Inventor · disambiguated record
Kyoung-Sei Choi
Also filed as: CHOI KYOUNG-SEI
21 granted patents·11 pending applications·153 citations·filing 2004–2015
94Inventor score
Top patents by PatentIndex Score
32 records- 0195US7534645B2CMOS type image sensor module having transparent polymeric encapsulation materialSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 19, 2009·44 cites·18 claims
- 0291US9230876B2Stack type semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 5, 2016·13 cites·9 claims
- 0389US8222089B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameCHOI KYOUNG-SEI·Filed 2011·Granted Jul 17, 2012·10 cites·12 claims
- 0488US9570400B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Feb 14, 2017·12 cites·16 claims
- 0586US7299547B2Method for manufacturing tape wiring boardSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 27, 2007·11 cites·15 claims
- 0682US8513781B2Device for removing electromagnetic interference and semiconductor package including the sameYOO JAE-WOOK·Filed 2011·Granted Aug 20, 2013·6 cites·24 claims
- 0782US7915727B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Mar 29, 2011·8 cites·20 claims
- 0881US9730323B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 8, 2017·4 cites·19 claims
- 0980US9793309B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 17, 2017·5 cites·18 claims
- 1076US7105904B2CMOS type image sensor module having transparent polymeric encapsulation materialSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 12, 2006·20 cites·22 claims
- 1172US7888237B2Method of cutting semiconductor wafer, semiconductor chip apparatus, and chamber to cut waferSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 15, 2011·3 cites·15 claims
- 1271US7190073B2Circuit film with bump, film package using the same, and related fabrication methodsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 13, 2007·4 cites·14 claims
- 1368US8575746B2Chip on flexible printed circuit type semiconductor packageLEE SI-HOON·Filed 2007·Granted Nov 5, 2013·5 cites·34 claims
- 1466US8266796B2Method of fabricating a semiconductor device packagePARK JI-YONG·Filed 2008·Granted Sep 18, 2012·3 cites·26 claims
- 1563US8629547B2Semiconductor chip packageCHO KYONG-SOON·Filed 2011·Granted Jan 14, 2014·2 cites·19 claims
- 1660US7895742B2Method for manufacturing tape wiring boardSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 1, 2011·1 cites·13 claims
- 1753US2014059852A1Multi-layer printed circuit board comprising film and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1851US2010005652A1Method of manufacturing a wiring substrate, method of manufacturing a tape package and method of manufacturing a display deviceSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1950US8796158B2Methods for forming circuit pattern forming region in an insulating substrateCHOI KYOUNG-SEI·Filed 2012·Granted Aug 5, 2014·0 cites·20 claims
- 2049US8250750B2Method for manufacturing tape wiring boardCHOI KYOUNG-SEI·Filed 2011·Granted Aug 28, 2012·0 cites·10 claims
- 2149US7956452B2Flip chip packagesSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jun 7, 2011·0 cites·14 claims
- 2249US2007126110A1Circuit film with bump, film package using the same, and related fabrication methodsSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2348US2009284883A1Electronic device having electrostatic discharge protection device and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2447US2011247871A1Multi-layer printed circuit board comprising film and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2011·Application pending·0 cites
- 2546US8110918B2Flexible substrate for a semiconductor package, method of manufacturing the same, and semiconductor package including flexible substrateCHOI KYOUNG-SEI·Filed 2004·Granted Feb 7, 2012·2 cites·49 claims
- 2643US2006071303A1Film substrate of a semiconductor package and a manufacturing methodLEE CHUNG-SUN·Filed 2005·Application pending·0 cites
- 2742US2007015338A1Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2839US2005205524A1Method of manufacturing tape wiring substrateLEE CHUNG-SUN·Filed 2005·Application pending·0 cites
- 2937US8648478B2Flexible heat sink having ventilation ports and semiconductor package including the sameYOO JAE-WOOK·Filed 2011·Granted Feb 11, 2014·0 cites·17 claims
- 3037US2011304763A1Image sensor chip and camera module having the sameCHOI MI-NA·Filed 2011·Application pending·0 cites
- 3137US2007007664A1Semiconductor package with molded back side and method of fabricating the sameLEE CHUNG-SUN·Filed 2006·Application pending·0 cites
- 3235US2011285890A1Camera moduleCHOI MI-NA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →