Inventor · disambiguated record
Kyungoe Kim
Also filed as: KIM KYUNGOE
26 granted patents·4 pending applications·89 citations·filing 2006–2024
95Inventor score
Top patents by PatentIndex Score
30 records- 0194US8129841B2Solder joint flip chip interconnectionPENDSE RAJENDRA D·Filed 2009·Granted Mar 6, 2012·29 cites·25 claims
- 0293US11823973B2Package with compartmentalized lid for heat spreader and EMI shieldSTATS CHIPPAC PTE LTD·Filed 2021·Granted Nov 21, 2023·2 cites·24 claims
- 0390US11688718B2Semiconductor device and method of controlling warpage during LABSTATS CHIPPAC PTE LTD·Filed 2021·Granted Jun 27, 2023·2 cites·20 claims
- 0489US8810029B2Solder joint flip chip interconnectionPENDSE RAJENDRA D·Filed 2012·Granted Aug 19, 2014·8 cites·49 claims
- 0584US11929334B2Die-beam alignment for laser-assisted bondingSTATS CHIPPAC PTE LTD·Filed 2020·Granted Mar 12, 2024·2 cites·22 claims
- 0684US9773685B2Solder joint flip chip interconnection having relief structurePENDSE RAJENDRA D·Filed 2012·Granted Sep 26, 2017·6 cites·24 claims
- 0780US8288205B2Package in package system incorporating an internal stiffener componentSHIM SEONG BO·Filed 2008·Granted Oct 16, 2012·6 cites·20 claims
- 0878US9412624B1Integrated circuit packaging system with substrate and method of manufacture thereofCUONG DAO NGUYEN PHU·Filed 2014·Granted Aug 9, 2016·6 cites·20 claims
- 0977US12107028B2Thermally enhanced FCBGA packageSTATS CHIPPAC PTE LTD·Filed 2023·Granted Oct 1, 2024·0 cites·22 claims
- 1077USRE44562ESolder joint flip chip interconnection having relief structurePENDSE RAJENDRA D·Filed 2012·Granted Oct 29, 2013·3 cites·27 claims
- 1177US2024421024A1Thermally Enhanced FCBGA PackageSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 1275US7851345B2Semiconductor device and method of forming oxide layer on signal traces for electrical isolation in fine pitch bondingSTATS CHIPPAC LTD·Filed 2008·Granted Dec 14, 2010·8 cites·25 claims
- 1374USRE44608ESolder joint flip chip interconnectionSTATS CHIPPAC LTD·Filed 2013·Granted Nov 26, 2013·3 cites·25 claims
- 1472US12074135B2Semiconductor device and method of controlling warpage during LABSTATS CHIPPAC PTE LTD·Filed 2023·Granted Aug 27, 2024·0 cites·23 claims
- 1569US11670563B2Thermally enhanced FCBGA packageSTATS CHIPPAC PTE LTD·Filed 2021·Granted Jun 6, 2023·0 cites·17 claims
- 1668US8216930B2Solder joint flip chip interconnection having relief structurePENDSE RAJENDRA D·Filed 2009·Granted Jul 10, 2012·3 cites·36 claims
- 1767US8018052B2Integrated circuit package system with side substrate having a top layerSTATS CHIPPAC LTD·Filed 2007·Granted Sep 13, 2011·4 cites·20 claims
- 1865US8115301B2Methods for manufacturing thermally enhanced flip-chip ball grid arraysKIM KYUNGOE·Filed 2006·Granted Feb 14, 2012·4 cites·19 claims
- 1961US8124520B2Integrated circuit mount system with solder mask padKIM KYUNGOE·Filed 2006·Granted Feb 28, 2012·2 cites·20 claims
- 2059US8859342B2Integrated circuit packaging system with substrate mold gate and method of manufacture thereofKIM OH HAN·Filed 2011·Granted Oct 14, 2014·1 cites·10 claims
- 2158US11817357B2Region-of-interest positioning for laser-assisted bondingSTATS CHIPPAC PTE LTD·Filed 2021·Granted Nov 14, 2023·0 cites·25 claims
- 2257US9373573B2Solder joint flip chip interconnectionSTATS CHIPPAC LTD·Filed 2014·Granted Jun 21, 2016·0 cites·24 claims
- 2354USRE44761ESolder joint flip chip interconnection having relief structureSTATS CHIPPAC LTD·Filed 2013·Granted Feb 11, 2014·0 cites·36 claims
- 2453US12218114B2Semiconductor device and method of making a photonic semiconductor packageSTATS CHIPPAC PTE LTD·Filed 2021·Granted Feb 4, 2025·0 cites·13 claims
- 2553US2024021566A1Semiconductor Device and Method of Forming Underfill Dam for Chip-to-Wafer DeviceSTATS CHIPPAC PTE LTD·Filed 2022·Application pending·0 cites
- 2651US7659633B2Solder joint flip chip interconnection having relief structureSTATS CHIPPAC LTD·Filed 2006·Granted Feb 9, 2010·0 cites·27 claims
- 2749US10109587B1Integrated circuit packaging system with substrate and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2016·Granted Oct 23, 2018·0 cites·20 claims
- 2848US2007105277A1Solder joint flip chip interconnectionSTATS CHIPPAC LTD·Filed 2006·Application pending·0 cites
- 2947US9093278B1Method of manufacture of integrated circuit packaging system with plasma processingCHOI JOONYOUNG·Filed 2013·Granted Jul 28, 2015·0 cites·20 claims
- 3028US2015318259A1Integrated circuit packaging system with no-reflow connection and method of manufacture thereofKIM KYUNGOE·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →