Inventor · disambiguated record
Lawrence Chung-Lai Lei
Also filed as: LEI LAWRENCE · LEI LAWRENCE C · LEI LAWRENCE CHUNG · LEI LAWRENCE CHUNG-LAI
82 granted patents·21 pending applications·10,978 citations·filing 1987–2023
99Inventor score
Files withAPPLIED MATERIALS INC87LEI LAWRENCE CHUNG-LAI6ADVANCED MICRO FABRICATION EQUIPMENT INC CHINA2ARCHERS INC2DUAL HELIOS SEMICONDUCTOR EQUIPMENT COMPANY INC2
Top patents by PatentIndex Score
103 records- 0199US6551929B1Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniquesAPPLIED MATERIALS INC·Filed 2000·Granted Apr 22, 2003·396 cites·60 claims
- 0299US5516367AChemical vapor deposition chamber with a purge guideAPPLIED MATERIALS INC·Filed 1994·Granted May 14, 1996·397 cites·47 claims
- 0398US7465666B2Method for forming tungsten materials during vapor deposition processesAPPLIED MATERIALS INC·Filed 2007·Granted Dec 16, 2008·47 cites·33 claims
- 0498US7235486B2Method for forming tungsten materials during vapor deposition processesAPPLIED MATERIALS INC·Filed 2006·Granted Jun 26, 2007·43 cites·39 claims
- 0598US6718126B2Apparatus and method for vaporizing solid precursor for CVD or atomic layer depositionAPPLIED MATERIALS INC·Filed 2001·Granted Apr 6, 2004·211 cites·7 claims
- 0698US6603269B1Resonant chamber applicator for remote plasma sourceAPPLIED MATERIALS INC·Filed 2000·Granted Aug 5, 2003·252 cites·7 claims
- 0798US6589352B1Self aligning non contact shadow ring process kitAPPLIED MATERIALS INC·Filed 1999·Granted Jul 8, 2003·566 cites·26 claims
- 0898US6364949B1300 mm CVD chamber design for metal-organic thin film depositionAPPLIED MATERIALS INC·Filed 1999·Granted Apr 2, 2002·424 cites·33 claims
- 0998US6302964B1One-piece dual gas faceplate for a showerhead in a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 2000·Granted Oct 16, 2001·986 cites·15 claims
- 1098US6106625AReactor useful for chemical vapor deposition of titanium nitrideAPPLIED MATERIALS INC·Filed 1998·Granted Aug 22, 2000·627 cites·28 claims
- 1198US6086677ADual gas faceplate for a showerhead in a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 1998·Granted Jul 11, 2000·1.1k cites·20 claims
- 1298US5856240AChemical vapor deposition of a thin film onto a substrateAPPLIED MATERIALS INC·Filed 1994·Granted Jan 5, 1999·275 cites·18 claims
- 1398US5800686AChemical vapor deposition chamber with substrate edge protectionAPPLIED MATERIALS INC·Filed 1994·Granted Sep 1, 1998·266 cites·13 claims
- 1498US5766365ARemovable ring for controlling edge deposition in substrate processing apparatusAPPLIED MATERIALS INC·Filed 1995·Granted Jun 16, 1998·435 cites·16 claims
- 1598US5213650AApparatus for removing deposits from backside and end edge of semiconductor wafer while preventing removal of materials from front surface of waferAPPLIED MATERIALS INC·Filed 1991·Granted May 25, 1993·530 cites·9 claims
- 1697US7674715B2Method for forming tungsten materials during vapor deposition processesAPPLIED MATERIALS INC·Filed 2008·Granted Mar 9, 2010·35 cites·25 claims
- 1797US7115494B2Method and system for controlling the presence of fluorine in refractory metal layersAPPLIED MATERIALS INC·Filed 2006·Granted Oct 3, 2006·30 cites·54 claims
- 1897US6866746B2Clamshell and small volume chamber with fixed substrate supportAPPLIED MATERIALS INC·Filed 2002·Granted Mar 15, 2005·130 cites·27 claims
- 1997US6302965B1Dispersion plate for flowing vaporizes compounds used in chemical vapor deposition of films onto semiconductor surfacesAPPLIED MATERIALS INC·Filed 2000·Granted Oct 16, 2001·209 cites·16 claims
- 2097US5888304AHeater with shadow ring and purge above wafer surfaceAPPLIED MATERIALS INC·Filed 1996·Granted Mar 30, 1999·374 cites·28 claims
- 2196US7846840B2Method for forming tungsten materials during vapor deposition processesAPPLIED MATERIALS INC·Filed 2009·Granted Dec 7, 2010·19 cites·22 claims
- 2296US6777352B2Variable flow deposition apparatus and method in semiconductor substrate processingAPPLIED MATERIALS INC·Filed 2002·Granted Aug 17, 2004·119 cites·6 claims
- 2396US6375748B1Method and apparatus for preventing edge depositionAPPLIED MATERIALS INC·Filed 1999·Granted Apr 23, 2002·293 cites·24 claims
- 2496US6364954B2High temperature chemical vapor deposition chamberAPPLIED MATERIALS INC·Filed 1998·Granted Apr 2, 2002·342 cites·16 claims
- 2596US6083321AFluid delivery system and methodAPPLIED MATERIALS INC·Filed 1997·Granted Jul 4, 2000·583 cites·16 claims
- 2695US6932871B2Multi-station deposition apparatus and methodAPPLIED MATERIALS INC·Filed 2002·Granted Aug 23, 2005·78 cites·29 claims
- 2795US6855368B1Method and system for controlling the presence of fluorine in refractory metal layersAPPLIED MATERIALS INC·Filed 2000·Granted Feb 15, 2005·58 cites·15 claims
- 2895US4714536APlanar magnetron sputtering device with combined circumferential and radial movement of magnetic fieldsVARIAN ASSOCIATES·Filed 1987·Granted Dec 22, 1987·135 cites·32 claims
- 2994US7085616B2Atomic layer deposition apparatusAPPLIED MATERIALS INC·Filed 2001·Granted Aug 1, 2006·42 cites·39 claims
- 3094US6827815B2Showerhead assembly for a processing chamberAPPLIED MATERIALS INC·Filed 2002·Granted Dec 7, 2004·133 cites·20 claims
- 3193US6159299AWafer pedestal with a purge ringAPPLIED MATERIALS INC·Filed 1999·Granted Dec 12, 2000·134 cites·23 claims
- 3292US8342119B2Self aligning non contact shadow ring process kitAPPLIED MATERIALS INC·Filed 2007·Granted Jan 1, 2013·11 cites·2 claims
- 3392US8027746B2Atomic layer deposition apparatusAPPLIED MATERIALS INC·Filed 2010·Granted Sep 27, 2011·4 cites·15 claims
- 3492US6494955B1Ceramic substrate supportAPPLIED MATERIALS INC·Filed 2000·Granted Dec 17, 2002·82 cites·35 claims
- 3592US5695568AChemical vapor deposition chamberAPPLIED MATERIALS INC·Filed 1994·Granted Dec 9, 1997·95 cites·22 claims
- 3691US7722719B2Gas baffle and distributor for semiconductor processing chamberAPPLIED MATERIALS INC·Filed 2005·Granted May 25, 2010·22 cites·29 claims
- 3791US7033922B2Method and system for controlling the presence of fluorine in refractory metal layersAPPLIED MATERIALS INC·Filed 2004·Granted Apr 25, 2006·30 cites·26 claims
- 3891US6729824B2Dual robot processing systemAPPLIED MATERIALS INC·Filed 2001·Granted May 4, 2004·59 cites·45 claims
- 3991US5556476AControlling edge deposition on semiconductor substratesAPPLIED MATERIALS INC·Filed 1994·Granted Sep 17, 1996·134 cites·25 claims
- 4090US7897525B2Methods and systems of transferring, docking and processing substratesARCHERS INC·Filed 2008·Granted Mar 1, 2011·21 cites·62 claims
- 4190US6223447B1Fastening device for a purge ringAPPLIED MATERIALS INC·Filed 2000·Granted May 1, 2001·50 cites·20 claims
- 4290US6206971B1Integrated temperature controlled exhaust and cold trap assemblyAPPLIED MATERIALS INC·Filed 1999·Granted Mar 27, 2001·90 cites·17 claims
- 4390US5968276AHeat exchange passage connectionAPPLIED MATERIALS INC·Filed 1997·Granted Oct 19, 1999·85 cites·13 claims
- 4489US8367565B2Methods and systems of transferring, docking and processing substratesARCHERS INC·Filed 2010·Granted Feb 5, 2013·16 cites·52 claims
- 4589US7860597B2Atomic layer deposition apparatusAPPLIED MATERIALS INC·Filed 2009·Granted Dec 28, 2010·5 cites·19 claims
- 4689US6430468B1Method and apparatus for accurate placement of semiconductor wafers onto respective platforms within a single reaction chamberAPPLIED MATERIALS INC·Filed 2000·Granted Aug 6, 2002·45 cites·10 claims
- 4789US6103014AChemical vapor deposition chamberAPPLIED MATERIALS INC·Filed 1996·Granted Aug 15, 2000·62 cites·15 claims
- 4889US5935338AChemical vapor deposition chamberAPPLIED MATERIALS INC·Filed 1996·Granted Aug 10, 1999·63 cites·11 claims
- 4988US8626330B2Atomic layer deposition apparatusCHIN BARRY L·Filed 2011·Granted Jan 7, 2014·4 cites·14 claims
- 5087US7705275B2Substrate support having brazed plates and resistance heaterAPPLIED MATERIALS INC·Filed 2006·Granted Apr 27, 2010·25 cites·13 claims
Showing the top 50 of 103 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Lawrence Chung-Lai Lei files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →