Inventor · disambiguated record
Kyeong-Koo Chi
Also filed as: CHI KYEONG-KOO
52 granted patents·11 pending applications·652 citations·filing 1996–2015
98Inventor score
Top patents by PatentIndex Score
63 records- 0197US6767834B2Method of manufacturing a contact of a semiconductor device using cluster apparatus having at least one plasma pretreatment moduleSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jul 27, 2004·198 cites·29 claims
- 0295US7319255B2Semiconductor device including a metal gate electrode formed in a trench and method of forming thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 15, 2008·35 cites·15 claims
- 0394US7540970B2Methods of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 2, 2009·27 cites·23 claims
- 0492US7547636B2Pulsed ultra-high aspect ratio dielectric etchLAM RES CORP·Filed 2007·Granted Jun 16, 2009·22 cites·18 claims
- 0589US7682986B2Ultra-high aspect ratio dielectric etchLAM RES CORP·Filed 2007·Granted Mar 23, 2010·13 cites·18 claims
- 0688US6534921B1Method for removing residual metal-containing polymer material and ion implanted photoresist in atmospheric downstream plasma jet systemSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Mar 18, 2003·45 cites·26 claims
- 0787US7402488B2Method of manufacturing a semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jul 22, 2008·13 cites·49 claims
- 0884US7384843B2Method of fabricating flash memory device including control gate extensionsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jun 10, 2008·12 cites·27 claims
- 0983US6793767B2Wafer stage including electrostatic chuck and method for dechucking wafer using the wafer stageSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 21, 2004·26 cites·13 claims
- 1081US7303957B2Method of fabricating a flash memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Dec 4, 2007·7 cites·19 claims
- 1181US7247540B2Methods of forming field effect transistors having recessed channel regionsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jul 24, 2007·7 cites·17 claims
- 1279US7763544B2Method of forming fine pattern of semiconductor device using sige layer as sacrificial layer, and method of forming self-aligned contacts using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jul 27, 2010·5 cites·11 claims
- 1379US6867096B2Method of fabricating semiconductor device having capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 15, 2005·16 cites·18 claims
- 1478US8158524B2Line width roughness control with arc layer openCHI KYEONG-KOO·Filed 2008·Granted Apr 17, 2012·6 cites·13 claims
- 1577US7709389B2Method of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 4, 2010·5 cites·16 claims
- 1677US7291531B2Method of fabricating semiconductor device having capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 6, 2007·4 cites·8 claims
- 1777US5859501ARadio frequency generating systems and methods for forming pulse plasma using gradually pulsed time-modulated radio frequency powerSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Jan 12, 1999·29 cites·14 claims
- 1872US8501627B2Profile control in dielectric etchCHI KYEONG-KOO·Filed 2008·Granted Aug 6, 2013·4 cites·10 claims
- 1972US7242054B2Nonvolatile memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jul 10, 2007·3 cites·12 claims
- 2072US6607954B2Methods of fabricating cylinder-type capacitors for semiconductor devices using a hard mask and a mold layerSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 19, 2003·20 cites·20 claims
- 2169US7125766B2Method of forming capacitor for semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 24, 2006·4 cites·20 claims
- 2267US7566659B2Method of forming fine pattern of semiconductor device using SiGe layer as sacrificial layer, and method of forming self-aligned contacts using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jul 28, 2009·2 cites·11 claims
- 2367US7510934B2Methods of fabricating nonvolatile memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 31, 2009·2 cites·15 claims
- 2467US7098135B2Semiconductor device including bit line formed using damascene technique and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 29, 2006·9 cites·11 claims
- 2566US7183600B2Semiconductor device with trench gate type transistor and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 27, 2007·11 cites·10 claims
- 2664US6562651B2Method of manufacturing a semiconductor device having contact padsSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted May 13, 2003·15 cites·16 claims
- 2764US5903351AMethod and apparatus for selective spectroscopic analysis of a wafer surface and gas phase elements in a reaction chamberSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted May 11, 1999·29 cites·14 claims
- 2863US8906194B2Ultra-high aspect ratio dielectric etchCHI KYEONG-KOO·Filed 2010·Granted Dec 9, 2014·1 cites·14 claims
- 2961US7338849B2Methods of fabricating flash memory devices and flash memory devices fabricated therebySAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 4, 2008·2 cites·32 claims
- 3060US7709346B2Semiconductor device with trench gate type transistor and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 4, 2010·2 cites·28 claims
- 3156US7736970B2Method of fabricating semiconductor device having capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 15, 2010·0 cites·12 claims
- 3255US7118926B2Method of optimizing seasoning recipe for etch processSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Oct 10, 2006·4 cites·14 claims
- 3355US7052952B2Method for forming wire line by damascene process using hard mask formed from contactsSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 30, 2006·7 cites·23 claims
- 3454US7258811B2Wafer stage including electrostatic chuck and method for dechucking wafer using the wafer stageSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Aug 21, 2007·3 cites·3 claims
- 3554US6570205B2DRAM cellSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted May 27, 2003·5 cites·8 claims
- 3652US6159811AMethods for patterning microelectronic structures using chlorine, oxygen, and fluorineSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Dec 12, 2000·14 cites·27 claims
- 3751US8941165B2Methods of fabricating integrated circuit capacitors having u-shaped lower capacitor electrodesCHO SUNG-IL·Filed 2010·Granted Jan 27, 2015·0 cites·18 claims
- 3851US6855597B2DRAM cellSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 15, 2005·4 cites·8 claims
- 3950US2006205190A1Semiconductor etching apparatus and method of etching semiconductor devices using sameCHI KYEONG-KOO·Filed 2006·Application pending·0 cites
- 4050US2006284277A1Semiconductor device including bit line formed using damascene technique and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 4149US8470715B2CD bias loading control with ARC layer openCHI KYEONG-KOO·Filed 2008·Granted Jun 25, 2013·0 cites·11 claims
- 4247US5932492AMethods for forming alumina maskingSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Aug 3, 1999·16 cites·20 claims
- 4346US7491344B2Method for etching an object using a plasma and an object etched by a plasmaSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 17, 2009·1 cites·23 claims
- 4446US7256143B2Semiconductor device having self-aligned contact plug and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 14, 2007·0 cites·8 claims
- 4546US6498081B2Method of manufacturing self-aligned contact holeSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Dec 24, 2002·2 cites·19 claims
- 4644US6875690B2Semiconductor device having self-aligned contact plug and method for fabricating the sameSAMSUNG ELECTRONICS COL LTD·Filed 2003·Granted Apr 5, 2005·1 cites·12 claims
- 4743US7329574B2Methods of forming capacitor electrodes using fluorine and oxygenSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 12, 2008·0 cites·17 claims
- 4843US5772772APlasma diffusion control apparatusSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Jun 30, 1998·8 cites·5 claims
- 4943US2006293781A1Method of optimizing seasoning recipe for etch processCHO HONG·Filed 2006·Application pending·0 cites
- 5042US2003116277A1Semiconductor etching apparatus and method of etching semiconductor devices using sameFiled 2003·Application pending·0 cites
Showing the top 50 of 63 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →