Inventor · disambiguated record
Lauren A. Link
Also filed as: LINK LAUREN · LINK LAUREN A · LINK LAUREN ASHLEY
17 granted patents·4 pending applications·13 citations·filing 2017–2022
88Inventor score
Top patents by PatentIndex Score
21 records- 0184US10700021B2Coreless organic packages with embedded die and magnetic inductor structuresINTEL CORP·Filed 2018·Granted Jun 30, 2020·3 cites·11 claims
- 0283US11552008B2Asymmetric cored integrated circuit package supportsINTEL CORP·Filed 2018·Granted Jan 10, 2023·3 cites·24 claims
- 0377US11251113B2Methods of embedding magnetic structures in substratesINTEL CORP·Filed 2017·Granted Feb 15, 2022·2 cites·16 claims
- 0477US11189409B2Electronic substrates having embedded dielectric magnetic material to form inductorsINTEL CORP·Filed 2017·Granted Nov 30, 2021·2 cites·16 claims
- 0573US10741947B2Plated through hole socketing coupled to a solder ball to engage with a pinINTEL CORP·Filed 2018·Granted Aug 11, 2020·2 cites·23 claims
- 0672US11881463B2Coreless organic packages with embedded die and magnetic inductor structuresINTEL CORP·Filed 2021·Granted Jan 23, 2024·0 cites·13 claims
- 0770US11862552B2Methods of embedding magnetic structures in substratesINTEL CORP·Filed 2022·Granted Jan 2, 2024·0 cites·7 claims
- 0870US11335632B2Magnetic inductor structures for package devicesINTEL CORP·Filed 2017·Granted May 17, 2022·1 cites·15 claims
- 0967US11205626B2Coreless organic packages with embedded die and magnetic inductor structuresINTEL CORP·Filed 2020·Granted Dec 21, 2021·0 cites·30 claims
- 1064US2022230951A1Magnetic inductor structures for package devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 1161US2022013265A1Electronic substrates having embedded dielectric magnetic material to form inductorsINTEL CORP·Filed 2021·Application pending·0 cites
- 1252US11824013B2Package substrate with reduced interconnect stressINTEL CORP·Filed 2019·Granted Nov 21, 2023·0 cites·20 claims
- 1351US11444042B2Magnetic structures in integrated circuit packagesINTEL CORP·Filed 2018·Granted Sep 13, 2022·0 cites·18 claims
- 1447US11289263B2Electronic substrates having embedded magnetic material using photo-imagable dielectric layersINTEL CORP·Filed 2017·Granted Mar 29, 2022·0 cites·20 claims
- 1546US11705389B2Vias for package substratesINTEL CORP·Filed 2019·Granted Jul 18, 2023·0 cites·24 claims
- 1646US11610706B2Release layer-assisted selective embedding of magnetic material in cored and coreless organic substratesINTEL CORP·Filed 2018·Granted Mar 21, 2023·0 cites·12 claims
- 1746US11574874B2Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitchINTEL CORP·Filed 2017·Granted Feb 7, 2023·0 cites·20 claims
- 1846US11075130B2Package substrate having polymer-derived ceramic coreINTEL CORP·Filed 2017·Granted Jul 27, 2021·0 cites·20 claims
- 1945US11651902B2Patterning of thin film capacitors in organic substrate packagesINTEL CORP·Filed 2018·Granted May 16, 2023·0 cites·17 claims
- 2041US2020411413A1Substrate for an electronic deviceALUR AMRUTHAVALLI PALLAVI·Filed 2019·Application pending·0 cites
- 2138US2020006211A1Substrate assembly region with ceramic or boron fiberINTEL CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →