Inventor · disambiguated record
Kyol Park
Also filed as: PARK KYOL
13 granted patents·160 citations·filing 2012–2015
91Inventor score
Top patents by PatentIndex Score
13 records- 0198US8921990B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 30, 2014·86 cites·13 claims
- 0292US9029998B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 12, 2015·17 cites·20 claims
- 0388US9583430B2Package-on-package devicePARK KYOL·Filed 2014·Granted Feb 28, 2017·16 cites·16 claims
- 0485US9024434B2Semiconductor packagesIM YUNHYEOK·Filed 2012·Granted May 5, 2015·8 cites·16 claims
- 0584US8587134B2Semiconductor packagesIM YUN-HYEOK·Filed 2012·Granted Nov 19, 2013·8 cites·20 claims
- 0683US9391009B2Semiconductor packages including heat exhaust partJANG EON SOO·Filed 2014·Granted Jul 12, 2016·10 cites·19 claims
- 0780US9013031B2Semiconductor packages including heat diffusion vias and interconnection viasIM YUNHYEOK·Filed 2014·Granted Apr 21, 2015·6 cites·20 claims
- 0879US9190338B2Semiconductor package having a heat slug and a spacerSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 17, 2015·5 cites·15 claims
- 0969US9482584B2System and method for predicting the temperature of a deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 1, 2016·2 cites·13 claims
- 1062US9054067B2Semiconductor package with thermal dissipating member and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 9, 2015·2 cites·20 claims
- 1154US9293389B2Method of manufacturing a semiconductor package including a surface profile modifierSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 22, 2016·0 cites·3 claims
- 1247US9666503B2Semiconductor package and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 30, 2017·0 cites·20 claims
- 1343US9679874B2Semiconductor package and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 13, 2017·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →