679944B2Semiconductor structure with high resistivity wafer and fabricating method of bonding the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 9, 2020·0 cites·20 claims
- 3953US11094599B2Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2020·Granted Aug 17, 2021·0 cites·28 claims
- 4053US2024162093A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 4151US2012149145A1Method for manufacturing image sensorYANG KUO-YUH·Filed 2010·Application pending·0 cites
- 4250US9378998B2Semiconductor structure and method of forming a harmonic-effect-suppression structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jun 28, 2016·0 cites·18 claims
- 4349US8519500B2Image sensor with correcting lens and fabrication thereofLIN YU-TSUNG·Filed 2007·Granted Aug 27, 2013·0 cites·21 claims
- 4448US2021351066A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Application pending·0 cites
- 4546US6455371B1Method for forming capacitor of a DRAM having a wall protection structureUNITED MICROELECTRONICS CORP·Filed 2001·Granted Sep 24, 2002·4 cites·5 claims
- 4639US6495417B1Method for increasing tolerance of contact extension alignment in COB DRAMUNITED MICROELECTRONICS CORPS·Filed 2000·Granted Dec 17, 2002·2 cites·21 claims
- 4730US2002109169A1Capacitor of a DRAM having a wall protection structureFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →